GR530
Abstract: GRH708 grm42-6 gr500
Text: NOTICE Soldering and Mounting 1. PCB Design 1 Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal
|
Original
|
PDF
|
TV130D
GR530
GRH708
grm42-6
gr500
|
ERE22
Abstract: GRM55 ERA21 GRM21 TV19
Text: Soldering and Mounting 1. PCB Design 1 Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.
|
Original
|
PDF
|
GRP15,
GRM18/21
GJ615
LLL18/21
GQM18/21
ERA11/21,
GRM31
LLL31
GNM31
ERE22
GRM55
ERA21
GRM21
TV19
|
LQH66
Abstract: LQM21FN100 flux NF-3000 inductors 3,9 micro-henry LQM21FN4R7 LQM21FN100N0 LQM21FN LQH32 lqh32mn121 LQH31MN* Application Note
Text: O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS for General Use Winding Type LQH31M/LQH32M/LQH43M N Series LQH31M Series 2.3±0.2 1.6±0.2 • Features 1.8±0.2 The chip inductor LQH31M series consists of miniature chip inductors wound on a special ferrite core. It
|
Original
|
PDF
|
O05E-6
O05E6
LQH31M/LQH32M/LQH43M
LQH31M
LQH31MN1R5J01
LQH31MN1R8J01
LQH31MN2R2J01
LQH31MN2R7J01
LQH31MN3R3J01
LQH66
LQM21FN100
flux NF-3000
inductors 3,9 micro-henry
LQM21FN4R7
LQM21FN100N0
LQM21FN
LQH32
lqh32mn121
LQH31MN* Application Note
|
gets
Abstract: No abstract text available
Text: SMD Aluminum Electrolytic Capacitors Reflow Condition Recommended pad pattern and size Unit: mm a c 3φ 0.8 2.2 1.6 8φ 4φ 1.0 2.6 1.6 5φ 1.4 3.0 1.6 6.3φ 1.9 3.5 8x6.5 2.1 4.0 Case size b c a Land size b : pad Recommended soldering methods Method Advisability
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: 0.020 ±0.002 0.51 ±0.05 RECOMMENDED LAND PATTERN 0.061 MAX. 1.55 0.020 REF. 0.51 0.040 [1.02] 0.029 [0.76] 0.050 ±0.002 1.27 ±0.05 0.070 [1.78] 0.068 MAX. [1.73] 0.090 MAX. 2.29 UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN INCH MM SURFACE FINISH: TOLERANCES:
|
Original
|
PDF
|
AISC-0805
|
NF-3000
Abstract: No abstract text available
Text: O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS High-frequency Winding Type LQW15A/LQW18A Series LQW15A Series 3 0.5±0.1 0.10±0.05 The LQW15A series which consists of air core chip coil using a miniature alumina core. The tight inductance tolerance +-0.2nH,+-3% is
|
Original
|
PDF
|
O05E-6
O05E6
LQW15A/LQW18A
LQW15A
LQH32MN680K21
LQH32M
NF-3000
|
Untitled
Abstract: No abstract text available
Text: 0.079 ±0.004 2 ±0.1 3 Front View 0.024 ±0.004 0.6 ±0.1 0.020 ±0.004 0.5 ±0.1 1 0.026 0.65 2 0.02 ±0.004 0.6 ±0.1 2 0.020 0.5 C0.008 [0.2] 0.026 0.65 Top View 0.028 ±0.004 0.7 ±0.1 1 Reommended Land Pattern 0.014 0.35 0.063 ±0.004 1.6 ±0.1 4 0.030
|
Original
|
PDF
|
|
LQM18NN82NM00
Abstract: LQM21NN1R0K10 LQH32MN LQM21FN
Text: O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS for General Use Monolithic Type LQM18N/LQM21N Series LQM18N Series 0.4±0.2 0.8±0.15 The LQM18N series, of magnetically shielded chip coil was developed by using original multilayer process technology and magnetic materials.
