Untitled
Abstract: No abstract text available
Text: R DS087 v2.1 March 10, 2003 System ACE MPM Solution Preliminary Product Specification Summary • • • • • • • System-level, high capacity, preconfigured solution for Virtex Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs
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DS087
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
388-pin
XCCACEM16BG388I
XCCACEM32BG388I
XCCACEM64BG388I
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XCV50E
Abstract: SelectMAP A0-A21 CS144 VQ44 xilinx SelectMAP second source flash configuration
Text: R DS087 v1.2 June 7, 2002 System ACE MPM Solution Advance Product Specification Summary • • • • • • • System level, high capacity, pre-configured solution for Virtex™ Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs
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DS087
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
388-pin
XCCACEM16
XCCACEM32
XCCACEM64
BG388
388-site
XCV50E
SelectMAP
A0-A21
CS144
VQ44
xilinx SelectMAP second source flash configuration
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XC2V80
Abstract: XCV50E
Text: System ACE MPM Solution R DS087 v2.3 May 21, 2007 Product Specification Summary • • • • • • • - System-level, high capacity, preconfigured solution for Virtex Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs Industry standard Flash memory combined with Xilinx
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DS087
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
388-pin
PDN2003-09)
XC2V80
XCV50E
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XCV50E
Abstract: A0-A21 CS144 VQ44 SelectMAP
Text: R DS087 v1.0 September 25, 2001 System ACE MPM Solution Advance Product Specification Summary of Features • • • • • • • • System level, high capacity, pre-configured solution for Virtex and Spartan FPGAs Industry standard Flash memory die combined with
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DS087
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
388-pin
XCCACEM16
BG388
XCCACEM16
XCCACEM32
XCCACEM64
XCV50E
A0-A21
CS144
VQ44
SelectMAP
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ACE FLASH
Abstract: XCV50E Xilinx jtag cable Schematic A0-A21 CS144 VQ44 XC2V80
Text: R DS087 v2.2 June 13, 2003 System ACE MPM Solution Preliminary Product Specification Summary • • • • • • • System-level, high capacity, preconfigured solution for Virtex Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs
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Original
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DS087
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
388-pin
CoCCACEM16BG388I
XCCACEM32BG388I
XCCACEM64BG388I
ACE FLASH
XCV50E
Xilinx jtag cable Schematic
A0-A21
CS144
VQ44
XC2V80
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Untitled
Abstract: No abstract text available
Text: CP3CN17 CP3CN17 Reprogrammable Connectivity Processor with CAN Interface Literature Number: SNOSA98B CP3CN17 Reprogrammable Connectivity Processor with CAN Interface 1.0 General Description The CP3CN17 connectivity processor combines a powerful RISC core with on-chip SRAM and Flash memory for high
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CP3CN17
CP3CN17
SNOSA98B
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F300H
Abstract: FC44H BIT137
Text: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT23
CSP-9-111C2)
CSP-9-111S2)
CSP-9-111S2.
F300H
FC44H
BIT137
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USB cable AWM 2725 rx tx pinout
Abstract: No abstract text available
Text: CP3BT26 CP3BT26 Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces Literature Number: SNOSAE5C CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded
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CP3BT26
CP3BT26
USB cable AWM 2725 rx tx pinout
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F1A4
Abstract: TR-28 national timer switch tb 208
Text: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT26
CSP-9-111C2)
CSP-9-111S2)
CSP-9-111S2.
F1A4
TR-28
national timer switch tb 208
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national timer switch tb 179
Abstract: No abstract text available
Text: CP3BT13 Reprogrammable Connectivity Processor with Bluetooth and CAN Interfaces General Description The CP3BT13 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT13
CSP-9-111C2)
CSP-9-111S2)
CSP-9-111S2.
national timer switch tb 179
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Untitled
Abstract: No abstract text available
Text: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM
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CP3UB26
CP3UB26
LQFP-128
LQFP-144
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CP3BT23
Abstract: CP3BT23G18NEP CP3BT23G18NEPNOPB CR16C LMX5251 LMX5252 LQFP-144 315 receiver module
Text: MAY 2004 CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT23
CP3BT23G18NEP
CP3BT23G18NEPNOPB
CR16C
LMX5251
LMX5252
LQFP-144
315 receiver module
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4 wire resistive touch screen
Abstract: deutsch dmc CP3UB26 CP3UB26G18NEP CP3UB26G18NEPNOPB CP3UB26G18NEPX CP3UB26G18NEPXNOPB CR16C LQFP-144
Text: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM
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CP3UB26
12-bit
4 wire resistive touch screen
deutsch dmc
CP3UB26G18NEP
CP3UB26G18NEPNOPB
CP3UB26G18NEPX
CP3UB26G18NEPXNOPB
CR16C
LQFP-144
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EE CORE 70
Abstract: books national semiconductor
Text: CP3UB26 CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces Literature Number: SNOSAE7D CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM
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CP3UB26
CP3UB26
EE CORE 70
books national semiconductor
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Untitled
Abstract: No abstract text available
Text: DAICO IND USTRIES INC blE D • SbCmTSD OOOlbflE MtiT ■ DAI FEA TU R ES MODEL NO. DS0874 ■ D C -2000 MHz ■ 16 nSec Transition Time ■ 55 nSec Switching Speed GaAs SP4T ■ 25 mV Transients ■ Ultra Small 14 Pin DIP & ■ Non-Reflective RF2 RF3 4 12
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DS0874
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dsq8
Abstract: DSQ850 1RF510 1RF1530 SP16T D8087 d809 DS0860 DS0860/B3 DS0838
Text: GaAs Switches II & Page: In This Issue: DC-2000 MHz To-5 SP2T s. Model No. D S0850/813 10-1500 MHz To-8 & R at pack SP2T's. Model No. D S0860/812 5-1000 MHz High Isolation Flat pack SP2T. Model No. DS0662 5-1000 MHz 24 PIN DIP SP8T. Model No. DS0838 DC-2000 MHz 14 PIN DIP SP4T, Model No. DS0874
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DC-2000
DS0850/813
DS0860/812
DS0662
DS0838
DS0874
DC-4000
SP16T.
