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    E4 SOT353 Search Results

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    SN74HC logic family

    Abstract: SOT505-2 SOT363-6 SOT891 HEF4000 series SOT753 footprint sn74abt fairchild AHC 14 cd4xxx SOT353-1 footprint
    Text: General-purpose logic solutions Commitment and innovation Typical lifecycle of general-purpose logic ABT HC HEF4000 HCT F MB LVT ALS LVC AS CBT LS ALVC LV S ALVT TTL AHC Bipolar CMOS AVC BiCMOS AUP NXP logic products in bold Introduction 2 Logic solutions


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    PDF HEF4000 so891 SN74HC logic family SOT505-2 SOT363-6 SOT891 HEF4000 series SOT753 footprint sn74abt fairchild AHC 14 cd4xxx SOT353-1 footprint

    M74HCxxxTTR

    Abstract: 74ABT FAIRCHILD HEF4000B MM74HC nxp Cross-reference HEF4000 LVT32 SN74HC 74HC HC PORTFOLIO
    Text: General-purpose logic solutions Commitment and innovation 2 Logic solutions Commitment and innovation NXP is deeply committed to the logic market and continually invests in new process and package technologies, and packaging facilities, to ensure that our portfolio remains leadingedge. We offer a very broad variety of innovative


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    PDF anOT891 M74HCxxxTTR 74ABT FAIRCHILD HEF4000B MM74HC nxp Cross-reference HEF4000 LVT32 SN74HC 74HC HC PORTFOLIO

    hef4051

    Abstract: 74AUP2G34 74LVT1403 74ABT543A 74LV74 74AVCH1T45 74HC590 CBTD3306 NCX2200 74HC40103
    Text: ロジック IC データスイッチ/アナログスイッチ コンパレータ レベルシフタ 汎用ロジック Index 2 ●● P3 NXP ロジック ●● P4 低抵抗アナログスイッチ/データスイッチ ●● P7 コンパレータ ●●


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    voltage regulators marking code

    Abstract: SOT353 e3 SOT-353 e4 sot353 OUTPUT 3.3V PACKAGE SOT323 SP2526 SP2526AS32RG SP2526XS23RG SP2526XS35RG Z A SOT323
    Text: SP2526 Low ESR Cap. Compatible Positive Voltage Regulators DESCRIPTION The SP2526 family is a positive voltage linear regulators, low power consumption, high voltage, manufactured using CMOS technology. The SP2526 family provides large currents with a low dropout


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    PDF SP2526 SP2526 OT-23-3L OT-323 OT-353 250mA 140mV voltage regulators marking code SOT353 e3 SOT-353 e4 sot353 OUTPUT 3.3V PACKAGE SOT323 SP2526AS32RG SP2526XS23RG SP2526XS35RG Z A SOT323

    PowerDI5060-8L

    Abstract: DFN1006-2 DFN1006-3 DFN1006H4-2 DFN1006H4-3 DFN1310H4-6 DFN1411-3 DFN1612-6 DFN1616-6 DFN1616-8
    Text: PACKAGE OUTLINE DIMENSIONS Surface Mount Packages DFN1006-2 / DFN1006H4-2 A DFN1006-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0.05 0.03 b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10 All Dimensions in mm A1 D R E


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    PDF DFN1006-2 DFN1006H4-2 DFN1006-2 DFN1006-3 DFN1006H4-3 DFN1006-3 O92-3L AP02002 PowerDI5060-8L DFN1006H4-2 DFN1006H4-3 DFN1310H4-6 DFN1411-3 DFN1612-6 DFN1616-6 DFN1616-8

    smd k72 y5

    Abstract: K72 y8 k72 y4 BAS70WT 46A gez SMBJ8.5CA SMBJ11CA SMD Marking K72 sk 75 dgm marking f5 sot-89
    Text: Micro Commercial Components Corp. Marking Code For MCC's SMD Devices 1N4148W 1N4148WX 1N4148X 1N4448W 1N4448WX 1N4448X 1N914W 1SS181 1SS184 1SS193 1SS226 1SS355 1SS357 1SS389 1SS400 1SS404 2N7002 2N7002DW 2N7002T 2N7002W 2SA1037-Q 2SA1037-R 2SA1037-S 2SA1162-GR


