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    DIMENSIONS PQFP 132 Search Results

    DIMENSIONS PQFP 132 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    MC68020EH33E Rochester Electronics LLC Rochester Manufactured MC68020, Microprocessor, 132 PQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    MC68020EH16E-G Rochester Electronics LLC Rochester Manufactured MC68020, Microprocessor, 132 PQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy

    DIMENSIONS PQFP 132 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    atop

    Abstract: No abstract text available
    Text: OEM PQFP Sockets Latching Aid Latching Latch ng A Aid d Part Number Lead Count Dimensions A Sq. B Sq. C 1.02 [ 25.9 ] .40 [ 10.2 ] 4-0000-07242-000-099-000 84 1.11 [ 28.2 ] 4-0000-07243-000-099-000 100 1.21 [ 30.7 ] 1.12 [ 28.4 ] .50 [ 12.7 ] 4-0000-07244-000-099-000


    Original     		PDF 4-0000-072XX-000-099-000 TS-0697 atop

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    DIMENSIONS PQFP 132

    Abstract: MO-069 TS-0361
    Text: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package


    Original     		PDF MO-069 TS-0361-10 DIMENSIONS PQFP 132 TS-0361

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: •Convert surface mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board


    Original     		PDF 97-AQ132C -or97-AQ132C-P

    amp pga socket

    Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		PDF 97-AQ132D 97-AQ132D -or97-AQ132D-P amp pga socket DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket

    18022

    Abstract: 132 pin PGA socket
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		PDF 97-AQ132D -or97-AQ132D-P 18022 132 pin PGA socket

    mounting pad PQFP

    Abstract: No abstract text available
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		PDF 97-AQ132D -or97-AQ132D-P mounting pad PQFP

    132 pin PGA socket

    Abstract: No abstract text available
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		PDF 97-AQ132D -or97-AQ132D-P 132 pin PGA socket

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		PDF 97-AQ132D -or97-AQ132D-P

    MO-069

    Abstract: TS-0361-13 2100-7243-00-1807 2132-7244-YY-1807 2132-7244-75-1807
    Text: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package


    Original     		PDF MO-069 TS-0361-13 TS-0361-13 2100-7243-00-1807 2132-7244-YY-1807 2132-7244-75-1807

    DIMENSIONS PQFP 132

    Abstract: No abstract text available
    Text: Model 5780, 132 Pin JEDEC Test Clip, .025” Lead Pitch, .025” sq. pins on .100 Centers These new test clips provide the user with an easy means to connect instrumentation to the 132 pin fine pitch plastic PQFP chip leads. • Connects to 132 pin high density


    Original     		PDF log425) \d5780 DIMENSIONS PQFP 132

    amp pga socket

    Abstract: AMS-QQ-N-290
    Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		PDF 97-AQ132D 132-Pin 97-AQ132D-P amp pga socket AMS-QQ-N-290

    Untitled

    Abstract: No abstract text available
    Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		PDF 97-AQ132D 132-Pin C36ending 97-AQ132D-P

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    AF3 din 74

    Abstract: PQFP-128 footprint AT40K AT40K05 AT40K05LV AT40K10 AT40K10LV AT40K20 AT40K20LV AT40K40
    Text: Features • Ultra High Performance • • • • • • • • • – System Speeds to 100 MHz – Array Multipliers > 50 MHz – 10 ns Flexible SRAM – Internal Tri-state Capability in Each Cell FreeRAM – Flexible, Single/Dual Port, Synchronous/Asynchronous 10 ns SRAM


    Original     		PDF XC4000, XC5200 0896C AF3 din 74 PQFP-128 footprint AT40K AT40K05 AT40K05LV AT40K10 AT40K10LV AT40K20 AT40K20LV AT40K40

    DSP56001A

    Abstract: PB10 PB12 1147 x motorola DIMENSIONS PQFP 132 FE 132-CQFP
    Text: Pin-out and Package General Purpose I/O Pin Tables The DSP56001A signals which may be programmed as general purpose I/O are listed with their primary function in Table 18. Table 19 and Table 20 identify pins on each package in numeric order. Table 21 identifies each signal name in order while giving the pin number for each


    Original     		PDF DSP56001A B13B-01 132-pin 88-pin 789D-01 PB10 PB12 1147 x motorola DIMENSIONS PQFP 132 FE 132-CQFP

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    LC4064V

    Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
    Text: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch


    Original     		PDF 32-Pin 100-Ball 132-Ball 56-Ball 269-Ball 208-Ball 256-Ball 100-Pin 128-Pin 44-Pin LC4064V Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel
    Text: Intel386 DX PQFP MICROPROCESSOR 2.0 MECHANICAL DATA 2.1 Package Dimensions The Intel386 DX is available in a 132 lead plastic quad flat pack PQFP package. Table 2.1 and Figures 2.1-2.5 show the physical dimensions of this package. Table 2.1. Intel Case Outline Dimensions for 132 Lead Plastic Quad Flat Pack 0.025 Inch Fitch


    OCR Scan     		PDF Intel386TM Intel386 PQFP 132 PACKAGE DIMENSION intel Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel

    land pattern PQFP 132

    Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 land pattern PQFP 132 PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208

    m0-112

    Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 m0-112 land pattern PQFP 132 MO-069 tc 4049 MO-112

    831A01

    Abstract: MC68306 MC68306FC16 MC68306PV16
    Text: SECTION 9 ORDERING INFORMATION AND MECHANICAL DATA This section contains the ordering information, pin assignments, and package dimensions for the MC68306. 9.1 STANDARD ORDERING INFORMATION Package Type Frequency MHz Temperature Order Number 132-Lead Plastic Quad Flat Pack (FC Suffix)


    OCR Scan     		PDF MC68306. 132-Lead MC68306FC16 144-Lead MC68306PV16 MC68306 831A01