Untitled
Abstract: No abstract text available
Text: 107-68948 Packaging Specification 09Jul2012 Rev C CABLE ASSEMBLY,DIRECT ATTACH QSFP 1. PURPOSE 目的 Define the packaging specifiction and packaging method of CABLE ASSEMBLY,DIRECT ATTACH QSFP. 订定 CABLE ASSEMBLY,DIRECT ATTACH QSFP 产品之包装规格及包装方式。
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09Jul2012
1748094-X
2163603-XUL
QR-ME-030C
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RENESAS tft application notes
Abstract: 20 pin lcd panel h8sx HC126A MOLEX52044
Text: H8S/H8SX Series Direct Drive LCD Design Guide Version 2.6 User’s Manual Direct Drive Solution Rev. 2.60 September, 2009 Renesas Technology America america.renesas.com Direct Drive LCD Design Guide Index 1. INTRODUCTION. 3
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40A-450-GS
Abstract: HP8573E HP8753E Picoprobe RIMM-Module HP34401A SoRIMM Rambus ASIC Cell rambus RAC direct rdram rac
Text: DIRECT RAMBUSTM SO-RIMMTM MODULE VALIDATION SPECIFICATION VERSION 0.9 È Copyright November 2000 Rambus Inc. All rights reserved. Rambus, RDRAM, and the Rambus Logo are registered trademarks of Rambus Inc. Direct Rambus, RIMM, SO-RIMM, and Direct RDRAM are trademarks of Rambus Inc.
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DL-0100-090
40A-450-GS
HP8573E
HP8753E
Picoprobe
RIMM-Module
HP34401A
SoRIMM
Rambus ASIC Cell
rambus RAC
direct rdram rac
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H8SX1668
Abstract: Atmel touchscreen freertos H8S2378 h8sx HVGA LCD driver kyocera column driver Renesas HVGA TOUCH SCREEN MCU RLCD2378
Text: APPLICATION NOTE H8S/H8SX Families Direct Drive LCD Demo Application Note Introduction The purpose of the LCD Direct Drive demo is to demonstrate how to create an interactive TFT-LCD panel application through Renesas DirectLCD API in a real-time environment on one Renesas LCD Direct Drive
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REU05B0112-0202/Rev
H8SX1668
Atmel touchscreen
freertos
H8S2378
h8sx
HVGA LCD driver
kyocera column driver
Renesas HVGA
TOUCH SCREEN MCU
RLCD2378
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EIA-364-13
Abstract: EIA-364-38 EIA-364-27 EIA-364-28 EIA-364-32 press fit connector EIA-364-13 contact retention
Text: Product Specification 108-2127 17Mar08 Rev B XFP Copper Module Direct Attach Cable Assembly and Cage 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics XFP Copper Module Direct Attach Cable Assembly and Cage.
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17Mar08
08Dec05.
13Jul07.
EIA-364-13
EIA-364-38
EIA-364-27
EIA-364-28
EIA-364-32
press fit connector
EIA-364-13 contact retention
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Untitled
Abstract: No abstract text available
Text: Series 74 Helical Tubing 713-380 Hat Trick System Y Transition for Direct Attachment of Series 74 Helical Convoluted Tubing Hat Trick Y transition with banding platform and boot groove for direct attachment of Series 74 conduit How To Order Product Series
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0-001S104
770-001S105
770-001S106
770-001S107
770-001S108
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Untitled
Abstract: No abstract text available
Text: Series 74 Helical Tubing 713-380 Hat Trick System Y Transition for Direct Attachment of Series 74 Helical Convoluted Tubing Hat Trick Y transition with banding platform and boot groove for direct attachment of Series 74 conduit How To Order Product Series
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770-001S103
770-001S104
770-001S105
770-001S106
770-001S107
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710-859
Abstract: No abstract text available
Text: Series 72 Guardian 710-859 Direct Attachment Guardian Double-Y Transition For Series 72 Annular Convoluted Tubing Direct-attachment Guardian double-Y transition How To Order “B” End, Conduit Entry Size Table I Finish (Table II) Product Series 710 - 859 M
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770-001S107
710-859
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Untitled
Abstract: No abstract text available
Text: Series 74 Helical Tubing 713-381 Hat Trick System T Transition for Direct Attachment of Series 74 Helical Convoluted Tubing Hat Trick T Transition with banding platform and boot groove for direct attachment of Series 74 conduit How To Order Product Series
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0-001S104
770-001S105
770-001S106
770-001S107
770-001S108
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710-860
Abstract: No abstract text available
Text: Series 72 Guardian 710-860 Direct Attachment Guardian T Transition For Series 72 Annular Convoluted Tubing Direct-attachment Guardian T transition How To Order “B” End, Conduit Entry Size Table I Finish (Table II) Product Series 710 - 860 M Basic No.