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    PDF 1N4148W 1N4148WX 1N4148X 1N4448W 1N4448WX 1N4448X 1N914W 1SS181 1SS184 1SS193 smd k72 y5 K72 y8 k72 y4 BAS70WT 46A gez SMBJ8.5CA SMBJ11CA SMD Marking K72 sk 75 dgm marking f5 sot-89

    tp1217

    Abstract: 149-452 SN74AC140 74FCT162244TPV DIN41612 C64 CTX171 B35N61H999X99 hc49 farnell TP12-17 OP275GP
    Text: a Evaluation Board for ⌬ ADC 16 Bit, 195kSPS ⌺-⌬ EVAL-AD7722CB to the 96-way DIN connector. In serial mode, the AD7722's serial interface signals are buffered with a 74FCT162244 and are available from a 20-pin header. FEATURES Full-Featured Evaluation Board for the AD7722


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    PDF 195kSPS EVAL-AD7722CB 96-way AD7722 74FCT162244 20-pin AD7722 tp1217 149-452 SN74AC140 74FCT162244TPV DIN41612 C64 CTX171 B35N61H999X99 hc49 farnell TP12-17 OP275GP

    Untitled

    Abstract: No abstract text available
    Text: D5V0L1B2LP4 ADVANCE INFORMATION LOW CAPACITANCE BIDIRECTIONAL TVS DIODE Features Mechanical Data • Provides ESD Protection per IEC 61000-4-2 Standard: • Air – ±30kV, Contact – ±30kV • • Case: X2-DFN1006-2 Case Material: Molded Plastic, “Green” Molding Compound. UL


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    PDF X2-DFN1006-2 IEC61000-4-4 5/50ns) IEC61000-4-5 J-STD-020 MILSTD-202, DS35586

    Untitled

    Abstract: No abstract text available
    Text: D5V0L1B2LP4 ADVANCE INFORMATION LOW CAPACITANCE BIDIRECTIONAL TVS DIODE Features Mechanical Data • Provides ESD Protection per IEC 61000-4-2 Standard: • Air – ±30kV, Contact – ±30kV • • Case: X2-DFN1006-2 Case Material: Molded Plastic, “Green” Molding Compound. UL


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    PDF X2-DFN1006-2 IEC61000-4-4 IEC61000-4-5 J-STD-020 MILSTD-202, DS35586

    oz8681l

    Abstract: OZ8681 RT8207AGQW 8681l P0603BDG 92hd80 RTL8111D MEK100-05-DPS RS880M RS880
    Text: 1 2 3 4 PCB STACK UP A LAYER LAYER LAYER LAYER LAYER LAYER 1 2 3 4 5 6 5 6 7 8 01 LX89 SYSTEM DIAGRAM : TOP :GND : IN1 : IN2 : VCC : BOT DDR3-SODIMM1 DDR3 channel A DDR3-SODIMM2 CPU THERMAL SENSOR AMD Champlain PAGE 6,7 35mm X 35mm S1G4 Processor DDR3 channel B


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    PDF 318MHz 5W/35W ICS9LPRS476AKLFT-- SLG8SP628VTR-- RTM880N-796 RS880 528pin RTL8111D VDD10 oz8681l OZ8681 RT8207AGQW 8681l P0603BDG 92hd80 RTL8111D MEK100-05-DPS RS880M

    SOT-95

    Abstract: TO-252-4L sc59 dfn3030-8 MSOP-10 powerdi 123 DFN1006-3 DFN1006H4-2 WL-CSP1010H6-4 DFN1310H4-6
    Text: PACKAGE OUTLINE DIMENSIONS Surface Mount Packages DFN1006-2 / DFN1006H4-2 A DFN1006-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0.05 0.03 b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10 All Dimensions in mm A1 D R E


