EC 103B Search Results

Contextual Info: MCL103A / 103B / 103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

MCL103A

Abstract: MCL103A-TR MCL103B MCL103B-TR3 MCL103C MCL103C-TR
Contextual Info: MCL103A / 103B / 103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

LS103A

Abstract: LS103A-GS18 LS103B LS103C
Contextual Info: LS103A / 103B / 103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

LL103A

Abstract: LL103A-GS08 LL103A-GS18 LL103B LL103B-GS08 LL103C
Contextual Info: LL103A/103B/103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

MCL103A

Abstract: MCL103A-TR MCL103B MCL103B-TR3 MCL103C
Contextual Info: MCL103A / 103B / 103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

LL103A

Abstract: LL103A-GS08 LL103A-GS18 LL103B LL103B-GS08 LL103C
Contextual Info: LL103A/103B/103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

LS103A

Abstract: LS103A-GS18 LS103B LS103C
Contextual Info: LS103A / 103B / 103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

LL103A

Abstract: LL103A-GS08 LL103A-GS18 LL103B LL103B-GS08 LL103C LL103AGS08
Contextual Info: LL103A/103B/103C Vishay Semiconductors Small Signal Schottky Diodes Features • Integrated protection ring against static discharge e2 • Low capacitance • Low leakage current • Low forward voltage drop • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC

Contextual Info: Preliminary XTL1029 • • • • High Performance Crystal for Wireless Communications Devices Excellent Frequency Stability and Reliability Ultra-Miniature Surface Mount Seam Weld Package Complies with Directive 2002/95/EC RoHS 13.52915 MHz Crystal Unit

Contextual Info: Preliminary XTL1029 • • • • High Performance Crystal for Wireless Communications Devices Excellent Frequency Stability and Reliability Ultra-Miniature Surface Mount Seam Weld Package Complies with Directive 2002/95/EC RoHS 13.52915 MHz Crystal Unit

BUSSMANN

Abstract: thermal fuse 7A 125v 150
Contextual Info: Brick Fuses 1025FA Series, Fast Acting Description • Surface Mount • Environmentally rugged, satisfies the EIA/IS-722 Standard • Solder Immersion Compatible • Targeted for Consumer Electronics RoHS 2002/95/EC ELECTRICAL CHARACTERISTICS Opening Time

Contextual Info: Brick Fuses 6125TD Series, Time Delay Description • Time Delay surface mount fuse • Complies with EIA-IS-722 Standard • Solder Immersion Compatible RoHS 2002/95/EC Printed Circuit Board Fuses - Surface Mount ELECTRICAL CHARACTERISTICS % of Amp Rating

Contextual Info: Brick Fuses 1025FA Series, Fast Acting Printed Circuit Board Fuses - Surface Mount Description • Fast Acting Surface Mount Fuse • Satisfies the EIA/IS-722 Standard • Solder Immersion Compatible RoHS 2002/95/EC ELECTRICAL CHARACTERISTICS % of Amp Rating

Contextual Info: Brick Fuses 1025TD Series, Time Delay Description • Time Delay Surface Mount Fuse • Satisfies the EIA/IS-722 Standard • Solder Immersion Compatible RoHS 2002/95/EC Printed Circuit Board Fuses - Surface Mount ELECTRICAL CHARACTERISTICS % of Amp Rating

Contextual Info: 0603ESDA-TR TR Series ESD Suppressor Features: RoHS 2002/95/EC • 0603/1608 foot print • Ideal ESD protection for high frequency, low voltage applications. • Exceeds testing requirements outlined in IEC 61000-4-2 • Ultra low capacitance 0.15pF maximum

6125TD1-R

Abstract: 6125TD3-R EIA-IS-722 6125td7-r 6125TD J-STD-002 95% 106E 107D 213B J-STD-002
Contextual Info: Brick Fuses 6125TD Series, Time Delay Description • Time Delay surface mount fuse • Complies with EIA-IS-722 Standard • Solder Immersion Compatible RoHS 2002/95/EC ELECTRICAL CHARACTERISTICS % of Amp Rating Opening Time 4 Hours Minimum 100% 1 Second Minimum

thermal Fuse 250V 2A

Abstract: thermal 3A 250v fuse 1025FA250-R 4A 250V SURFACE MOUNT FUSE Fuse 250V 2,5A J-STD-002 1025FA12-R Fuse 250V 15A Fuse 250V 4A 106E
Contextual Info: Brick Fuses 1025FA Series, Fast Acting Description • Fast Acting Surface Mount Fuse • Satisfies the EIA/IS-722 Standard • Solder Immersion Compatible RoHS 2002/95/EC ELECTRICAL CHARACTERISTICS % of Amp Rating Opening Time 100% 4 Hours Minimum 200% 250mA-5A

Contextual Info: PolyCHIP Fuses PC04F Series, Fast Acting Description • Low resistance • Low profile 0402/1005 design • Pb-free RoHS 2002/95/EC • Polymer matrix design • One time positive disconnect • Compatible with leaded and lead-free reflow and wave solder

Contextual Info: 0603ESDA-TR, PolySURG TR Series ESD Suppressor Features: RoHS 2002/95/EC • 0603/1608 foot print • Ideal ESD protection for high frequency, low voltage applications. • Exceeds testing requirements outlined in IEC 61000-4-2 • Ultra low capacitance 0.15pF maximum

Contextual Info: Brick Fuses 1025TD Series, Time Delay Description • Time Delay Surface Mount Fuse • Satisfies the EIA/IS-722 Standard • Solder Immersion Compatible RoHS 2002/95/EC ELECTRICAL CHARACTERISTICS % of Amp Rating Opening Time 100% 4 Hours Minimum 200% 1 Second Minimum

Contextual Info: UNCONTROLLED DOCUMENT G T-BG 350L PART NUM BER DATE 12.04.00 12.11.06 11.15.07 12.21.11 E.C.N. E.C.N. E.C.N. E.C.N. D re v . REV. A B C D E.C.N. NUMBER AND REVISION COMMENTS #10685 #11148. #11454. #1 OBRDR. 08.0 [00.315] ELECTRICAL SP EC IFIC AT IO N S PARAMETER

Contextual Info: SD103A~SD103C SMALL SIGNAL SCHOTTKY BARRIES SWITCHING DIODES VOLTAGE 20 to 40 Volts CURRENT 0.35 Amperes FEATURES • Low Forward Voltage Drop • Guard Ring Construction for Transient Protection • Low Reverse Recovery Time • Low Reverse Capacitance • In compliance with EU RoHS 2002/95/EC directives

BUSS SR-5 T3.15A 250V

Abstract: Buss SR-5 T2A 250v OC-106 94V0 C T2A 250v BUSS SS-5 OC106 BUSS SR-5 T1.25A 250V T4A 250V buss ss-5 oc103 94vo c T2A 250v BUSS T2A 250v SS-5
Contextual Info: CIRCUIT PROTECTION Circuit Protection G r o u The Cooper Bussmann Electronic Fuse family offers fail-safe circuit protection devices in SMD, Thru-Hole, and traditional Ferrule Fuse p RoHS 2002/95/EC packages. CHIP Fuses 0603FA & 3216FF Series Cooper Bussmann's patented Solid Matrix CHIP™ fuses

Contextual Info: XTL1003-1 • Surface Mount Seam-Weld Package • Good Frequency Stability over Temperature • Excellent Reliability • Complies with Directive 2002/95/EC RoHS 13.56000 MHz Crystal Unit P b The XTL1003-1 is a surface mount 5.0 x 3.2 mm crystal unit for use in wireless