DPS128X32CV3
Abstract: 2CV3
Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ
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OCR Scan
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128X3
DPS128X32CV3/DPS128X32BV3
DPS128X32CV3/DPS128X32BV3
500mV
30A044-24
DPS128X32CV3
2CV3
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DP1000
Abstract: No abstract text available
Text: DPS Differential Pressure Sensor DESCRIPTION The powertrain control module in the vehicle supplies power to The DPS is a diesel particulate filter differential pressure the sensor where a pressure transducer measures the sensor with two pressure ports. The output is a differential
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008148-1-EN
DP1000
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 1 Megabit CM OS SRAM DPS128M8n3/DPS 128X8A3 DESCRIPTION: The DPS128M8nY & DPS 128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded,
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OCR Scan
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DPS128M8n3/DPS
128X8A3
DPS128M8nY
128X8A3
50-pin
100ns
120ns
150ns
California92841-1428
30A097-01
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PDF
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LYPR540AH
Abstract: LYPR540AH DATASHEET LGA-28L gyroscope three axis application gyroscope 9 AXIS lga28l LYPR540AHTR LGA land pattern LGA28
Text: LYPR540AH MEMS motion sensor: 3 axis analog output gyroscope Preliminary data Features • Analog supply voltage 2.7 V to 3.6 V ■ Wide extended operating temperature range -40°C to 85°C ■ 3 indipendent angular rate channels ■ ±400 dps and ±1600 dps full-scale
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LYPR540AH
LGA-28L
LYPR540AH
LYPR540AH DATASHEET
LGA-28L
gyroscope three axis application
gyroscope 9 AXIS
lga28l
LYPR540AHTR
LGA land pattern
LGA28
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PDF
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LGA-28L
Abstract: LYPR540AH LYPR LGA28L N1A3D
Text: LYPR540AH MEMS motion sensor: 3 axis analog output gyroscope Preliminary data Features • Analog supply voltage 2.7 V to 3.6 V ■ Wide extended operating temperature range -40°C to 85°C ■ 3 indipendent angular rate channels ■ ±400 dps and ±1600 dps full-scale
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LYPR540AH
LGA-28L
LYPR540AH
LGA-28L
LYPR
LGA28L
N1A3D
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Untitled
Abstract: No abstract text available
Text: 1 Megabit High Speed CMOS SRAM D EN SE-PA C DPS 128M8CnY/BnY, DPS128X8CA3/BA3 M I C R O S Y S T E M S DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .
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OCR Scan
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128M8CnY/BnY,
DPS128X8CA3/BA3
DPS128X8CA3/BA3
50-pin
30A097-31
27ST41S
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PDF
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galvanized iron thermal conductivity
Abstract: 122.04.02 dps 350 power supply schematic reliance thyristor 400V motor operated valves wiring diagrams reliance thyristor wiring diagram 135.12.02 automax dps 450 power supply schematic 1620a 17
Text: AutoMax DPS DC Power Module Instruction Manual User Manual: 49 1335-e 06 Publication: AMXDPS-UM003D-EN TABLE OF CONTENTS GENERAL NOTES Chapter 1. Chapter 2. DESCRIPTION WITH SCHEMATIC DIAGRAM 1.5 Features .