|
Original
|
PDF
|
O05E-6
O05E6
LQM18N/LQM21N
LQM18N
LQH32MN680K21
LQH32M
LQM18NN82NM00
LQM21NN1R0K10
LQH32MN
LQM21FN
|
Untitled
Abstract: No abstract text available
Text: Recommended Land Pattern 0.430 10.92 0.350 8.89 2X 0.638±0.006 16.20±0.15 0.386 9.80 0.018 0.45 0.012 0.30 0.018 0.45 0.450 11.43 D1 D2 D3 D4 2 8 1 0.06 3 1.60 26 0.1 3.2 0.190 4.83 7 0.450 11.43 0.620 15.75 0.018 0.45 GREEN RIGHT LED J1 0.0 0.9 35 0.230
|
Original
|
PDF
|
OL012
ARJC01-111002L
|
Untitled
Abstract: No abstract text available
Text: Recommended Land Pattern 0.620 15.75 0.450 11.43 0.018 0.45 0.012 0.30 0.450 11.43 1. .04 02 0 26 0.1 3.2 9 3 5 10 0.100 2.54 6 8 0.120 3.05 1 4 7 11 0.298 7.57 12 0.060 1.52 0.014 0.35 YELLOW RIGHT LED 0.018 0.45 0.063 1.60 4X 0.116 2.95 2 0.498 12.65 0.142±0.012
|
Original
|
PDF
|
ARJC02-111009D
|
Untitled
Abstract: No abstract text available
Text: Recommended Land Pattern 0.620 15.75 0.533 13.55 0.018 0.45 0.012 0.30 0.018 0.45 0.450 11.43 4 3 6 5 8 7 1. .04 02 0 10 12 9 11 0.298 7.57 0.498 12.65 0.142±0.012 3.60±0.30 J1 0.530 13.45 J8 0.014 0.35 YELLOW RIGHT LED 1 4X 0.276 7.00 GREEN LEFT LED 0.047
|
Original
|
PDF
|
ARJC02-111006K
|
Untitled
Abstract: No abstract text available
Text: Recommended Land Pattern 0.620 15.75 0.106 2.70 0.630±0.006 16.00±0.15 0.276 7.00 0.018 0.45 0.012 0.30 0.450 11.43 0.06 3 1.60 26 0.1 3.2 1 9 4 3 6 5 10 40 0.0 2 1.0 0.100 2.54 2 8 7 11 12 0.298 7.57 0.498 12.65 0.142±0.012 3.60±0.30 YELLOW RIGHT LED
|
Original
|
PDF
|
ARJC02-111006E
|
LQW31HN
Abstract: LQM21DN22 lqw2bhn68ng LQM21FN100N0 LQM21DN10 LQM21FN
Text: O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS High-frequency Winding Type LQW2BH/LQW31H Series LQW2BH Series 1.5±0.2 1.5±0.2 1.78max The LQW2BH series consists of air-core chip coil using a sub-miniature alumina core as a bobbin. The high Q value
|
Original
|
PDF
|
O05E-6
O05E6
LQW2BH/LQW31H
78max
470nH.
LQH32MN680K21
LQH32M
LQW31HN
LQM21DN22
lqw2bhn68ng
LQM21FN100N0
LQM21DN10
LQM21FN
|
LQS66C
Abstract: LQN21A LQN6C 40KHZ ULTRASONIC CLEANER CIRCUIT LQS33N LQN4N LQH 3 C 22 uH 40khz Ultrasonic cleaner circuit diagram LQh3N lqh3n331k(j)04
Text: This is the PDF file of catalog No.O05E-3. O05E3.pdf 97.10.03 CHIP COIL Standard Chip Coil LQH1N/LQH3N/LQH N 4N Series Wire Wound Chip Coil with High Q Value at High Frequencies and Low DC Resistance The chip coil LQH/LQN series consists of miniature chip inductors wound on a special ferrite core and are
|
Original
|
PDF
|
O05E-3.
O05E3
LQH3N680K34
LQS66C
LQN21A
LQN6C
40KHZ ULTRASONIC CLEANER CIRCUIT
LQS33N
LQN4N
LQH 3 C 22 uH
40khz Ultrasonic cleaner circuit diagram
LQh3N
lqh3n331k(j)04
|
|
|
LQH1NR33K04
Abstract: LQH1NR15K04 LQH1NR22K04 40KHZ ULTRASONIC CLEANER CIRCUIT MURATA LQH chipdrossel MR8153RA LQS33N LQH3N330K LQH 3 C 22 uH
Text: Datum 981109 PRODUKTINFORMATION HÄMTFAX 08-580 941 14 FAX ON DEMAND +46 8 580 941 14 INTERNET http://www.elfa.se TEKNISK INFORMATION 020-75 80 20 ORDERTEL 020-75 80 00 ORDERFAX 020-75 80 10 TECHNICAL INFORMATION +46 8 580 941 15 ORDERPHONE +46 8 580 941 01 ORDERFAX +46 8 580 941 11
|
Original
|
PDF
|
LQH3N680K34
LQH1NR33K04
LQH1NR15K04
LQH1NR22K04
40KHZ ULTRASONIC CLEANER CIRCUIT
MURATA LQH
chipdrossel
MR8153RA
LQS33N
LQH3N330K
LQH 3 C 22 uH
|
LQH3ERN
Abstract: LQH3ERN1R5 NF-3000 1415C LQH3ERN6R8G01 LQH3ERN1R5G01 LQM21FN
Text: O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS for General Use Magnetic Shielded Type LQH3ER Series 1.8±0.2 LQH3ER Series • Features The LQH3ER series consists of magnetically shielded chip inductors. Its tight inductance tolerance of +-2%
|
Original
|
PDF
|
O05E-6
O05E6
LQH3ERN1R0G01
