k4b2g1646q
Abstract: ddr3 2133 K4B2G1646Q-BCK0 K4B2G1646Q-BCMA
Text: Rev. 1.03, Mar. 2014 K4B2G1646Q 2Gb Q-die DDR3 SDRAM Only x16 96FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4B2G1646Q
96FBGA
k4b2g1646q
ddr3 2133
K4B2G1646Q-BCK0
K4B2G1646Q-BCMA
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IS46TR
Abstract: IS43TR82560A DDR3 DRAM 2GB 128Mx16 96BALL FBGA "2Gb DDR3 SDRAM"
Text: IS43/46TR16128A/AL, IS43/46TR82560A/AL 256Mx8, 128Mx16 2Gb DDR3 SDRAM ADVANCED INFORMATION MAY 2012 FEATURES • Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V Low Voltage L : VDD and VDDQ = 1.35V + 0.1V, -0.067V
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IS43/46TR16128A/AL,
IS43/46TR82560A/AL
256Mx8,
128Mx16
cycles/64
cycles/32
60A/AL
78-ball
IS46TR
IS43TR82560A
DDR3 DRAM 2GB 128Mx16 96BALL FBGA
"2Gb DDR3 SDRAM"
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Untitled
Abstract: No abstract text available
Text: Nanya Technology Corp. DDR3 L 4Gb SDRAM NT5CB(C)512M8CN / NT5CB(C)256M16CP NT5CB(C)512M8CN / NT5CB(C)256M16CP Commercial, Industrial and Automotive DDR3(L) 4Gb SDRAM Features Signal Integrity JEDEC DDR3 Compliant - Configurable DS for system compatibility
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512M8CN
256M16CP
DDR3L-1866
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NT5CB256
Abstract: NT5CC256M16CP-DI NT5CB256M16 NT5CB256m NT5CB512M8CN-DI NT5CB256M16CP-DI NT5CC512M8CN-DI NT5CC512M8CN-DII NT5CB256M16CP-EK NT5CC512M8
Text: 4Gb DDR3 SDRAM C-Die NT5CB512M8CN / NT5CB256M16CP NT5CC512M8CN / NT5CC256M16CP CAS Latency Frequency -DI/DII* -EK* -FL* DDR3/L-1600-CL11 DDR3-1866-CL13 DDR3-2133-CL14 Min. Min. Speed Bins Units tCK Parameter Max. Max. Min. Max. Avg Clock Frequency 300 800
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NT5CB512M8CN
NT5CB256M16CP
NT5CC512M8CN
NT5CC256M16CP
DDR3/L-1600-CL11
DDR3-1866-CL13
DDR3-2133-CL14
NT5CB256
NT5CC256M16CP-DI
NT5CB256M16
NT5CB256m
NT5CB512M8CN-DI
NT5CB256M16CP-DI
NT5CC512M8CN-DI
NT5CC512M8CN-DII
NT5CB256M16CP-EK
NT5CC512M8
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MT41K256M8DA
Abstract: MT41K256M8DA-125 MT41K MT41K256M8 mt41k256m8da-125-k 96-Ball MT41K256M8DA125K
Text: Preliminary‡ 2Gb: x4, x8, x16 Automotive DDR3 SDRAM Features Automotive DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 banks MT41J256M8 – 32 Meg x 8 x 8 banks MT41J128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • •
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MT41J512M4
MT41J256M8
MT41J128M16
09005aef84bd8f53
MT41K256M8DA
MT41K256M8DA-125
MT41K
MT41K256M8
mt41k256m8da-125-k
96-Ball
MT41K256M8DA125K
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K4B4G0846C
Abstract: K4B4G0446C K4B4G0846C-BCMA K4B4G0446C-BCK0 DDR3-1866
Text: Rev. 1.0, Apr. 2012 K4B4G0446C K4B4G0846C 4Gb C-die DDR3 SDRAM 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4B4G0446C
K4B4G0846C
78FBGA
K4B4G0846C
K4B4G0846C-BCMA
K4B4G0446C-BCK0
DDR3-1866
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K4B2G0846D
Abstract: K4B2G0846D-HCK0 k4b2g0846 K4B2G0846D-HCMA K4B2G0446D K4B2G0446D-HCH9
Text: Rev. 1.1, Sep. 2010 K4B2G0446D K4B2G0846D 2Gb D-die DDR3 SDRAM 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4B2G0446D
K4B2G0846D
78FBGA
K4B2G0846D
K4B2G0846D-HCK0
k4b2g0846
K4B2G0846D-HCMA
K4B2G0446D-HCH9