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770-001S107
710-860
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710-858
Abstract: No abstract text available
Text: Series 72 Guardian 710-858 Direct Attachment Guardian Y Transition For Series 72 Annular Convoluted Tubing Direct-attachment Guardian Y transition How To Order “B” End, Conduit Entry Size Table I Finish (Table II) Product Series 710 - 858 M Basic No.
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770-001S107
710-858
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710-861
Abstract: No abstract text available
Text: Series 72 Guardian 710-861 Direct Attachment Guardian Double-T Transition For Series 72 Annular Convoluted Tubing Direct-attachment Guardian double-T transition How To Order “B” End, Conduit Entry Size Table I Finish (Table II) Product Series 710 - 861 M
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770-001S107
710-861
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Untitled
Abstract: No abstract text available
Text: Series 74 Helical Tubing 713-381 Hat Trick System T Transition for Direct Attachment of Series 74 Helical Convoluted Tubing Hat Trick T Transition with banding platform and boot groove for direct attachment of Series 74 conduit How To Order Product Series
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770-001S103
770-001S104
770-001S105
770-001S106
770-001S107
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DA1000
Abstract: No abstract text available
Text: Direct Attach DA1000 LEDs CxxxDA1000-Sxx000 Data Sheet Cree’s Direct Attach DA1000 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
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DA1000TM
CxxxDA1000-Sxx000
DA1000
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Untitled
Abstract: No abstract text available
Text: Direct Attach DA1000 LEDs CxxxDA1000-Sxx000 Data Sheet Cree’s Direct Attach DA1000 LEDs are the next generation of solid-state LED emitters that combine highly eficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
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DA1000â
CxxxDA1000-Sxx000
DA1000
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Untitled
Abstract: No abstract text available
Text: Direct Attach DA1000 LEDs CxxxDA1000-Sxx000 Data Sheet Cree’s Direct Attach DA1000 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
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DA1000â
CxxxDA1000-Sxx000
DA1000
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DA3547
Abstract: AuSn eutectic ausn submount
Text: Direct Attach DA3547 LEDs CxxxDA3547-Sxxx00 Data Sheet Cree’s Direct Attach DA3547 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value
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DA3547TM
CxxxDA3547-Sxxx00
DA3547
AuSn eutectic
ausn submount
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Untitled
Abstract: No abstract text available
Text: Direct Attach DA700 LEDs CxxxDA700-Sxx000 Data Sheet Cree’s Direct Attach DA700 LEDs are the next generation of solid-state LED emitters that combine highly eficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
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DA700â
CxxxDA700-Sxx000
DA700
DA700
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DA700
Abstract: OS4000
Text: Direct Attach DA700 LEDs CxxxDA700-Sxx000 Data Sheet Cree’s Direct Attach DA700 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
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DA700TM
CxxxDA700-Sxx000
DA700
OS4000
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cree
Abstract: DA3547
Text: Direct Attach DA3547 LEDs CxxxDA3547-Sxxx00-2 Data Sheet Cree’s Direct Attach DA3547 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value
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DA3547TM
CxxxDA3547-Sxxx00-2
DA3547
cree
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DA2432
Abstract: cxxxd DA243 C470DA2432-0701-2
Text: Direct Attach DA2432 LEDs CxxxDA2432-Sxxx00-2 Data Sheet Cree’s Direct Attach DA2432 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value
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DA2432TM
CxxxDA2432-Sxxx00-2
DA2432
cxxxd
DA243
C470DA2432-0701-2
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B-701
Abstract: a69 156
Text: 64MB RIMMTM Module with 128/144Mb RDRAMs Direct Rambus RIMM™ Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s Direct Rambus RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and nonECC modules.
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128/144Mb
128Mb
144Mb
HR064N04E
HR064N04D
HR064N04C
HR064N04B
HR064E04E
HR064E04D
HR064E04C
B-701
a69 156
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HR256E16B
Abstract: HR256E16C HR256E16D HR256E16E HR256N16B HR256N16C HR256N16D HR256N16E
Text: 256MB RIMMTM Module with 128/144 Mb RDRAMs Direct Rambus RIMM™ Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s Direct Rambus RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and nonECC modules.
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256MB
128Mb
144Mb
HR256N16E
HR256N16D
HR256N16C
HR256N16B
HR256E16E
HR256E16D
HR256E16C
HR256E16B
HR256E16C
HR256E16D
HR256E16E
HR256N16B
HR256N16C
HR256N16D
HR256N16E
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HR128E08B
Abstract: HR128E08C HR128E08D HR128E08E HR128N08C HR128N08D HR128N08E
Text: 128 MB RIMMTM Module with 128/144Mb RDRAMs Direct Rambus RIMM™ Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s Direct Rambus RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and nonECC modules.
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128/144Mb
128Mb
144Mb
HR128N08E
HR128N08D
HR128N08C
HR128N08B
HR128E08E
HR128E08D
HR128E08C
HR128E08B
HR128E08C
HR128E08D
HR128E08E
HR128N08C
HR128N08D
HR128N08E
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