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    DIM100 Price and Stock

    Synapse Wireless DIM10-087-06-A

    WIRELESS LIGHTING MODULE DALI2 0
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    DigiKey DIM10-087-06-A Bulk 30 1
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    Synapse Wireless DIM10-087-00

    SNAP DIM-10 007
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    Texas Instruments TMDSDIM100CON5PK

    DIM100 CONNECTOR 5PK
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    DigiKey TMDSDIM100CON5PK Bulk 1
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    Power Integrations 1SP0635D2S1C-DIM1000NSM33-TS000

    Gate Drivers Conformal Coded PI Gate Driver Only
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    Mouser Electronics 1SP0635D2S1C-DIM1000NSM33-TS000
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    Power Integrations 1SP0635V2M1C-DIM1000NSM33-TS000

    Gate Drivers Plug-and-Play Gate Driver, SCALE-2, master, fiber optic interface with versatile link
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    Mouser Electronics 1SP0635V2M1C-DIM1000NSM33-TS000
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    Find more DIM100 price and stock on Findchips.com

    DIM100 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DIM10-087-00 Synapse Wireless RF/IF and RFID - RF Receiver, Transmitter, and Transceiver Finished Units - SNAP DIM-10 007 Original PDF
    DIM10-087-06-A Synapse Wireless WIRELESS LIGHTING MODULE DALI2 0 Original PDF

    DIM100 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Quick Start Guide SPRUGP7 – June 2009 TMS320C28343 Experimenter’s Kit Overview The C28343 Experimenter’s Kit is a quick, easy, and low-cost way to evaluate the TMS320C2834x family of devices. It consists of a DIM100 docking station and a C28343 DIM100 controlCARD. The docking


    Original     		PDF TMS320C28343 C28343 TMS320C2834x DIM100

    DIM100PHM33-F000

    Abstract: No abstract text available
    Text: DIM100PHM33-F000 DIM100PHM33-F000 Half Bridge IGBT Module DS5764-1.2 June 2008 LN26119 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability APPLICATIONS ■


    Original     		PDF DIM100PHM33-F000 DS5764-1 LN26119 DIM100PHM33-F000

    DIM100PHM33-F000

    Abstract: DIM100PHM33-F 100a diode bridge DIM100PHM33
    Text: DIM100PHM33-F000 Half Bridge IGBT Module Replaces DS5764-1.2 DS5764-2 October 2011 LN28815 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


    Original     		PDF DIM100PHM33-F000 DS5764-1 DS5764-2 LN28815) DIM100PHM33-F000 DIM100PHM33-F 100a diode bridge DIM100PHM33

    DIM1000XSM33-TS001

    Abstract: No abstract text available
    Text: DIM1000XSM33-TS001 Single Switch IGBT Module DS6126-1 October 2013 LN31016 FEATURES KEY PARAMETERS • 10.2kV Isolation  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT


    Original     		PDF DIM1000XSM33-TS001 DS6126-1 LN31016) DIM1000XSM33-TS001

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-A000 DIM100CHS17-A000 Half Bridge IGBT Module PDS5709-1.5 January 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate KEY PARAMETERS VCES typ VCE(sat) * (max) IC (max) IC(PK) 1700V 2.7V


    Original     		PDF DIM100CHS17-A000 PDS5709-1 DIM100CHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-A000 DIM100CHS17-A000 Half Bridge IGBT Module Replaces February 2004 version, issue PDS5709-1.6 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate PDS5709-2.1 June 2004 KEY PARAMETERS VCES typ


    Original     		PDF DIM100CHS17-A000 PDS5709-1 PDS5709-2 DIM100CHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-E000 DIM100CHS17-E000 Half Bridge IGBT Module PDS5728-1.0 February 2004 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses ■ 10µs Short Circuit Withstand KEY PARAMETERS VCES typ VCE(sat) (max)


    Original     		PDF DIM100CHS17-E000 PDS5728-1 DIM100CHS17-E000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-A000 DIM100CHS17-A000 Half Bridge IGBT Module PDS5709-1.6 February 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate KEY PARAMETERS VCES typ VCE(sat) * (max) IC (max) IC(PK) 1700V 2.7V


    Original     		PDF DIM100CHS17-A000 PDS5709-1 DIM100CHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM1000ECM33-TL000 IGBT Chopper Module DS6105-1 June 2013 LN30633 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT


    Original     		PDF DIM1000ECM33-TL000 DS6105-1 LN30633)

    Untitled

    Abstract: No abstract text available
    Text: DIM1000NSM33-TL000 Single Switch IGBT Module DS6109-1 June 2013 LN30637 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT


    Original     		PDF DIM1000NSM33-TL000 DS6109-1 LN30637)

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS12-A000 DIM100CHS12-A000 Half Bridge IGBT Module Replace February 2004 version, issue DS5734-1.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5734-2.1 June 2004 KEY PARAMETERS VCES typ


    Original     		PDF DIM100CHS12-A000 DS5734-1 DS5734-2 DIM100CHS12-A000

    half bridge circuit diagram

    Abstract: No abstract text available
    Text: DIM100CHS12-H000 DIM100CHS12-H000 Fast Half Bridge IGBT Module Target Infomation DS5632-1.3 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate KEY PARAMETERS VCES


    Original     		PDF DIM100CHS12-H000 DS5632-1 20kHz DIM100CHS12-H000 half bridge circuit diagram

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS12-E000 DIM100CHS12-E000 Half Bridge IGBT Module PDS5682-1.2 January 2004 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses ■ 10µs Short Circuit Withstand KEY PARAMETERS VCES typ VCE(sat) (max)


    Original     		PDF DIM100CHS12-E000 PDS5682-1 DIM100CHS12-E000

    DIM100WHS12-A000

    Abstract: dynex
    Text: DIM100WHS12-A000 DIM100WHS12-A000 Half Bridge IGBT Module Replaces February 2004 version, issue DS5735-1.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5735-2.0 May 2004 KEY PARAMETERS VCES typ


    Original     		PDF DIM100WHS12-A000 DS5735-1 DS5735-2 DIM100WHS12-A000 dynex

    Untitled

    Abstract: No abstract text available
    Text: DIM1000ECM33-TS000 IGBT Chopper Module DS6091-1 April 2013 LN30401 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  Isolated AlSiC Base with AlN Substrates


    Original     		PDF DIM1000ECM33-TS000 DS6091-1 LN30401) DIM1000ECM33-TS000

    bi-directional switches IGBT

    Abstract: DIM100PHM33-F000
    Text: DIM100PHM33-F000 DIM100PHM33-F000 Half Bridge IGBT Module PDS5764-1.1 April 2004 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability APPLICATIONS ■ High Reliability Inverters


    Original     		PDF DIM100PHM33-F000 PDS5764-1 DIM100PHM33-F000 bi-directional switches IGBT

    87630-1001

    Abstract: DIM-100 DIMM100 TMDSDIM100CON5PK DIM100 DIMM-100 876-3010
    Text: DIM100 Connector 5 Pack - DIM100CON5PK - TI Tool Folder Samples & Purchase Cart | Contact Us | TI Worldwide: United States | my.TI Login All Searches Search by Keyword GO Search by Part Number TI Home > Semiconductors > Microcontrollers > DIM100 Connector 5 Pack


    Original     		PDF DIM100 TMDSDIM100CON5PK TMDSDIM100CON5PK DIM100 TMDSDIM100CON5PK: 87630-1001 DIM-100 DIMM100 DIMM-100 876-3010

    DIM1000ECM33-TS000

    Abstract: DIM1000ECM33-TS
    Text: DIM1000ECM33-TS000 IGBT Chopper Module Replaces DS6091-2 DS6091-3 September 2014 LN31962 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max)


    Original     		PDF DIM1000ECM33-TS000 DS6091-2 DS6091-3 LN31962) DIM1000ECM33-TS000 DIM1000ECM33-TS

    DIM100

    Abstract: C28346 ADS7865 SPRUG01 DIM-100 C2000 DIM168 C2834
    Text: Quick Start Guide SPRUG01 – March 2009 Delfino C28343 controlCARD ™ Overview The Delfino C28343 controlCARD is based on the standard DIM100 controlCARD form factor and is compatible with existing C2000 controlCARD based application development boards. It is based around


    Original     		PDF SPRUG01 C28343 DIM100 C2000 179-pin TMS302C28343ZHH C28346 DIM168 ADS7865 SPRUG01 DIM-100 C2834

    Untitled

    Abstract: No abstract text available
    Text: DIM100WHS17-A000 DIM100WHS17-A000 Half Bridge IGBT Module PDS5715-1.0 Febuary 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate KEY PARAMETERS VCES typ VCE(sat) * (max) IC (max) IC(PK) 1700V 2.7V


    Original     		PDF DIM100WHS17-A000 PDS5715-1 DIM100WHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS12-A000 DIM100CHS12-A000 Half Bridge IGBT Module DS5734-1.0 Fbruary 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate KEY PARAMETERS VCES typ VCE(sat)* (max) IC (max) IC(PK) 1200V 2.2V 100A


    Original     		PDF DIM100CHS12-A000 DS5734-1 DIM100CHS12-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100WHS12-E000 DIM100WHS12-E000 Half Bridge IGBT Module PDS5710-1.1 January 2004 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses ■ 10µs Short Circuit Withstand KEY PARAMETERS VCES typ VCE(sat) (max)


    Original     		PDF DIM100WHS12-E000 PDS5710-1 DIM100WHS12-E000

    Untitled

    Abstract: No abstract text available
    Text: DIM100


    Original     		PDF DIM100

    copper heatsink

    Abstract: LM 949
    Text: DIM100WHS12-H000 DIM100WHS12-H000 Fast Half Bridge IGBT Module Target Infomation DS5650-1.0 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate APPLICATIONS ■


    Original     		PDF DIM100WHS12-H000 DS5650-1 20kHz DIM100WHS12-H000 copper heatsink LM 949