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    PDF DFN1006-2 DFN1006H4-2 DFN1006-2 DFN1006-3 DFN1006H4-3 DFN1006-3 O92-3L AP02002 SOT-95 TO-252-4L sc59 dfn3030-8 MSOP-10 powerdi 123 DFN1006H4-2 WL-CSP1010H6-4 DFN1310H4-6

    dpc209

    Abstract: SN0608098 BCM5880 t144 nvg72m PR157 2N7002DW webcam circuit diagram ISL88731 compal
    Text: A B C D E COMPAL CONFIDENTIAL 1 MODEL NAME : JAL21 PCB NO : LA-4042P DAA00000T0L BOM P/N : 43153331L01 1 M09 Maybach DIS uFCPGA Mobile Penryn Intel Cantiga PM + ICH9M 2 2 2007-10-31 REV : 0.1 @ : Nopop Component 3 3 4 4 MB PCB Part Number DELL CONFIDENTIAL/PROPRIETARY


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    PDF JAL21 LA-4042P DAA00000T0L) 43153331L01 DAA00000R0L LA-4051P NVG98 dpc209 SN0608098 BCM5880 t144 nvg72m PR157 2N7002DW webcam circuit diagram ISL88731 compal

    wpc8763ldg

    Abstract: winbond wpce775 WPC8763 RTM880N-796 SB700 WPC8769 TOSHIBA SATELLITE L20 SCHEMATIC DIAGRAM MMBT3906 RS740 RS740M
    Text: 1 2 3 4 5 6 7 8 01 BU2 SYSTEM DIAGRAM PCB STACK UP LAYER 1 : TOP LAYER 2 : SGND A DDRII 667/800 MHz DDRII-SODIMM1 LAYER 3 : IN1 AMD Lion Sabie Griffin PAGE 8 LAYER 4 : SVCC S1G2 Processor DDRII 667/800 MHz DDRII-SODIMM2 LAYER 5 : IN2 CPU THERMAL SENSOR A 14.318MHz


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    PDF 318MHz ICS9LPRS480AKLFT SLG8SP628VTR RTM880N-795 RS780M 528pin Marvell65 DTC144EU PR158 PC135 wpc8763ldg winbond wpce775 WPC8763 RTM880N-796 SB700 WPC8769 TOSHIBA SATELLITE L20 SCHEMATIC DIAGRAM MMBT3906 RS740 RS740M

    AA112A

    Abstract: IPC-7351A
    Text: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10


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    PDF AP02002) AP02001) IPC-7351A) DFN0402â DFN0603â DFN0606â IPC-7351A, AA112A IPC-7351A

    kb3926

    Abstract: RS780M RTM880N BSS138_NL RT8204 rtl8111c Reference design BSS138-NL Quanta TT9 RealTek RTL8111C reference design ME4410A
    Text: 1 2 3 5 6 7 8 Soyuz 2.0 SYSTEM DIAGRAM PCB STACK UP LAYER 1 : TOP DDRII-SODIMM1 LAYER 2 : SGND1 A 4 LAYER 3 : IN1 PAGE 8,9 LAYER 4 : IN2 DDRII-SODIMM2 LAYER 5 : VCC PAGE 8,9 DDRII 667/800 MHz AMD Lion Sabie Griffin DDRII 01 CPU THERMAL SENSOR S1G2 Processor


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    PDF 318MHz ICS9LPRS476AKLFT-- SLG8SP626VTR-- RTM880N-795 RS780M 528pin RJ-45 RealC143 CS35232FB10 CS26202FB17 kb3926 RS780M RTM880N BSS138_NL RT8204 rtl8111c Reference design BSS138-NL Quanta TT9 RealTek RTL8111C reference design ME4410A

    76M12

    Abstract: u19 c629 c639 M21125 microwave inverter panasonic c86 sot23-8 smd m21 sot23 panasonic inverter microwave diode C646 PANASONIC C372
    Text: M21125/M21115 Evaluation Module User Guide 21125-EVMD-001-A February 2009 Revision History Revision Date A February 2009 21125-EVMD-001-A Description Initial release Mindspeed Technologies Mindspeed Proprietary and Confidential 2 Contents 1.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4


