DDR3 DIMM CONNECTOR Search Results

DDR3 DIMM 240 pinout

Abstract: DDR3 slot 240 pinout DDR3 DIMM pinout DDR3 DIMM footprint DDR3 DIMM DDR3 impedance N4834A eye-fi "Touch DISPLAY" A13-B13
Contextual Info: DDR3 DIMM Probing For Use With the 16900 Series Logic Analyzer Data Sheet Features Agilent offers a wide range of probing • Quick, easy connection between the DIMM connector and Agilent logic analyzers with the interposer or midbus probe solution for DDR3 DIMM measurement. • Compatible with all 240-pin DDR3 SDRAM DIMMs

K4B2G0846

Contextual Info: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

DDR3 DIMM

Abstract: 200Pos INNER CARTON LABEL
Contextual Info: 107-68838 Packaging Specification 29May09 Rev A DDR3 DIMM ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of DDR3 DIMM ASSY. 订定 DDR3 DIMM ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product

Contextual Info: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 1024MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN01G64D2BG1SA-xxRT • 1GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: 240PIN DDR3 1333 Unbuffered DIMM JM1333KLN-8GK 8GB Kit With 256Mx8 CL9 Description Placement The JM1333KLN-8GK, a dual channel kit, consists of 2 pcs 4GB DDR3 SDRAM module. The 4GB module is a 512M x 64bits DDR3-1333 Unbuffered DIMM. The 4GB module consists of 16pcs 256Mx8 bits DDR3 SDRAMs in

GS-14-899

Abstract: MO-269 DDR3 memory DDR3 sodimm socket DDR3 rDIMM DDR3 pcb design GS-12-486 ddr3 dimm connector sc007
Contextual Info: BOARD-TO-BOARD CONNECTORS FCÎ, DDR3 MEMORY MODULE SOCKETS DESCRIPTION Memory module sockets from FCI are designed to accept most industry standard memory types DDR, DDR2, DDR3 and form factors such as DIMM, SO-DIMM or VLP DIMM. The sockets allow convenient memory

H5TQ2G

Contextual Info: 240pin DDR3 SDRAM Registered DIMM DDR3 SDRAM Registered DIMM Based on 2Gb B-die HMT325R7BFR8C HMT351R7BFR8C HMT351R7BFR4C HMT31GR7BFR8C HMT31GR7BFR4C HMT42GR7BMR4C *Hynix Semiconductor reserves the right to change products or specifications without notice.

H5TQ2G83BFR

Contextual Info: 240pin DDR3 SDRAM Registered DIMM DDR3 SDRAM Registered DIMM Based on 2Gb B-die HMT325R7BFR8C HMT351R7BFR8C HMT351R7BFR4C HMT31GR7BFR8C HMT31GR7BFR4C HMT42GR7BMR4C *Hynix Semiconductor reserves the right to change products or specifications without notice.

Contextual Info: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3UL Description Placement The TS256MKR72V3UL is a 256M x 72bits DDR3-1333 VLP Registered DIMM. The TS256MKR72V3UL consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and

H5TQ2G83

Abstract: H5TQ4G43 H5TQ2G HMT35 HMT351R7BFR4C H5TQ2G83BFR H5TQ4G HMT31GR HMT325R7BFR8C H5TQ2G43BFR
Contextual Info: 240pin DDR3 SDRAM Registered DIMM DDR3 SDRAM Registered DIMM Based on 2Gb B-die HMT325R7BFR8C HMT351R7BFR8C HMT351R7BFR4C HMT31GR7BFR8C HMT31GR7BFR4C HMT42GR7BMR4C *Hynix Semiconductor reserves the right to change products or specifications without notice.

DDR3 DIMM 240 pinout

Contextual Info: M2Y2G64CB8HC5N / M2Y2G64CB8HC9N 2GB: 256M x 64 Unbuffered DDR3 SDRAM DIMM 240pin Unbuffered DDR3 SDRAM MODULE Based on 128Mx8 DDR3 SDRAM C Die Features • Performance: Speed Sort DIMM  Latency fCK Clock Frequency PC3-8500 PC3-10600 -BE -CG 7 9 533

Contextual Info: 204PIN DDR3 1066 SO-DIMM 1024MB With 128Mx8 CL7 TS128MSK64V1U Description Placement The TS128MSK64V1U is a 128M x 64bits DDR3-1066 SO-DIMM. The TS128MSK64V1U consists of 8pcs 128Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS512MKR72V3N 4GB With 256Mx8 CL9 Description Placement The TS512MKR72V3N is a 512M x 72bits DDR3-1333 Registered DIMM. The TS512MKR72V3N consists of 18pcs 256Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits

Contextual Info: 204PIN DDR3 1333 SO-DIMM 1024MB With 128Mx8 CL9 TS128MSK64V3U Description Placement The TS128MSK64V3U is a 128M x 64bits DDR3-1333 SO-DIMM. The TS128MSK64V3U consists of 8pcs 128Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: preliminary Data Sheet Rev.0.9 15.11.2011 8192MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN08G64B3BB2SA-xxRT • 8GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11 

Contextual Info: Data Sheet Rev.1.2 26.04.2011 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64E1BG2MT-xxRT • 2GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9  module density

TS256MSK64V1N

Contextual Info: 204PIN DDR3 1066 SO-DIMM TS256MSK64V1N 2048MB With 256Mx8 CL7 Description Placement The TS256MSK64V1N is a 256M x 64bits DDR3-1066 SO-DIMM. The TS256MSK64V1N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS1GKR72V3Y 8GB With 512Mx4 CL9 Description Placement The TS1GKR72V3Y is a 1024M x 72bits DDR3-1333 Registered DIMM. The TS1GKR72V3Y consists of 36pcs 512Mx4bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3U Description Placement The TS256MKR72V3U is a 256M x 72bits DDR3-1333 Registered DIMM. The TS256MKR72V3U consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits

Contextual Info: 204PIN DDR3 1333 SO-DIMM 4096MB With 256Mx8 CL9 TS512MSK64V3N Description Placement The TS512MSK64V3N is a 512M x 64bits DDR3-1333 SO-DIMM. The TS512MSK64V3N consists of 16pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 204PIN DDR3 1333 SO-DIMM TS256MSK64V3N 2048MB With 256Mx8 CL9 Description Placement The TS256MSK64V3N is a 256M x 64bits DDR3-1333 SO-DIMM. The TS256MSK64V3N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.