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Untitled
Abstract: No abstract text available
Text: Rev. 1.01, Dec. 2010 M471B2873GB0 M471B5673GB0 204pin Unbuffered SODIMM based on 1Gb G-die 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
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M471B2873GB0
M471B5673GB0
204pin
78FBGA
K4B1G0846G
128Mbx8
256Mx64
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MT9JSF25672AZ-2G1
Abstract: micron ddr3 2133 MT4J128M8
Text: 1GB, 2GB x72, ECC, SR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT9JSF12872AZ – 1GB MT9JSF25672AZ – 2GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C D1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, unbuffered dual in-line memory module
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240-Pin
MT9JSF12872AZ
MT9JSF25672AZ
240-pin,
PC3-17000,
PC3-14900,
PC3-12800,
PC3-10600,
PC3-8500,
PC3-6400
MT9JSF25672AZ-2G1
micron ddr3 2133
MT4J128M8
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hynix ddr3
Abstract: ddr3 2133 DDR3-2133 DDR3-1333 DDR3-1866 780max
Text: DDR3 Device Operation DDR3 SDRAM Device Operation 1 DDR3 Device Operation Contents 1. Functional Description 1.1 Simplified State Diagram 1.2 Basic Functionality 1.3 RESET and Initialization Procedure 1.3.1 Power-up Initialization Sequence 1.3.2 Reset Initialization with Stable Power
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Untitled
Abstract: No abstract text available
Text: IS43/46TR16640B, IS43/46TR16640BL IS43/46TR81280B, IS43/46TR81280BL 128MX8, 64MX16 1Gb DDR3 SDRAM NOVEMBER 2014 FEATURES • Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V Low Voltage L : VDD and VDDQ = 1.35V + 0.1V, -0.067V Refresh Interval: 7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
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IS43/46TR16640B,
IS43/46TR16640BL
IS43/46TR81280B,
IS43/46TR81280BL
128MX8,
64MX16
cycles/64
cycles/32
3TR81280BL
-125JBL
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Untitled
Abstract: No abstract text available
Text: ‘H’ Part number Last Updated: May. 2012 H 5 T Q XX X X X X X - XX X 1 2 3 4 56 7 8 9 10 11 12 13 14 HYNI X MEMORY OPERATI NG TEMPERATURE & POWER CONSUMPTI ON PRODUCT FAMI LY 5 : DRAM C : Commercial Temp1 & Normal Power L : Commercial Temp1) & Low Power
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DDR3-2133
DDR3-1866
DDR3-1600
DDR3-1333
DDR3-1066
DDR3-800
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Untitled
Abstract: No abstract text available
Text: 4Gb DDR3 SDRAM 4Gb DDR3 SDRAM Lead-Free&Halogen-Free RoHS Compliant H5TQ4G43AFR-xxC H5TQ4G83AFR-xxC H5TQ4G63AFR-xxC * SK hynix reserves the right to change products or specifications without notice. Rev. 1.0 / Apr. 2013 1 Revision History Revision No. History
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H5TQ4G43AFR-xxC
H5TQ4G83AFR-xxC
H5TQ4G63AFR-xxC
H5TQ4G43AFR-xxC,
H5TQ4G83AFR-xxC
H5TQ4G63AFR-xxC
96Ball
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h5tq2g63bfr
Abstract: No abstract text available
Text: 2Gb DDR3 SDRAM 2Gb DDR3 SDRAM Lead-Free&Halogen-Free RoHS Compliant H5TQ2G83BFR-xxC H5TQ2G83BFR-xxI H5TQ2G83BFR-xxL H5TQ2G83BFR-xxJ H5TQ2G63BFR-xxC H5TQ2G63BFR-xxI H5TQ2G63BFR-xxL H5TQ2G63BFR-xxJ * Hynix Semiconductor reserves the right to change products or specifications without notice.