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    PDF M21125/M21115 21125-EVMD-001-A 76M12 u19 c629 c639 M21125 microwave inverter panasonic c86 sot23-8 smd m21 sot23 panasonic inverter microwave diode C646 PANASONIC C372

    G7 mic diode

    Abstract: AA19 smd diode NF-SPP-100-N-A2 smd diode U12 C647 foxconn Socket AM2 nvidia g72m Marvell 88E1116 SMD W4 Transistor 30pin lvds
    Text: 5 4 3 2 1 First International Computer,Inc D D Portable Computer Group HW Department Board name : MotherBoard Schematic C Project : AMD S1 + Nvidia C51D + MCP51 Version : 0.4 C Initial Date : 05/13/2006 Confidential B B Manager Sign by : Avery Lee Drawing by


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    PDF MCP51 PA1538/XA1526 PTB50/XTB70 G7 mic diode AA19 smd diode NF-SPP-100-N-A2 smd diode U12 C647 foxconn Socket AM2 nvidia g72m Marvell 88E1116 SMD W4 Transistor 30pin lvds

    RTM880N-796

    Abstract: RTL8111DL KB3926 RTS5159 G786P8 RTL8103E 8111DL 966a quanta ut12 kb3926 d2
    Text: 1 2 3 A 1 2 3 4 5 6 : : : : : : 5 6 7 8 UT12 UMA SYSTEM DIAGRAM PCB STACK UP LAYER LAYER LAYER LAYER LAYER LAYER 4 TOP IN1 IN2 VCC IN3 BOT DDRII DDRII-SODIMM1 667/800 MHz AMD Lion Sabie Griffin PAGE 6,7 DDRII DDRII-SODIMM2 01 CPU THERMAL SENSOR S1G2 Processor


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    PDF 318MHz ICS9LPRS480-- SLG628 QFN-64 RTM880N-796 RX781 RS780MN 528pin Pin99 Pin34 RTL8111DL KB3926 RTS5159 G786P8 RTL8103E 8111DL 966a quanta ut12 kb3926 d2

    Alc201A

    Abstract: HY-05 HYCOM diode DB3 C531 ALC201 SmD TRANSISTOR a75 smd diode c539 P62-1D3-1AX9 smd diode c644 RJ45 speedtech EPSON C691 MAIN
    Text: Intel 852GME Interactive Client Reference Design User’s Guide October 2003 Order Number: 274000-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    PDF 852GME Alc201A HY-05 HYCOM diode DB3 C531 ALC201 SmD TRANSISTOR a75 smd diode c539 P62-1D3-1AX9 smd diode c644 RJ45 speedtech EPSON C691 MAIN

    CX20561

    Abstract: G545A2 IT8502 slg8sp628v ISL6251 Marvell 88E8057 ME2N7002E schematic acer lcd backlight inverter RTM880N-796 SLG8SP628
    Text: 1 2 3 PCB STACK UP 5 6 7 8 AJ6 SYSTEM DIAGRAM LAYER 1 : TOP LAYER 2 : SVCC DDRII-SODIMM1 LAYER 3 : IN1 A 4 DDRII 667/800 MHz AMD Lion Sabie Griffin PAGE 6,7 LAYER 4 : IN2 LAYER 5 : GND DDRII-SODIMM2 LAYER 6 : BOT PAGE 6,7 DDRII CPU THERMAL SENSOR S1G2 Processor


