CDP18
Abstract: CDP-1802 CDP18XX
Text: Nomenclature Guide CDP Types CDP1802 PART NUMBER CMOS LSI CDP18XX REVISION A: 1st B: 2nd A C D 3 PRODUCT ASSURANCE LEVEL X: -40°C to +85°C with Burn-In 3: Non-Compliant with MIL-STD-883 PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Metal-Seal (SBDIP) E: Dual-In-Line Plastic (PDIP)
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CDP1802
CDP18XX
MIL-STD-883
1-888-INTERSIL
CDP18
CDP-1802
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glenair connector
Abstract: he308 40m38277 unef HE30 Glenair m85049
Text: TAG Ring Backshells AS85049/30 TAG Ring Backshells ® M85049/30-10 W Glenair Connector Designator F Finish N = Electroless Nickel W = 1,000 Hour Cadmium Olive Drab Over Electroless Nickel Basic Part No. MIL-DTL-38999 Series I & II, 40M38277, PAN 6433-1, PATT 614, PATT 616,
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AS85049/30
MIL-DTL-38999
40M38277,
NFC93422
HE308
HE309
M85049/30-10
631-M85049/30-12W
M85049/30-12W
glenair connector
he308
40m38277
unef
HE30
Glenair m85049
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SKCB
Abstract: skcb 2m2-45-3-12 3m3-45-2-12 SKiiP 83 AC 12 i t 1 41046220 SKIIP "2 FOLD" SKIIP85 SKIIP DRIVER SKIIP GD semikron skiip 20
Text: Modules – Explanations – SKiiP SKiiP gate driver designator D: gate driver Features DU: gate driver with DC-link voltage measurement and over voltage protection • SKiiP: SEMIKRON integrated intelligent Power is a power semiconductor subsystem • SKiiP integrates power semiconductor switches, heat
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th5000
2m2-45-2-12
2m2-45-3-12
2m2-45-4-12
3m3-45-2-12
3m3-45-3-12
3m3-45-4-12
4m7-40-2-12
4m7-40-3-12
4m7-40-4-12
SKCB
skcb 2m2-45-3-12
3m3-45-2-12
SKiiP 83 AC 12 i t 1
41046220
SKIIP "2 FOLD"
SKIIP85
SKIIP DRIVER
SKIIP GD
semikron skiip 20
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PDF
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vw 9a engines
Abstract: ACTS373DMSR ACTS373HMSR ACTS373KMSR ACTS373MS
Text: ACTS373MS Radiation Hardened Octal Transparent Latch, Three-State April 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • 1.25 Micron Radiation Hardened SOS CMOS • Total Dose 300K RAD Si • Single Event Upset (SEU) Immunity
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ACTS373MS
MIL-STD-1835
CDIP2-T20,
-55oC
125oC
vw 9a engines
ACTS373DMSR
ACTS373HMSR
ACTS373KMSR
ACTS373MS
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PDF
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glenair connector
Abstract: No abstract text available
Text: 39 Series 39 EMI/RFI Cable Sealing Backshells 390 F S 001 M 16 10 M 6 CONNECTOR DESIGNATORS Length: S only 1/2 inch increments: e.g. 6 = 3 inches Product Series A-F-H-L-S Connector Designator ROTATABLE COUPLING TYPE A OVERALL SHIELD TERMINATION Strain Relief Style
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y6 smd
Abstract: Y5 smd transistor smd transistor y5 y4 smd transistor Y5 smd Y6 11 y6 smd transistor 5962F9671001VRC 5962F9671001VXC ACS541HMSR
Text: ACS541MS Radiation Hardened Octal Buffer/ Line Driver Three-State January 1996 Features Pinouts • Devices QML Qualified in Accordance with MIL-PRF-38535 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • Detailed Electrical and Screening Requirements are Contained in
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ACS541MS
MIL-PRF-38535
MIL-STD-1835
CDIP2-T20,
600mm
600mm
y6 smd
Y5 smd transistor
smd transistor y5
y4 smd transistor
Y5 smd
Y6 11
y6 smd transistor
5962F9671001VRC
5962F9671001VXC
ACS541HMSR
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synergy
Abstract: 10KHECL
Text: *SYNERGY FIFO O RDERING INFORMATION S E M IC O N D U C TO R SY69 x xx xx x x ] Special Processing \ Temperature Range C = Commercial \ Package Identifier E MQ PQ X * = c = Cerquad Flatpack Metallic Quad Flatpack Plastic Quad Flatpack Other Device Type \ I/O Designator
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OCR Scan
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10KHECL
synergy
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PDF
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DWG-9111
Abstract: DWG-9110 ALLEGRO MICROSYSTEMS branding 302 DWG-9001 1402 dwg
Text: Package Drawing Designator: CA and CB Type: 5-pin module, PFF leadform 14.0±0.2 3.0±0.2 1.50±0.10 4.0±0.2 5 4 1º±2° A NNNNNNN TTT - AAA 3.5±0.2 17.5±0.2 13.00±0.10 LLLLLLL YYWW Branded Face 4.40±0.10 1 B Standard Branding Reference View 2.9±0.2
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DWG-9111,
DWG-9110)
DWG-9111