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H5TQ2G83BFR-xxC
H5TQ2G83BFR-xxI
H5TQ2G83BFR-xxL
H5TQ2G83BFR-xxJ
H5TQ2G63BFR-xxC
H5TQ2G63BFR-xxI
H5TQ2G63BFR-xxL
H5TQ2G63BFR-xxJ
96Ball
h5tq2g63bfr
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M471B5173
Abstract: No abstract text available
Text: Rev. 1.0, Apr. 2012 M471B5173CB0 M471B1G73CB0 204pin Unbuffered SODIMM based on 4Gb C-die 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
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M471B5173CB0
M471B1G73CB0
204pin
78FBGA
estoppel512M
K4B4G0846C
512Mx8
1Gx64
M471B5173
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Untitled
Abstract: No abstract text available
Text: Rev. 1.01, Mar. 2012 K4B2G0446E K4B2G0846E 2Gb E-die DDR3 SDRAM 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4B2G0446E
K4B2G0846E
78FBGA
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Untitled
Abstract: No abstract text available
Text: IS43/46TR16256A, IS43/46TR16256AL, IS43/46TR85120A, IS43/46TR85120AL 512Mx8, 256Mx16 4Gb DDR3 SDRAM ADVANCED INFORMATION DECEMBER 2012 FEATURES • Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V • Low Voltage L : VDD and VDDQ = 1.35V + 0.1V, -0.067V •
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IS43/46TR16256A,
IS43/46TR16256AL,
IS43/46TR85120A,
IS43/46TR85120AL
512Mx8,
256Mx16
cycles/64
cycles/32
IS46TR85120AL
-15HBLA2
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Untitled
Abstract: No abstract text available
Text: 1Gb DDR3 SDRAM 1Gb DDR3 SDRAM Lead-Free&Halogen-Free RoHS Compliant H5TQ1G83DFR-xxC H5TQ1G83DFR-xxI H5TQ1G63DFR-xxC H5TQ1G63DFR-xxI *Hynix Semiconductor reserves the right to change products or specifications without notice Rev. 1.5 /Dec. 2010 1 Revision History
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H5TQ1G83DFR-xxC
H5TQ1G83DFR-xxI
H5TQ1G63DFR-xxC
H5TQ1G63DFR-xxI
DDR3-800
DDR3-1600)
96Ball
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H5TQ1G63DFR
Abstract: H5TQ1G83DFR
Text: 1Gb DDR3 SDRAM 1Gb DDR3 SDRAM Lead-Free&Halogen-Free RoHS Compliant H5TQ1G83DFR-xxC H5TQ1G83DFR-xxI H5TQ1G83DFR-xxL H5TQ1G83DFR-xxJ H5TQ1G63DFR-xxC H5TQ1G63DFR-xxI H5TQ1G63DFR-xxL H5TQ1G63DFR-xxJ *Hynix Semiconductor reserves the right to change products or specifications without notice
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H5TQ1G83DFR-xxC
H5TQ1G83DFR-xxI
H5TQ1G83DFR-xxL
H5TQ1G83DFR-xxJ
H5TQ1G63DFR-xxC
H5TQ1G63DFR-xxI
H5TQ1G63DFR-xxL
H5TQ1G63DFR-xxJ
96Ball
H5TQ1G63DFR
H5TQ1G83DFR
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512mb 96 ball
Abstract: H5TQ1G63DFR A1073 h5tq1g83 H5TQ1G63DF
