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    Untitled

    Abstract: No abstract text available
    Text: Dense-Pac Microsystems, Inc. ^ D P S 1 2 8 X 1 6 A 3 CERAM IC 128K X ¡ 6 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a


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    DPS128X16A

    Abstract: No abstract text available
    Text: CERAMIC 128KX 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a re vo lu tio n ary n ew m e m o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC m ounted on a co-fired ceram ic substrate. The module packs


    OCR Scan     		PDF 128KX DPS128X16A3 30A045-20 DPS128X16A

    DPS128X16A

    Abstract: No abstract text available
    Text: □PM D P S 1 2 8 X 1 6 A 3 Dense-Pac Microsystems. Inc. ^ CERAMIC 128KX 16 CM OS SRAM MODULE PRELIMINARY D ESC R IP T IO N : The DPS128X16A3 "DENSE-STACK" module is a revolutionary new m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable


    OCR Scan     		PDF 128KX DPS128X16A3 30A045-20 DPS128X16A