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1335-e
AMXDPS-UM003D-EN
F-800S
F-700L
F-800L
F-16S
F-16XL
F-14S
F-14M
F-14L
galvanized iron thermal conductivity
122.04.02
dps 350 power supply schematic
reliance thyristor
400V motor operated valves wiring diagrams
reliance thyristor wiring diagram
135.12.02
automax
dps 450 power supply schematic
1620a 17
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PDF
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48-PIN
Abstract: 50-PIN tl71 operational 128X8A3
Text: 1 Megabit CMOS SRAM D E N S E - P A C M I C R O S Y S T E M DPS 128M8n3/DPS 128X8A3 S DESCRIPTION: The D P S 1 2 8 M 8 n Y & D P S 128X 8A 3S R A M devicesarea revolutionary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless C hip Carriers SLCC . Available in straight leaded,
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OCR Scan
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128M8n3/DPS
128X8A3
DPS128M8nY
DPS128X8A3SRAMdevicesarea
50-pi
-M25T
100ns
150ns
California92841-1428
30A097-01
48-PIN
50-PIN
tl71 operational
128X8A3
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS 128X32CV3/DPS12 8X32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC
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OCR Scan
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DPS128X32CV3/DPS128X32BV3
128X32CV3/DPS12
8X32BV3
DPS128X32CV3/DPS128X32BV3
500mV
128X32C
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AL339
Abstract: 50-PIN
Text: DENSE-PAC MICROSYSTEMS 2 Megabit C M O S SRAM DPS 128X 16n 3 DESCRIPTION: The D PS128X16n3SRAM "ST A C K " modules are a revolutionary new memory subsystem using Dense-PacMicrosystems'ceramicStackable LeadlessChip Carriers SLCC . Available in straight leaded, "J" leaded
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OCR Scan
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28X16n3
128X16n3
50-pin
DPS128X16n3
128Kx16
100ns
120ns
150ns
-f125
California92841-1428
AL339
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 2 Megabit High Speed CMOS SRAM DPS12 8 X1 6 Cn3 /DPS12 8 X1 6 Bn3 MICROSYSTEMS DESCRIPTION: The DPS 128X16Cn3/DPS128X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .
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OCR Scan
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28X16Cn3/DPS128X16Bn3
50-pin
DPS128X16Cn3/DPS128X16Bn3
3QA097-32
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PDF
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LGA-28
Abstract: LSM030AL LGA-28L LSM030ALTR
Text: LSM030AL Linear sensor module 3D gyroscope sensor Features • Analog supply voltage 2.7 V to 3.6 V ■ Wide extended operating temperature range 40 °C to 85 °C ■ 3 indipendent angular rate channels ■ ±1500 dps full-scale ■ High shock survivability
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LSM030AL
LGA-28L
LSM030AL
LGA-28
LGA-28L
LSM030ALTR
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Untitled
Abstract: No abstract text available
Text: PENSE-PAC 1 Megabit CMOS SRAM DPS128M8n3/DPS 128X8 A3 MICROSYSTEMS DESCRIPTION: The DPS128M8nY & DPS128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded,
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OCR Scan
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DPS128M8n3/DPS
128X8
DPS128M8nY
DPS128X8A3
50-pin
100ns
120ns
150ns
30A097-01
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS128M8CnY/BnY, DPS 128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ.
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OCR Scan
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DPS128M8CnY/BnY,
DPS128X8CA3/BA3
128X8CA3/BA3
50-pin
3QA097-31
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit High Speed CM OS SRAM DPS128M8CnY/BnY, DPS 128X8CA3/BA3 MICROSYSTEMS DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .
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DPS128M8CnY/BnY,
128X8CA3/BA3
DPS128X8CA3/BA3
50-pin
30A097-31
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PDF
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Neuron Chip 3150 MIP application
Abstract: Microprocessor Interface Program Neuron Chip 3150 CYPRESS SLTA-10 Neuron Chip 3150 mip 386
Text: LONWORKS MIP/DPS Developer’s Kit Model 23210 Description The Microprocessor Interface Program MIP is firmware for the Neuron Chip that transforms the Neuron Chip into a communications coprocessor for an attached host processor. The MIP enables the attached host to implement LONWORKS applications
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03-0333-01A
Neuron Chip 3150 MIP application
Microprocessor Interface Program
Neuron Chip 3150 CYPRESS
SLTA-10
Neuron Chip 3150
mip 386
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Untitled
Abstract: No abstract text available
Text: DPS129 □PM Dense-Pac Microsystems, Inc. ^ 16K X 8 CMOS SRAM MODULE NOT RECOMENDED FOR NEW DESIGNS D E S C R IP T IO N : The DPS 129 is a 16K X 8 Static Random Access Memory SRAM module using 8 C M O S 16K X 1 SRAMs. The memory utilizes asynchronous circuitry
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DPS129
DPS129
30A002-01
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PDF
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Untitled
Abstract: No abstract text available
Text: DPS 1152 □PM Dense-Pac Microsystems. Inc. 64K X 18 CMOS SRAM MODULE DESCRIPTION: The DPS1152 is a high-speed, lo w -po w er static RAM m odule com prised o f eighteen 64K X 1 m on olith ic SRAM's, and decou pling capacitors surface m ounted on a co-fired ceram ic substrate.
