E-MMC V 4.41 OPERATION MODE Search Results

SEM32G

Abstract: sandisk eMMC 4.41 emmc 4.41 spec JESD84-A441 eMMC 4.41 SEM04G emmc pcb layout SEM08G 153 ball eMMC memory sandisk 32GB Nand flash
Contextual Info: e.MMC 4.41 I/F Preliminary Data Sheet 80-36-03433 February 2010 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03433 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet

SEM08G

Abstract: SDIN7DU2-16G sandisk 8GB Nand flash sandisk emmc sandisk Nand flash part number BGA 221 eMMC emmc Pin assignment emmc bga 162 SDIN7DU2-8G sandisk 32GB Nand flash
Contextual Info: Ultra e.MMC 4.41 I/F Released Data Sheet 80-36-03666 V1.2 May 2012 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03666 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet

SEM64G

Abstract: sandisk eMMC 4.41 Sandisk emmc SEM32G SDIN5C1-16G-L SEM16G SEM08G emmc 4.41 SEM04G sdin5d2
Contextual Info: Standard and Ultra e.MMC 4.41 I/F Released Data Sheet 80-36-03462 V1.4 December 2011 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03462 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet

KLM4G1FE3B-B001

Abstract: KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5
Contextual Info: Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e•MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed

KLM8G2FEJA-A001

Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Contextual Info: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.

feme

Abstract: 18J2 feme 110 CL257 MP4TD1120 16SL2 ATS 1276
Contextual Info: M-Pulse Microwave Silicon Bipolar MMIC Dascadable Amplifier MP4TD1120 O o fd -B eO Microctrip Package O u t lin e d features High Dynamic Rang« Caccadabl« 50£i/75Q Gain Block - 3dB Bandwidth: 50 MHz to 1.3 GHz • 17.0 dBm Typical 1.0 GHz 12 dS Typical Gain @ 0.5 GHz

Toshiba NAND BGA 224

Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
Contextual Info: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.

Toshiba emmc

Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
Contextual Info: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.

emmc 4.41 spec

Abstract: eMMC 4.41 emmc spec SD-DDR50 emmc 4.5 spec SDXC protocol emmc 4.41 firmware operation eMMC 4.41 application note MMC-DDR52 emmc v 4.41 operation mode
Contextual Info: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0

Contextual Info: CYUSB303X EZ-USB FX3S SuperSpeed USB Controller EZ-USB® FX3S SuperSpeed USB Controller Features • ■ ■ ❐ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0

eMMC 4.41

Abstract: emmc 4.41 spec emmc spec emmc 5.0 emmc cmd18 EMMC HOST CONTROLLER emmc 4.5 spec DAT70 TO-39, UVC eMMC 4.41 application note
Contextual Info: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0

CYUSB202X

Contextual Info: CYUSB202X SD2 USB and Mass Storage Peripheral Controller Features • ■ ■ ❐ ❐ Latest-generation storage support ❐ SD2.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off

sony cmos sensor imx 179

Abstract: sony cmos sensor imx 174 sony cmos sensor imx 117 sony cmos sensor imx 175 IMX* Sony sony IMX 117 sony IMX 136 sony IMX 179 emmc 4.41 spec sony IMX cmos
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.1, 05/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

sony cmos sensor imx 174

Abstract: sony cmos sensor imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.2, 08/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.1, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

IMX6DQ6SDLSRM

Abstract: IMX 125 cmos sony sony IMX 135 sony cmos sensor imx 174
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLIEC Rev. 3, 03/2014 MCIMX6SxCxxxxxB MCIMX6SxCxxxxxC MCIMX6UxCxxxxxB MCIMX6UxCxxxxxC i.MX 6Solo/6DualLite Applications Processors for Industrial Products Package Information Plastic Package

DDR3L lpddr2

Abstract: IMX6DQ6SDLSRM
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLIEC Rev. 2.1, 05/2013 MCIMX6SxCxxxxxB MCIMX6UxCxxxxxB i.MX 6Solo/6DualLite Applications Processors for Industrial Products Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch

sony IMX 136

Abstract: IMX6DQ6SDLSRM sony sensor imx 136 sony CMOS sensor imx 136 Sony imx 134 cmos sensor sony IMX 138 sony cmos sensor imx 123 sony cmos sensor imx 174 sony CMOS sensor imx 135 sony IMX 260
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.2, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

IMX6DQ6SDLSRM

Abstract: Samsung eMMC 4.41 sony cmos sensor imx 174 sony cmos sensor imx 179 sony cmos sensor imx 175 sony IMX 136 sony CMOS sensor imx 136 sony IMX 138 LVDS to MIPI CSI Sony imx 134
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIxEC Rev. 2, 04/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

sony CMOS sensor imx 135

Abstract: sony iMX 145 cmos image sensor sony cmos sensor imx 174 Sony imx 145 sony iMX 174 cmos image sensor sony IMX 135 sony cmos sensor imx 175 Sony sony imx 175 sony cmos sensor imx 123
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLCEC Rev. 3, 03/2014 MCIMX6SxExxxxxB MCIMX6SxExxxxxC MCIMX6UxExxxxxB MCIMX6UxExxxxxC MCIMX6SxDxxxxxB MCIMX6SxDxxxxxC MCIMX6UxDxxxxxB MCIMX6UxDxxxxxC i.MX 6Solo/6DualLite Applications Processors

Sony imx 147

Abstract: sony cmos sensor imx 174
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.2, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

sony IMX 159 camera

Abstract: IMX6DQ6SDLSRM arm cortex a9 mpcore sony CMOS sensor imx 135 sony IMX 135 LVDS to MIPI CSI Samsung eMMC 4.41 MIPI CSI-2 Parallel bridge sony cmos sensor imx 174 sony IMX 132
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAxEC Rev. 2, 04/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

Sony imx 134

Abstract: IMX6DQ6SDLSRM Sony imx 134 cmos sensor Samsung eMMC 4.41 emmc 4.41 spec MIPI CSI-2 Parallel bridge LVDS to MIPI CSI MCIMX6Q5EYM10AC sony IMX 135 sony IMX 136
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCxEC Rev. 2, 04/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch

CLKIN32

Contextual Info: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■