DS0918
dsq8
DSQ850
1RF510
1RF1530
SP16T
D8087
d809
DS0860
DS0860/B3
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Untitled
Abstract: No abstract text available
Text: FEATURES • D C -2 0 0 0 MHz ■ 16 nSec Transition Time ■ 55 nSec Switching Speed S P 4T MODEL NO. DS0874 è GaA* 8P4T ■ 25 mV Transients ■ Ultra Small 14 Pin DIP ■ Non-Reflective R F COM RF1 14 1 ■ TTL Driver oooo3 .XXX Ï CD S CD > -i O 0C V
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DS0874
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DS0874
Abstract: No abstract text available
Text: FEA TU R ES • 16 nSec Transition Time ■ 55 nSec Switching Speed SP4T MODEL NO. DS0874 dr ■ D C -2 0 0 0 MHz GaAs SP4T ■ 25 mV Transients ■ Ultra Small 14 Pin DIP ■ Non-Reflective RF2 ■ TTL Driver 12 RF3 4 C2 C1 „0" ••0“ RF COM +5V C2
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DC-2000
100-TYP
DS0874
DC-100
DC-1000
OW/10%
2000MHz
2b04cl20
DS0874
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relay 5 volt - SPST
Abstract: DA0035 DA0775 DA0784-1 DA0786 DS0028 DS0052 DS0073 DS0778 P35-4101
Text: DAICO INDUSTRIES INC blE D • Eb04TEQ OQQlfllb 552 ■ DAI FEATURES ■ 0.5 - 3.5 GHz Frequency Range ■ Self Biased. No Separate Gate Supply Req. ■ +22 dBm Output Power Capability ■ Matched to 50 Q .400 MAX BOND PAD CONFIGURATION — .21 — • .180 SQ
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Eb04TEQ
P35-4101
DS0990
DA0769
DA0996
relay 5 volt - SPST
DA0035
DA0775
DA0784-1
DA0786
DS0028
DS0052
DS0073
DS0778
P35-4101
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DA0035
Abstract: DA0775 DA0784-1 DA0786 DS0028 DS0052 DS0073 DS0778 P35-4100 P35-4100-0
Text: D A I C O I N D U S T R I E S INC tl E D DAI E b O ^ E D OQOlfilS bib FEATURES • 0.05 - 3.5 GHz Frequency Range ■ ■ Flat Frequency Response With Direct Gain Control +22 dBm Output Power Capability ■ Matched to 50 Q Æ mm 5% äti'is iS «®sms: .400 MAX
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P35-4100
DS0990
DA0769
DA0996
DA0035
DA0775
DA0784-1
DA0786
DS0028
DS0052
DS0073
DS0778
P35-4100
P35-4100-0
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084I
Abstract: No abstract text available
Text: DIN SOCKET METAL COVER TYPE C1 16 ~ t o jL S pecifications: 72 00 - ^ Insulation Resistance: 100 M n at 500V D.C. Dielectric Strength: 1000V A.C./1 Minute Contact Resistance: 2 0m n MAX. ARRANGEMENT OF -T t5 .q c r f t fid d Q i \ / * I/m liW \ iV V r */
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DS-076
DS-074
ADS-077
ADS-078
DS-087
ADS-088
084I
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Untitled
Abstract: No abstract text available
Text: DAICO I N D U S T R I E S INC tlE D DAI Eti04TEQ OGOlfllb 552 FEATURES • 0.5 - 3.5 GHz Frequency Range Self Biased. No Separate Gate Supply Req. +22 dBm Output Power Capability Matched to 50 Q .400 MAX BOND PAD CONFIGURATION — .21 — - .180 SQ rfr; .0 5 0 |
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Eti04TEQ
D4T50
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Untitled
Abstract: No abstract text available
Text: GaAs Switches II & Page: In This Issue: DC-2000 MHz To-5 SP2T s. M odel No. DS0850/813 10-1500 MHz To-8 & R a t p a ck SP2T's. M odel No. DS0860/812 5-1000 MHz H igh Iso latio n Flat p a ck SP2T. M odel No. DS0662 5-1000 MHz 24 PIN DIP SP8T. M odel No. DS0838
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DC-2000
DS0850/813
DS0860/812
DS0662
DS0838
DS0874
DC-4000
SP16T.
DS0918
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PLA relay
Abstract: ds0097 pla relay 8 pin 9 v dc
Text: DAICO INDUSTRIES INC blE D • EhD4T5D □□□1S37 537 ■ DAI FEATURES J ■ 10-3000 MHz ■ ■ -30 to -10 dBm Dynamic Range Adjustable Threshold Level ■ ■ Stable Over Temperature See DTD01939 for T0-8 Version MODEL NO. DTD05039 tH r Threshold Detector
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DTD01939
DTD05039
04T20
PLA relay
ds0097
pla relay 8 pin 9 v dc
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