DIMM DDR3 SOCKET Search Results

K4B2G0846

Contextual Info: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

DDR3 DIMM

Abstract: 200Pos INNER CARTON LABEL
Contextual Info: 107-68838 Packaging Specification 29May09 Rev A DDR3 DIMM ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of DDR3 DIMM ASSY. 订定 DDR3 DIMM ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product

Contextual Info: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 1024MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN01G64D2BG1SA-xxRT • 1GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: 240PIN DDR3 1333 Unbuffered DIMM JM1333KLN-8GK 8GB Kit With 256Mx8 CL9 Description Placement The JM1333KLN-8GK, a dual channel kit, consists of 2 pcs 4GB DDR3 SDRAM module. The 4GB module is a 512M x 64bits DDR3-1333 Unbuffered DIMM. The 4GB module consists of 16pcs 256Mx8 bits DDR3 SDRAMs in

GS-14-899

Abstract: MO-269 DDR3 memory DDR3 sodimm socket DDR3 rDIMM DDR3 pcb design GS-12-486 ddr3 dimm connector sc007
Contextual Info: BOARD-TO-BOARD CONNECTORS FCÎ, DDR3 MEMORY MODULE SOCKETS DESCRIPTION Memory module sockets from FCI are designed to accept most industry standard memory types DDR, DDR2, DDR3 and form factors such as DIMM, SO-DIMM or VLP DIMM. The sockets allow convenient memory

Contextual Info: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3UL Description Placement The TS256MKR72V3UL is a 256M x 72bits DDR3-1333 VLP Registered DIMM. The TS256MKR72V3UL consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and

Contextual Info: Data Sheet Rev.1.1 12.11.2010 4096MB DDR3 – SDRAM Ultra Low Profile ECC DIMM 240 Pin unbuffered ECC DIMM Features: SGU04G72H1BD2MT-CCRT 4096MB PC3-10600 in FBGA Technology RoHS compliant Options: • Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7

Contextual Info: Data Sheet Rev.1.1 12.11.2010 4096MB DDR3 – SDRAM Ultra Low Profile ECC DIMM 240 Pin unbuffered ECC DIMM Features: SGU04G72H1BD2MT-CCRT 4096MB PC3-10600 in FBGA Technology RoHS compliant Options: • Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7

Contextual Info: This document was generated on 01/21/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 78315-0051 Active DDR3 DIMM Sockets 1.00mm Pitch Aerodynamic DDR3 DIMM Socket, Very Low Profile, Vertical, Press-Fit,

Contextual Info: This document was generated on 06/18/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 78588-0002 Active DDR3 DIMM Sockets 1.00mm Pitch DIMM DDR3 Socket, Ultra Low Profile, Through Hole, Vertical, Black

Contextual Info: This document was generated on 02/04/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 78588-1502 Active DDR3 DIMM Sockets 1.00mm Pitch DIMM DDR3 Socket, Ultra Low Profile, Through Hole, Vertical, Black

Contextual Info: This document was generated on 02/04/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 78315-0011 Active DDR3 DIMM Sockets 1.00mm Pitch Aerodynamic DDR3 DIMM Socket, Very Low Profile, Vertical, Press-Fit,

Contextual Info: This document was generated on 02/04/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 78315-0001 Active DDR3 DIMM Sockets 1.00mm Pitch Aerodynamic DDR3 DIMM Socket, Very Low Profile, Vertical, Press-Fit,

Contextual Info: 240PIN DDR3 1066 Registered DIMM TS1GKR72V1N 8GB With 256Mx8 CL7 Description Placement The TS1GKR72V1N is a 1G x 72bits DDR3-1066 Registered DIMM. The TS1GKR72V1N consists of 36pcs 256Mx8bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits

Contextual Info: 204PIN DDR3 1066 SO-DIMM 1024MB With 128Mx8 CL7 TS128MSK64V1U Description Placement The TS128MSK64V1U is a 128M x 64bits DDR3-1066 SO-DIMM. The TS128MSK64V1U consists of 8pcs 128Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS512MKR72V3N 4GB With 256Mx8 CL9 Description Placement The TS512MKR72V3N is a 512M x 72bits DDR3-1333 Registered DIMM. The TS512MKR72V3N consists of 18pcs 256Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits

Contextual Info: 204PIN DDR3 1333 SO-DIMM 1024MB With 128Mx8 CL9 TS128MSK64V3U Description Placement The TS128MSK64V3U is a 128M x 64bits DDR3-1333 SO-DIMM. The TS128MSK64V3U consists of 8pcs 128Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: preliminary Data Sheet Rev.0.9 15.11.2011 8192MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN08G64B3BB2SA-xxRT • 8GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11 

Contextual Info: Data Sheet Rev.1.2 26.04.2011 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64E1BG2MT-xxRT • 2GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9  module density

TS256MSK64V1N

Contextual Info: 204PIN DDR3 1066 SO-DIMM TS256MSK64V1N 2048MB With 256Mx8 CL7 Description Placement The TS256MSK64V1N is a 256M x 64bits DDR3-1066 SO-DIMM. The TS256MSK64V1N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS1GKR72V3Y 8GB With 512Mx4 CL9 Description Placement The TS1GKR72V3Y is a 1024M x 72bits DDR3-1333 Registered DIMM. The TS1GKR72V3Y consists of 36pcs 512Mx4bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits