SPANSION date code format
Abstract: AM29 T0003 Am29f 405 gde 8 905 959 252
Text: Chapter 8 Die and Wafer Shipments CHAPTER 8 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Storage Conditions for Die and Wafer Carrier Designs for Singulated Die Waffle Pack Surftape and Reel Carrier Designs for Wafers Wafer Jar
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Abstract: No abstract text available
Text: CPD32X 10 Amp Schottky Rectifier Die w w w. c e n t r a l s e m i . c o m The CPD32X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods.
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CPD32X
CPD32X
CPD32X-WN:
CPD32X-WR:
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CPD31X
Abstract: No abstract text available
Text: CPD31X Schottky Rectifier Die 10 Amp, 60 Volt w w w. c e n t r a l s e m i . c o m The CPD31X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods.
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CPD31X
CPD31X
CPD31X-WN:
CPD31X-WR:
17-October
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Abstract: No abstract text available
Text: CPD34X Schottky Rectifier Die 10 Amp, 60 Volt w w w. c e n t r a l s e m i . c o m The CPD34X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods.
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CPD34X
CPD34X
CPD34X-WN:
CPD34X-WR:
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Abstract: No abstract text available
Text: CPD32X Schottky Rectifier Die 10 Amp, 40 Volt w w w. c e n t r a l s e m i . c o m The CPD32X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods.
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CPD32X
CPD32X
CPD32X-WN:
CPD32X-WR:
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AM29
Abstract: 29f800bb AMD xp
Text: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray
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Abstract: No abstract text available
Text: CPD32X Schottky Rectifier Die 10 Amp, 40 Volt w w w. c e n t r a l s e m i . c o m The CPD32X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods.
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CPD32X
CPD32X
CPD32X-WN:
CPD32X-WR:
17-October
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INSPECTION
Abstract: No abstract text available
Text: DMOS /HVCMOS Standard Product Flow Wafer Fab Assembly QC Photomasks and Substrates Saw and Visual Wafer Fabrication QC Visual Inspection 5 QA Plant Clearance Die orders only QC Finished Wafer Inspection Die Attach QC Die Attach Monitor Wafer Backside Process
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2N6659
Abstract: 2N6660 2N6661 TN0102N2 TN0104N2 TN0110N2 TN0520N2 TN0606N7 VN0106N7 VN13
Text: DMOS /HVCMOS Standard Product Flow Wafer Fab Assembly QC Photomasks and Substrates Saw and Visual Wafer Fabrication QC Visual Inspection 5 QA Plant Clearance Die orders only QC Finished Wafer Inspection Die Attach QC Die Attach Monitor Wafer Backside Process
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VN1310N2
TN0110N2
VN2206N2
TN0520N2
VN2210N2
TN0606N7
VN2222NC
TN0610N2
VP0104N7
TP0104N2
2N6659
2N6660
2N6661
TN0102N2
TN0104N2
TN0110N2
TN0520N2
TN0606N7
VN0106N7
VN13
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XC3S2
Abstract: xc3s200an
Text: 100% Material Declaration Data Sheet FTG256 XC3S200AN PK424 v1.1 April 27, 2012 Average Weight: 0.7331 g Component Substance Description CAS# or Description % of Component Use in Product Silicon Die 1 Silicon (Si) 7440-21-3 100.00 Basis Silicon Die 2 Die attach
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FTG256
XC3S200AN
PK424
XC3S2
xc3s200an
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A3232
Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Text: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN
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MAX232
Abstract: EN-4088Z SN74ABT16240 SN74ABT16240A SN74ABT16241 SN74ABT16241A 1500KV ABT16241 Hitachi EN-4088Z ABT16240A
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16240A and SN74ABT16241A, Die Revision D February 20, 1997 Abstract Texas Instruments qualified the SN74ABT16240A and SN74ABT16241A die revision D replacing die revision B. Die revision D includes an all layer change, which incorporates timing
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SN74ABT16240A
SN74ABT16241A,
SN74ABT16240A
SN74ABT16241A
SN74ABT16240
SN74ABT16241
ABT16241
ABT16241A
MAX232
EN-4088Z
1500KV
ABT16241
Hitachi EN-4088Z
ABT16240A
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ABT16541A
Abstract: SN74ABT16540 SN74ABT16540A SN74ABT16541 SN74ABT16541A abt245n ASL2B SN74ABT245 EN4088Z
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16540A and SN74ABT16541A, Die Revision D May 14, 1997 Abstract Texas Instruments qualified the SN74ABT16540A and SN74ABT16541A die revision D, replacing die revision B. Die revision D includes an all layer change and improves the
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SN74ABT16540A
SN74ABT16541A,
SN74ABT16540A
SN74ABT16541A
SN74ABT16540
SN74ABT16541
SN74ABT16541
SN74ABT16541A
ABT16541A
abt245n
ASL2B
SN74ABT245
EN4088Z
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outsourcing IBM
Abstract: avnet celestica flextronics national semiconductor CC
Text: Considerations in Converting from SMT to Die Assemblies National Semiconductor Technical Seminar Series Die Product Business Unit June 26 2003 1 Approaches, Options & Solutions • Die conversion trends and drivers • Die interconnect approaches • Device and information resources
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Ablebond 71-1
Abstract: Ablebond 71 BCT8373 SN74BCT8373 SN74BCT8373A 5247 8 pin
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74BCT8373A, Die Revision B February 7, 1996 Abstract Texas Instruments has qualified the SN74BCT8373A, Die Revision B, to replace the SN74BCT8373, no die revision. Die revision B was redesigned to conform to IEEE Standard 1149.11990 JTAG . The die and device revision are necessary to change the TDO drive state controls to
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SN74BCT8373A,
SN74BCT8373,
Ablebond 71-1
Ablebond 71
BCT8373
SN74BCT8373
SN74BCT8373A
5247 8 pin
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Ablebond
Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Text: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.
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ABT841A
Abstract: 74ABT841 SN74ABT841 SN74ABT841A
Text: TEXAS INSTRUMENTS Device Revision Notification for the SN74ABT841A, Die Revision B August 21, 1996 Abstract Texas Instruments has qualified the SN74ABT841A, Die Revision B, to replace the SN74ABT841, ‘No-Rev’ die revision. Die revision B was redesigned to improve Capacitive Discharge Model CDM
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SN74ABT841A,
SN74ABT841,
ABT841A
74ABT841
74ABT841A
ABT841A
74ABT841
SN74ABT841
SN74ABT841A
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Untitled
Abstract: No abstract text available
Text: Advance Technical Information PolarTM IGBT DIE IXGD160N30PC-66 VCES = 300 V For Plasma Display Applications Die Outline Notes: 1. Wafer Diameter: 150 mm 2. Width of all Scribe Streets: 100 µm 3. Die Thickness: 200 ± 20 µm 4. Die Size Tolerance: ± 50 µm
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IXGD160N30PC-66
22-A114-B
A0011.
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SN74FB2041A
Abstract: 84-1LMIS SN74FB2031 SN74FB2041ARC
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74FB2041A, Die Revision C January 15, 1996 Abstract Texas Instruments has qualified the SN74FB2041A, Die Revision C, to replace the SN74FB2041, Die Revision B. Die revision C was designed to improve propagation delay times. Data sheet changes are
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SN74FB2041A,
SN74FB2041,
SN74FB2041A
84-1LMIS
SN74FB2031
SN74FB2041ARC
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PIC16 example ay0438
Abstract: 30014 QCI-30014 sugar production process 85c72 PIC16 example codes QCI-30397 PIC16-17 27c64 EEPROM AY0438
Text: DIE SUPPORT Overview of Microchip Die Specifications INTRODUCTION This overview is intended to give our customers a better understanding of Microchip’s process of die usage and manufacture. This information is not intended as what is needed to manufacture die. It is highly recommended
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DS30258B-page
PIC16 example ay0438
30014
QCI-30014
sugar production process
85c72
PIC16 example codes
QCI-30397
PIC16-17
27c64 EEPROM
AY0438
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Untitled
Abstract: No abstract text available
Text: Chip Mounting and Handling of GaAs MMIC Chips CHIP DIE DOWN BONDING TECHNIQUES Die Attach The important considerations for die attach are to have low thermal resistance, strong mechanical bond over the desired temperature range, and no damage occurring to the chip
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Untitled
Abstract: No abstract text available
Text: Packaging - Handling Gallium Arsenide Die Handling Gallium Arsenide Die Gallium arsenide die have physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding
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Untitled
Abstract: No abstract text available
Text: DIE PRODUCTS B U R R -B R O W N * E 0PA2111 DIE ] Dual, Low Noise, Precision Difet OPERATIONAL AMPLIFIER DIE FEATURES DESCRIPTION • • • • • • The OPA2111 die is a high-precision monolithic Dlfet Dielectrically isolated FET operational ampli
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0PA2111
OPA2111
OPA2111
ll-STD-883,
MIL-STD-883,
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Burr Brown part marking
Abstract: OPA21 OPA2111 fet operational amplifier
Text: DIE PRODUCTS B U R R -B R O W N * OPA2111 DIE 1 Dual, Low Noise, Precision Difet OPERATIONAL AM PLIFIER DIE FEATURES DESCRIPTION • LOW NOISE: 100% TESTED The OPA2111 die is a high-precision monolithic D ifet Dielectrically isolated FET operational ampli
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OPA2111
OPA2111
Mil-STD-883,
MIL-STD-883.
Burr Brown part marking
OPA21
fet operational amplifier
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