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DPS1152
S1152
30A00606
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PDF
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Untitled
Abstract: No abstract text available
Text: 2 Megabit CMOS SRAM D E N S E - P A C M ICRO SYSTEM S DPS128X16n3 DESCRIPTION: The DPS 128X16n3 SRAM '"STACK'7modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC . Available in straight leaded, "j" leaded
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OCR Scan
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DPS128X16n3
128X16n3
50-pin
DPS128X16n3
128Kx
120ns
150ns
30A097-02
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PDF
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Untitled
Abstract: No abstract text available
Text: < f v D P S16X 16 16K X 16 CMOS SRAM MODULE DESCRIPTION: The DPS 16X16 is part o f a new family of high speed S tatic RAM m odules d e ve lo p e d by Dense-Pac Microsystems, Inc. The DPS16X16 uses advanced packaging concepts which mount four LCC memory devices on a single multilayer ceramic substrate. The
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OCR Scan
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16X16
DPS16X16
30A017-00
DPS16X16
30A017-00
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PDF
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Untitled
Abstract: No abstract text available
Text: n 7 THIS DRAWING IS UNPUBLISHED. JÊL COPYRIGHT 19 RELEASED FOR PUBLICATION BY AMP INCORPORATED. 4 5 6 3 2 LOG , 19 ALL RIGHTS RESERVED. AD REVISIONS ïïT s t 47 DESCRIPTION 19JUN02 REVISED PER 0 5 1 2 - 0 1 3 7 - 02 NATERI AL H0U5ING CONTACT DPS RAP GREY
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19JUN02
08/5EP/98
ANDER50N/UT
08/SEP/98
amp26463/
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PDF
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lem HA
Abstract: 50-PIN dps128m8bny
Text: DENSE-PAC 1 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 H igh Speed SRAM devices are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC .
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OCR Scan
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DPS128M8CnY/BnY,
DPS128X8CA3/BA3
128M8CnY/BnY,
28X8CA3/BA3
50-pin
California92841-1428
OA097-31
lem HA
dps128m8bny
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PDF
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c040
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 16 Megabit High Speed C M O S SRAM 1 DPS M X 16 M K n 3 SLCC Stack D E S C R IP T IO N : The D PS1M X16M K n3 High Speed S R A M "S T A C K " modules area re volu tion ary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ.
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OCR Scan
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16-Megabits
500mV
30A129-04
c040
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PDF
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74S132
Abstract: AD346 AD585 long range gold detector circuit diagram FL 14-12
Text: High Speed SUMMING PT AD346 Fast 2 .0 | a s Acquisition Tim e to ± 0 . 01 % Low Droop Rate: 0.5m V/m s Low Offset Low Glitch: < 4 0 m V Aperture Jitter: 40 Dps Extended Tem perature Range: -5 5 ° C to + 125°C internal Hold Capacitor HOLD TTL LOGIC REF REF OUT
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OCR Scan
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AD346
400ps
AD585
32-Pin
-100ns
350ns;
250ns
750ns
74S132
AD585
long range gold detector circuit diagram
FL 14-12
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PDF
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