DO-15 LAND PATTERN Search Results

MO-211

Abstract: C828 1031L 438H
Contextual Info: REVIS PKG SYMM £ REV A — IONS D E S C R 1P T I O N RELEASE TO DO CUME NT BY/APP'D E .C .N. DATE 607 03/15/2002 C O NT ROL MS/VA 0.5 DIMENSIONS ARE IN MILLIMETERS NOTE 3 LAND PATTERN RECOMMENDATION NOTES: UNLESS 1 . E P OX Y OTHERWI S E 0 . 001 SPECIFIED

Contextual Info: m V D EM TB s M B L A A1 A2 D D1 E El N e b bl ddd REV DESCRIPTION □A TE OD N ITW L RELEA SE « /2 0 /8 7 APPROVED LAND PATTERN DIMENSIONS JEDEC VARIATION BFB MAX NN NON 1.60 .1» ,15 1.39 1-40 1,45 22, DO BSC 20.00 BSC 22.00 BSC 20.00 BSC 144 •5D BSC

TB488

Contextual Info: Technical Brief 488 Authors: Mark Kwoka and Loyde Carpenter PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Introduction Intersil's POL Module Product family offering a relatively new packaging concept that is currently experiencing rapid growth.

BLM41PG471SN1

Abstract: BLM31PG391SN1 BLM41PG750SN1 BLM41P H63A BLM21PG33 BLM41PG600SN1 MURATA BLM BLM41PG102SN1 BLM18
Contextual Info: Land Pattern Solder Resist BLM Series c Except BLM21P/31P/41P a b Size (mm) Type L W a b c ∗ BLM15 (Reflow) 1.0 0.5 0.4 1.2-1.4 0.5 BLM18 (Flow) 1.6 0.8 0.7 2.2-2.6 0.7 BLM18 (Reflow) 1.6 0.8 0.7 1.8-2.0 0.7 BLM21 2.0 1.25 1.2 3.0-4.0 1.0 BLM31 3.2 1.6

H60A

Abstract: H63A
Contextual Info: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters N M/N A series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as

Contextual Info: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as

murata chip suppression filter NFA

Contextual Info: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as

qfn Substrate design guidelines

Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid

lqw04

Abstract: LQW21H T4 0506 LQW2UA LQP02T MURATA LQW15A
Contextual Info: RF Inductor Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor chip coil electrode. Land Pattern + Solder Resist Land Pattern

TB389

Contextual Info: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing

VCM18R

Abstract: H60A H63A VCM21R varistor 1 A 30W
Contextual Info: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters N M / N A series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as

J-STD-005

Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

J-STD-005

Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

NFM60R

Abstract: NFM51R
Contextual Info: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as

NFE31P

Abstract: H60A H63A 02MG
Contextual Info: for reflow and flow soldering NFW31S for reflow soldering NFE31P Chip mounting side Land Solder Resist Back side Small diameter thru hole φ0.4—φ0.6 3.0 3.0 Connect to ground pattern of mounting side 2.6 1.0 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFp

PLM250

Abstract: PLM3216K PLM3216
Contextual Info: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as

Contextual Info: 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFM/NFA series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as

DLM31K

Abstract: DLW31S H60A H63A
Contextual Info: for reflow and flow soldering Land Solder Resist 0.7 1.4 0.7 DLP31S DLM31K 1.0 0.6 1.0 for reflow soldering DLW31S ∗1 1.6 0.4 ∗2 1.6 3.7 ∗ 1 : If the pattern is made with wider than 1.6mm, it will result to let components turn around, because melting speed is different.

NFM41R

Abstract: NFM40P nfm40r NFM21C pattern NFM21P
Contextual Info: for reflow soldering Land Solder Resist Chip mounting side Back side Ground pattern d Small diameter thru hole ø0.4—ø0.6 Connect to ground pattern of mounting side a b in mm c Size mm Type NFM21C/NFR21G NFM21P NFM40R/3DC NFM40P NFM41R/41C NFM41P/VFM41R

Contextual Info: Technical Brief 498 PCB Land Pattern Design and Surface Mount Guidelines for HDA POL Modules Introduction Intersil's HDA POL Module Product family offers a relatively new packaging concept that is currently experiencing rapid growth. The Module Product family features the HDA High

Contextual Info: .126±.006 3.2±0.15 PIN 1 2 3 FUNCTION Vcc/NC* GND Output 4 Vdd *NC for ASTX-09 only .20±.006 5.0±0.15 Recommended Land Pattern .15 3.8 .059 1.5 max .055 1.4 min .102 2.6 .039 1.0 .102 2.6 .043 1.1 2 1 0.01uF Note: The outline package may vary. Electrical properties, pin configuration, and land pattern are the same.

ERE22

Abstract: GRM55 ERA21 GRM21 TV19
Contextual Info: Soldering and Mounting 1. PCB Design 1 Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.

land pattern PQFP 132

Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Contextual Info: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L

200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These