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    PDF 31818MHz SLG8SP628 88E8057 RS780MN 528pin 10/100/GagaLAN3B Page11 330u/2V CH733RY8802) Page17 CX20561 G545A2 IT8502 slg8sp628v ISL6251 Marvell 88E8057 ME2N7002E schematic acer lcd backlight inverter RTM880N-796 SLG8SP628

    rtl8102el

    Abstract: RTM880N-796 SB700 slg8sp628v RX781 g995 AMD RX780 ALC272 IT8512 NS681686
    Text: 5 4 3 2 1 PF1/2 BLOCK DIAGRAM DDRII-SODIMM1 PG 8,9 D CLOCK GENERATOR NBGFX_CLK Griffin Processor NBGPP_CLK DDRII-SODIMM2 SLG8SP628VTR PG 3 638 S1g2 socket PG 4,5,6,7 LVDS DVI LVDS(2ch) CRT PG 18 RX781/RS780MC PG 18 21mm X 21mm, 528pin BGA PCI-E X16 MXM Module


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    PDF 200MHz ICS9LPRS476AKLFT SLG8SP628VTR 100MHz 48MHz 14MHz RTL8102E IEEE1394 SB700 ITE8512 rtl8102el RTM880N-796 SB700 slg8sp628v RX781 g995 AMD RX780 ALC272 IT8512 NS681686

    Qualcomm PM7540 Power Management IC

    Abstract: PM7540 QSD8250 PM7540 Power Management IC PM*7540 QSD8650 cke 2009 amp pcb qualcomm pm7540 MXU6219 GRFC-6
    Text: 8 7 6 5 4 3 2 1 T-note System Block Diagram 10.1" TFT LCD Panel 1280x720 HDMI Tx D D LVDS LVDS transmitter Transeceiver MXU6219 GPS ANT FS USB C Mobile DDR (512 MB) EBI1 EBI2 QUALCOMM QSD8250 Power Management PM 7540 SDC-1 Boot NAND FLASH (512MB) SDC-4 PCM


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    PDF 1280x720) 512MB) MXU6219 QSD8250 Page22. 330pF. Page23. K0315 Qualcomm PM7540 Power Management IC PM7540 QSD8250 PM7540 Power Management IC PM*7540 QSD8650 cke 2009 amp pcb qualcomm pm7540 MXU6219 GRFC-6

    PM7540

    Abstract: Qualcomm PM7540 Power Management IC PM7540 Power Management IC QSD8250 PM*7540 qualcomm pm7540 8250 qualcomm QSD8650 MXU6219 qualcomm 8250
    Text: 8 7 6 5 4 3 2 1 T-note System Block Diagram 10.1" TFT LCD Panel 1280x720 HDMI Tx D D LVDS LVDS transmitter Transeceiver MXU6219 GPS ANT FS USB C Mobile DDR (512 MB) EBI1 EBI2 QUALCOMM QSD8250 Power Management PM 7540 SDC-1 Boot NAND FLASH (512MB) SDC-4 PCM


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    PDF 1280x720) 512MB) MXU6219 QSD8250 Page18. Page22. 330pF. Page23. K0315 PM7540 Qualcomm PM7540 Power Management IC PM7540 Power Management IC QSD8250 PM*7540 qualcomm pm7540 8250 qualcomm QSD8650 MXU6219 qualcomm 8250

    WPCE775

    Abstract: isl6265 oz601 RT9025 ISL6237 S51212 RTM880N AMD RX780 RTM880N-796 fds8884
    Text: 5 4 3 2 1 ZY7 SYSTEM BLOCK DIAGRAM CPU CORE ISL6265A PAGE 29 D D NB CORE RT8202 DDRII-SODIMM1 PAGE XX DDRII 667/800 MHz AMD Griffin PAGE 7 DDRII-SODIMM2 DDR II SMDDR_VTERM 1.8VSUS(TPS51116REGR) LVDS PAGE 18 CPU THERMAL SENSOR S1G2 Processor DDRII 667/800 MHz


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    PDF ISL6265A RT8202) TPS51116REGR) 318MHz ISL6237 ICS9LPRS476AKLFT-- SLG8SP626VTR-- RTM880N-795 ISL6251A) RX780 WPCE775 isl6265 oz601 RT9025 ISL6237 S51212 RTM880N AMD RX780 RTM880N-796 fds8884