LQH3ERN1R2G01
LQH3ERN1R5G01
LQH3ERN1R8G01
LQH3ERN2R2G01
LQH3ERN2R7G01
LQH3ERN3R3G01
LQH3ERN3R9G01
LQH3ERN
LQH3ERN1R5
NF-3000
1415C
LQH3ERN6R8G01
LQM21FN
|
Untitled
Abstract: No abstract text available
Text: Common mode Noise Filter Array Common mode Noise Filter Array Type: EXC28CG • Features ● ● ● ● ● ● ● 2 Common mode noise filters in one package The TDR value is controlled to 100 ȑ typ. , preventing transmission signal reflection Meet the HDMI and other eye-pattern standards and suppress the skew, overshoot, and other waveform distortion
|
Original
|
PDF
|
EXC28CG
EL114
|
Untitled
Abstract: No abstract text available
Text: Common mode Noise Filter Array Common mode Noise Filter Array Type: EXC28CG • Features ● ● ● ● ● ● ● 2 Common mode noise filters in one package The TDR value is controlled to 100 ȑ typ. , preventing transmission signal reflection Meet the HDMI and other eye-pattern standards and suppress the skew, overshoot, and other waveform distortion
|
Original
|
PDF
|
EXC28CG
EL113
|
LQH43CN330K01
Abstract: LQH43CN1R0M01 LQH32CN*M11 LQH43CN470K01
Text: O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS for Choke Winding Type LQH31C/LQH32C/LQH43C Series LQH31C Series 2.3±0.2 1.6±0.2 • Features 1.8±0.2 The LQH31C series consists of miniature chip inductors with low DC resistance, high current capacity, and high
|
Original
|
PDF
|
O05E-6
O05E6
LQH31C/LQH32C/LQH43C
LQH31C
970mA
LQH31CN100K01
LQH31CN220K01
LQH31CN470K01
LQH31CN101K01
LQH43CN330K01
LQH43CN1R0M01
LQH32CN*M11
LQH43CN470K01
|
800MHz CDMA Handset Circuit Diagram
Abstract: ipc-SM-782 resistor 0603 RF5144PCBA-410 ERJ-3GEY0R00 IPC-SM-782 RF5144
Text: RF5144 DUAL-BAND CDMA 800MHz/1900MHz TRI-MODE POWER AMPLIFIER MODULE RoHS Compliant & Pb-Free Product Typical Applications • 3V CDMA/AMPS Cellular Handset • 3V CDMA US-PCS Handset • 3V CDMA2000/1XRTT Cellular Handset • 3V CDMA2000/1XRTT US-PCS Handset
|
Original
|
PDF
|
RF5144
800MHz/1900MHz
CDMA2000/1XRTT
RF5144
IS-95/CDMA20001X/
824MHz
849MHz
1850MHz
1910MHz
800MHz CDMA Handset Circuit Diagram
ipc-SM-782 resistor 0603
RF5144PCBA-410
ERJ-3GEY0R00
IPC-SM-782
|
alpha b 500k
Abstract: LQG15HN5N6
Text: O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS for Choke Monolithic Type LQM21D/LQM21F/LQM31F Series LQM21D/LQM21F Series 0.5±0.3 Electrode The LQM21D series consists of magnetically shielded chip inductors. It has less than half the DC resistance
|
Original
|
PDF
|
O05E-6
O05E6
LQM21D/LQM21F/LQM31F
LQM21D/LQM21F
LQM21D
LQM21Dis
LQH32MN680K21
LQH32M
alpha b 500k
LQG15HN5N6
|
land pattern PQFP 132
Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L
|
OCR Scan
|
PDF
|
PQ80-
5U-1982
M0-112,
PS0-4035
P5C-4049
land pattern PQFP 132
PQFP 132 PACKAGE DIMENSION
MO-112
N2979
land pattern PQFP 208
|
BLA81B01
Abstract: BLM550R NFM52R BLM550 BLM32 BLM41P03 NFM52 NFM51
Text: •mwifíntn Copper Foil Pattern BLM11 BLM21 BLM32 BLM31 BLM41 BLM550R EMI FILTERS As shown below, one side of the PCB is used for chip mounting, and the other is used for grounding. Small diameter feedthrough holes are then used to connect the grounds on each side of the PCB. This reduces the highfrequency impedance of the grounding and maximizes the
|
OCR Scan
|
PDF
|
BLM11
BL/31/41
BLA81B01
BLM550R
NFM52R
BLM550
BLM32
BLM41P03
NFM52
NFM51
|
4B2S
Abstract: 72741 k 4110 tip 338 N80E
Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) REVISIONS DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORM AT 01/24/92 APPRO VED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L MIN
|
OCR Scan
|
PDF
|
PQ80-
5U-1982
M0-10B,
850S4
PSC-4035
4B2S
72741
k 4110
tip 338
N80E
|