Text: 1Gb DDR3 SDRAM 1Gb DDR3 SDRAM Lead-Free&Halogen-Free RoHS Compliant H5TQ1G83DFR-xxC H5TQ1G83DFR-xxI H5TQ1G63DFR-xxC H5TQ1G63DFR-xxI *Hynix Semiconductor reserves the right to change products or specifications without notice Rev. 1.3 /Dec. 2010 1 Revision History
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H5TQ1G83DFR-xxC
H5TQ1G83DFR-xxI
H5TQ1G63DFR-xxC
H5TQ1G63DFR-xxI
DDR3-800
DDR3-1600)
96Ball
512mb 96 ball
H5TQ1G63DFR
A1073
h5tq1g83
H5TQ1G63DF
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NT5CB256M16bP-DI
Abstract: NT5CB256M16 NT5CC512M8BN NT5CB512M8BN-CGI NT5CB512M8BN-DI NT5CB256M16BP-DII NT5CB256M16B T14C NT5CC512M8 NT5CC256M16BP
Text: NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP Speed Bins -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Units tCK Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Clock Frequency
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NT5CB512M8BN
NT5CB256M16BP
NT5CC512M8BN
NT5CC256M16BP
DDR3/L-1066-CL7
DDR3/L-1333-CL9
DDR3/L-1600-CL11
DDR3-1866-CL12
DDR3-2133-CL13
NT5CB256M16bP-DI
NT5CB256M16
NT5CB512M8BN-CGI
NT5CB512M8BN-DI
NT5CB256M16BP-DII
NT5CB256M16B
T14C
NT5CC512M8
NT5CC256M16BP
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NT5CB64M16DP
Abstract: nt5cb64m16 DDR3-2133-CL13 DDR3 pin out NT5CB64M16D NT5CB64m
Text: NT5CB128M8DN/NT5CB64M16DP NT5CC128M8DN/NT5CC64M16DP 1Gb DDR3 D-die SDRAM Feature Table 1: CAS Latency Frequency Speed Bins Parameter -BE* -CF/CFI* -DH/DHI* -EI* -FK* DDR3/L-1066-CL7 (DDR3/L-1333-CL8) (DDR3/L-1600-CL10) (DDR3-1866-CL11) (DDR3-2133-CL13) Units
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NT5CB128M8DN/NT5CB64M16DP
NT5CC128M8DN/NT5CC64M16DP
DDR3/L-1066-CL7)
DDR3/L-1333-CL8)
DDR3/L-1600-CL10)
DDR3-1866-CL11)
NT5CB64M16DP
nt5cb64m16
DDR3-2133-CL13
DDR3 pin out
NT5CB64M16D
NT5CB64m
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NT5CC256
Abstract: NT5CB256M16 512M8CN NT5CC256M16
Text: Nanya Technology Corp. DDR3 L 4Gb SDRAM NT5CB(C)512M8CN / NT5CB(C)256M16CP NT5CB(C)512M8CN / NT5CB(C)256M16CP Commercial, Industrial and Automotive DDR3(L) 4Gb SDRAM Features Signal Integrity JEDEC DDR3 Compliant - Configurable DS for system compatibility
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512M8CN
256M16CP
DDR3L-1866
NT5CC256
NT5CB256M16
NT5CC256M16
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Untitled
Abstract: No abstract text available
Text: 2Gb DDR3 L SDRAM F-Die NT5CB256M8FN / NT5CB128M16FP NT5CC256M8FN / NT5CC128M16FP Options Features Differential clock input (CK, ) Speeds Differential bidirectional data strobe DDR3 - 2133 2,3 TDQS and /TDQS pair for X8 DDR3 - 1866
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NT5CB256M8FN
NT5CB128M16FP
NT5CC256M8FN
NT5CC128M16FP
P147-150,
NT5CC128M16FP-DIA
NT5CC128M16FP-DIH
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