DWG-9110
ALLEGRO MICROSYSTEMS
branding 302
DWG-9001
1402 dwg
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PDF
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ALLEGRO MICROSYSTEMS
Abstract: MO-153-AB
Text: Package Drawing Designator: LD Type: 38-pin, 0.50 mm pin pitch TSSOP 9.70±0.10 8º 0º 38 0.20 0.09 4.40±0.10 NNNNNNNNNNNNN YYWW LLLLLLLLLLLLL 6.40±0.20 0.60 ±0.15 A 1.00 REF 1 B 1 2 0.25 BSC Branded Face 38X SEATING PLANE 0.10 C 0.27 0.17 0.50 BSC 1.20 MAX
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38-pin,
MO-153
ALLEGRO MICROSYSTEMS
MO-153-AB
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mp 1448
Abstract: No abstract text available
Text: PACKAGE OUTLINES PLASTIC POWER-TAB SIP PACKAGE DESIGNATOR W Dimensions in Inches controlling dimensions 0.180 1.260 1.240 0.020 MAX 0.775 0.765 0.245 0.225 0.055 0.045 0.155 ø 0.145 0.140 0.570 0.540 0.365 INDEX AREA 0.065 0.035 0.135 0.100 0.290 MIN 1
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MP-007
MP-004
TS-001)
MP-005
mp 1448
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PDF
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MONOLITHIC MEMORIES
Abstract: MMI Monolithic Memories, Inc. 341-0558-C
Text: Military PAL Devices MMI PACKAGE DESIGNATOR J/JS W L PACKAGE TYPE CERAMIC DIP CERAMIC FLATPACK CERAMIC LEADLESS CHIP CARRIER Product Introduction Procedures All new products released by the Military Products Division must successfully pass Mil-Std-883 Class B processing prior to new
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Mil-Std-883
productL-STD-883
MONOLITHIC MEMORIES
MMI Monolithic Memories, Inc. 341-0558-C
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Untitled
Abstract: No abstract text available
Text: Microminiature Circular - .050" Contact Spacing MIKQP How to Order - M IKQP A ll Plastic MIK Q P 9 11 P H * J SERIES DESIGNATOR-M IK - M icrom iniature Circular CLASS -Q - Quick Release Push Pull
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OCR Scan
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PDF
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Untitled
Abstract: No abstract text available
Text: D O F - 0 - 2 1 2 E < 0 3 .0 8 } k & k-ñ B REV. 2 NOTE 1 .MOLD 8.S ep.2003 CAVITY 2. COMPANY 4. CONTACT DESIGNATOR NO. A P P E A R S TIP 2. IS M.TANAKA S.HARA IN IN AT RAISED RAISED RAISED PLATED IN H APPD. * & A PPD . LETTERS. LETTERS. LETTERS. POINT OF
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OCR Scan
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IL-A05-7P-S3L2
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PDF
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Untitled
Abstract: No abstract text available
Text: Device Orientation Vishay Siliconix TR Device Orientation for TO-252 DEVICE ORIENTATION PACKAGE METHOD TO-252 TR Note • The TR designator is not inflected in the part number or ordering information. User Direction of Feed Revision control of this drawing is maintained through Document Control.
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O-252
O-252
X11-0006,
14-Febr-11
PACK-0007-26
14-Feb-11
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MIL-PRF-38535
Abstract: MIL-PRF-38535 LEAD FINISH MILPRF38535 MILPRF-38535 5962
Text: Nomenclature Guide 5962 SMD/DSCC - QML Types 5962 - XXXXX 0X X X X SMD ID NUMBER Does Not Change (ID Not Applicable in Earlier DSCC Items) TOTAL DOSE DESIGNATOR -: Non-Rad Hard M: 3 krad (Si) D: 10 krad (Si) R: 100 krad (Si) F: 300 krad (Si) DRAWING NUMBER
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MIL-PRF-38535)
MIL-STD-883)
MIL-STD-1835,
MIL-PRF-38535
MIL-PRF-38535
MIL-PRF-38535 LEAD FINISH
MILPRF38535
MILPRF-38535
5962
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COILTRONICS 407 241-7876
Abstract: OS-CON 10SA220K 10SA220K C9-C14 alco alco switch sanyo OS-CON SA 4435D DIFS4 SW-DIP-4
Text: SÌ9140DB T em ic S e m i c o n d u c t o r s Bill of Material Part Used Designators Part Type Case Size 1 3 0.1 nF C 7, CIO , C l l 0805 2 1 1.5 LI Inductor 3 1 1 nF/25 V C eram ic C 12 1206 4 1 4.7 k R 11 0805 5 1 4 .99 k. 1% R2 0805 6 1 5.6 pF C8 0805 7
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9140DB
nF/25
nF/10V
40-Pin
Si4410DY
Si9160
Si9160DB
07-Feb-97
AES473S
COILTRONICS 407 241-7876
OS-CON 10SA220K
10SA220K
C9-C14
alco
alco switch
sanyo OS-CON SA
4435D
DIFS4
SW-DIP-4
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PDF
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banana jack footprint
Abstract: A26578-ND MCR03EZPJ000 NC7SZ125M5X 160-1183-1-ND 300-8571-1-ND yc248 MCR03EZPJ331 111-0702-001-ND SMA-13
