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    DIMENSIONS--209-BUMP Search Results

    DIMENSIONS--209-BUMP Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    93135-003LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    93135-005LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    93135-004LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    RF-HDT-AJLS-G1 Texas Instruments RF-HDT-AJLS Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) Visit Texas Instruments