TB488
Abstract: No abstract text available
Text: Technical Brief 488 Authors: Mark Kwoka and Loyde Carpenter PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Introduction Intersil's POL Module Product family offering a relatively new packaging concept that is currently experiencing rapid growth.
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TB488
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BLM41PG471SN1
Abstract: BLM31PG391SN1 BLM41PG750SN1 BLM41P H63A BLM21PG33 BLM41PG600SN1 MURATA BLM BLM41PG102SN1 BLM18
Text: Land Pattern Solder Resist BLM Series c Except BLM21P/31P/41P a b Size (mm) Type L W a b c ∗ BLM15 (Reflow) 1.0 0.5 0.4 1.2-1.4 0.5 BLM18 (Flow) 1.6 0.8 0.7 2.2-2.6 0.7 BLM18 (Reflow) 1.6 0.8 0.7 1.8-2.0 0.7 BLM21 2.0 1.25 1.2 3.0-4.0 1.0 BLM31 3.2 1.6
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BLM21P/31P/41P)
BLM15
BLM18
BLM21
BLM31
BLM41
BLM15
BLM21P/31P/41P
BLM41PG471SN1
BLM31PG391SN1
BLM41PG750SN1
BLM41P
H63A
BLM21PG33
BLM41PG600SN1
MURATA BLM
BLM41PG102SN1
BLM18
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H60A
Abstract: H63A
Text: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters N M/N A series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as
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BLA31
H60A
H63A
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Untitled
Abstract: No abstract text available
Text: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as
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VCM11R/21R
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murata chip suppression filter NFA
Abstract: No abstract text available
Text: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as
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BLA3216
murata chip suppression filter NFA
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qfn Substrate design guidelines
Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid
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TB389
qfn Substrate design guidelines
j-std-001d
IPC-SM-782
MO-220
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lqw04
Abstract: LQW21H T4 0506 LQW2UA LQP02T MURATA LQW15A
Text: RF Inductor Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor chip coil electrode. Land Pattern + Solder Resist Land Pattern
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LQG15H
LQG18H
LQP02T
LQP03T
LQP15M
LQP15M
lqw04
LQW21H
T4 0506
LQW2UA
MURATA LQW15A
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TB389
Abstract: No abstract text available
Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
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TB389
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VCM18R
Abstract: H60A H63A VCM21R varistor 1 A 30W
Text: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters N M / N A series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as
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VCM18R/21R
VCM18R
H60A
H63A
VCM21R
varistor 1 A 30W
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J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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TB389
J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
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J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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TB389
J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
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NFM60R
Abstract: NFM51R
Text: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as
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NFM51R
NFM60R
NFM51R
NFM60R
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H60A
Abstract: H63A
Text: for reflow soldering Land Solder Resist NFE61P/61H Chip mounting side Back side Small diameter thru hole φ0.4— φ0.6 3.0 Connect to ground pattern of mounting side 1.6 2.6 3.0 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFp
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NFE61P/61H
H60A
H63A
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NFE31P
Abstract: H60A H63A 02MG
Text: for reflow and flow soldering NFW31S for reflow soldering NFE31P Chip mounting side Land Solder Resist Back side Small diameter thru hole φ0.4—φ0.6 3.0 3.0 Connect to ground pattern of mounting side 2.6 1.0 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFp
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NFW31S
NFE31P
NFE31P
H60A
H63A
02MG
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Untitled
Abstract: No abstract text available
Text: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as
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NFM61R/61RH
NFM61R
NFM61RH
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DLM31K
Abstract: DLW31S H60A H63A
Text: for reflow and flow soldering Land Solder Resist 0.7 1.4 0.7 DLP31S DLM31K 1.0 0.6 1.0 for reflow soldering DLW31S ∗1 1.6 0.4 ∗2 1.6 3.7 ∗ 1 : If the pattern is made with wider than 1.6mm, it will result to let components turn around, because melting speed is different.
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DLP31S
DLM31K
DLW31S
DLM31K
DLW31S
H60A
H63A
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NFM41R
Abstract: NFM40P nfm40r NFM21C pattern NFM21P
Text: for reflow soldering Land Solder Resist Chip mounting side Back side Ground pattern d Small diameter thru hole ø0.4—ø0.6 Connect to ground pattern of mounting side a b in mm c Size mm Type NFM21C/NFR21G NFM21P NFM40R/3DC NFM40P NFM41R/41C NFM41P/VFM41R
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NFM21C/NFR21G
NFM21P
NFM40R/3DC
NFM40P
NFM41R/41C
NFM41P/VFM41R
NFM21C/21P,
NFR21G
NFM41R
NFM40P
nfm40r
NFM21C pattern
NFM21P
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Untitled
Abstract: No abstract text available
Text: Technical Brief 498 PCB Land Pattern Design and Surface Mount Guidelines for HDA POL Modules Introduction Intersil's HDA POL Module Product family offers a relatively new packaging concept that is currently experiencing rapid growth. The Module Product family features the HDA High
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ele00x
TB498
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Untitled
Abstract: No abstract text available
Text: .126±.006 3.2±0.15 PIN 1 2 3 FUNCTION Vcc/NC* GND Output 4 Vdd *NC for ASTX-09 only .20±.006 5.0±0.15 Recommended Land Pattern .15 3.8 .059 1.5 max .055 1.4 min .102 2.6 .039 1.0 .102 2.6 .043 1.1 2 1 0.01uF Note: The outline package may vary. Electrical properties, pin configuration, and land pattern are the same.
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ASTX-09
ASVTX-09
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ERE22
Abstract: GRM55 ERA21 GRM21 TV19
Text: Soldering and Mounting 1. PCB Design 1 Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.
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GRP15,
GRM18/21
GJ615
LLL18/21
GQM18/21
ERA11/21,
GRM31
LLL31
GNM31
ERE22
GRM55
ERA21
GRM21
TV19
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200123K
Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These
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IPC-SM-782)
200123K
200123K
QFN 88 land pattern
LGA-28 land pattern
SOIC 8 pcb pattern
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MO-211
Abstract: C828 1031L 438H
Text: REVIS PKG SYMM £ REV A — IONS D E S C R 1P T I O N RELEASE TO DO CUME NT BY/APP'D E .C .N. DATE 607 03/15/2002 C O NT ROL MS/VA 0.5 DIMENSIONS ARE IN MILLIMETERS NOTE 3 LAND PATTERN RECOMMENDATION NOTES: UNLESS 1 . E P OX Y OTHERWI S E 0 . 001 SPECIFIED
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OCR Scan
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MO-211,
APPROVALS85
MO-211
C828
1031L
438H
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Untitled
Abstract: No abstract text available
Text: m V D EM TB s M B L A A1 A2 D D1 E El N e b bl ddd REV DESCRIPTION □A TE OD N ITW L RELEA SE « /2 0 /8 7 APPROVED LAND PATTERN DIMENSIONS JEDEC VARIATION BFB MAX NN NON 1.60 .1» ,15 1.39 1-40 1,45 22, DO BSC 20.00 BSC 22.00 BSC 20.00 BSC 144 •5D BSC
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Y14-5N-19B2
DEDB49
4J3-BS74
MS-026v
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land pattern PQFP 132
Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L
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PQ80-
5U-1982
M0-112,
PS0-4035
P5C-4049
land pattern PQFP 132
PQFP 132 PACKAGE DIMENSION
MO-112
N2979
land pattern PQFP 208
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