Text: Bill of Materials Project: 600057.PrjPCB Variant: Standard Build Revision: B SD356EVK Evaluation Board Creation Date: 9/5/2008 11:20:27 AM Print Date: 08-Sep-08 10:49:57 AM Item Designator Manufacturer Manufacturer Part Number Distributor Distributor Part Number
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SD356EVK
08-Sep-08
111-0702-001-ND
111-0703-001-ND
C3216X7R1C475K
ECJ-0EB1A105M
445-1385-2-ND
PCC2364CT-ND
2205k-ND
LMS4684LD
banana jack footprint
A26578-ND
MCR03EZPJ000
NC7SZ125M5X
160-1183-1-ND
300-8571-1-ND
yc248
MCR03EZPJ331
111-0702-001-ND
SMA-13
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BO27
Abstract: 5962F9671701VRC 5962F9671701VXC ACTS240HMSR ACTS240MS
Text: ACTS240MS S E M I C O N D U C T O R High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State January 1996 Features Pinouts • Devices QML Qualified in Accordance with MIL-PRF-38535 20 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR CDIP2-T20,
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ACTS240MS
MIL-PRF-38535
MIL-STD-1835
CDIP2-T20,
05A/cm2
BO27
5962F9671701VRC
5962F9671701VXC
ACTS240HMSR
ACTS240MS
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PDF
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40M38277
Abstract: HE308 HE309 NFC93422
Text: EMI/RFI Environmental Backshells AS85049/17 EMI/RFI Environmental Backshell Glenair Connector Designator F M85049/17 10 N 03 A Length Code Omit for Standard Basic Part No. MIL-DTL-38999 Series I & II, 40M38277, PAN 6433-1, PATT 614, PATT 616, NFC93422 Series HE308 &
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AS85049/17
M85049/17
MIL-DTL-38999
40M38277,
NFC93422
HE308
HE309
40M38277
HE308
HE309
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PDF
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M85049
Abstract: 40m38277 HE308 12 HE308 HE309 NFC93422 165 906 381
Text: Crimp Ring and Banding Backshells M85049/33-2 Crimp Ring Backshell Glenair Connector Designator F M85049/33-2-10 W Finish N = Electroless Nickel W = 500 hour Cadmium Olive Drab Over Electroless Nickel Basic Part No. MIL-C-38999 Series I & II, 40M38277, PAN 6433-1,
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M85049/33-2
M85049/33-2-10
MIL-C-38999
40M38277,
NFC93422
HE308
HE309
M85049/26-2
M85049
40m38277
HE308 12
HE308
HE309
165 906 381
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PDF
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40M38277
Abstract: HE308 HE309 NFC93422 M85049 backshell
Text: EMI/RFI Environmental Backshells M85049/76 EMI/RFI Environmental Backshell Glenair Connector Designator F M85049/76-10 W 01 MIL-C-38999 Series I & II, 40M38277, PAN 6433-1, PATT 614, PATT 616, NFC93422 Series HE308 & HE309 Basic Part No. Clamp Size Shell Size
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M85049/76
M85049/76-10
MIL-C-38999
40M38277,
NFC93422
HE308
HE309
40M38277
HE308
HE309
M85049 backshell
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PDF
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D-Subminiature Connectors
Abstract: Kycon db15
Text: D-SUBMINIATURE CONNECTORS K85R1X / K85R2X Series KYCON RoHS Click here for more information Mounting Options * *Metric Jack Screws also available. No Designator - No Mounting Brackets O- Mounting Brackets with .120" Dia. Non-Threaded Mounting Holes and Riveted Threaded Inserts
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K85R1X
K85R2X
K85R1X/K85R2X
JS-10
1-888-KYCON-22
1-888-KYCON-22
D-Subminiature Connectors
Kycon db15
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PDF
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Untitled
Abstract: No abstract text available
Text: AVX Tantalum Division Biddeford Surface Mount Military/Aerospace Products PART NUMBERING, TEST & PACKAGING OPTIONS Part Numbering: AVX part numbers have 19 character fields. Standard characters are used to denote AVX series, case size, capacitance code, capacitance tolerance, voltage code and standard / Low ESR designator.
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TR/13
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Untitled
Abstract: No abstract text available
Text: Composite Backshells 319-136 Composite EMI/RFI Shield Sock with Shrink Boot Porch and Self-Locking Rotatable Coupling CONNECTOR DESIGNATOR: A A MIL-DTL-5015, -26482 Series II, and -83723 Series I and III F H MIL-DTL-38999 Series I, II ROTATABLE COUPLING STANDARD PROFILE
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MIL-DTL-5015,
MIL-DTL-38999
34awg
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