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    DDR3 CONSTRAINTS Search Results

    DDR3 CONSTRAINTS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TS3DDR3812RUAR Texas Instruments 12-channel, 1:2 MUX & DEMUX switch for DDR3 applications 42-WQFN -40 to 85 Visit Texas Instruments Buy
    SSTE32882HLBAKG Renesas Electronics Corporation DDR3 Register + PLL Visit Renesas Electronics Corporation
    SSTE32882HLBAKG8 Renesas Electronics Corporation DDR3 Register + PLL Visit Renesas Electronics Corporation
    4MX0121VA13AVG Renesas Electronics Corporation Switch / Multiplexer for DDR3 / DDR4 NVDIMM Visit Renesas Electronics Corporation
    4MX0121VA13AVG8 Renesas Electronics Corporation Switch / Multiplexer for DDR3 / DDR4 NVDIMM Visit Renesas Electronics Corporation

    DDR3 CONSTRAINTS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    "DDR3 SDRAM"

    Abstract: ddr3 Designs guide DDR3 layout DDR3 layout guidelines DDR3 SDRAM Memory DDR3 timing diagram DDR3 phy Verilog DDR3 memory model ddr3 sdram stratix 4 controller DDR3 phy pin diagram
    Text: Design Guidelines for Implementing DDR3 SDRAM Interfaces in Stratix III Devices Application Note 436 February 2007, v1.0 Introduction DDR3 SDRAM is the latest generation of DDR SDRAM technology, with improved power, higher data bandwidth, and enhanced signal quality by


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		W3J512M64K-XPBX W3J512M64K-XLBX PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		W3J512M64G-XPBX W3J512M64G-XLBX PDF

    Untitled

    Abstract: No abstract text available
    Text: Aerodynamic DDR3 DIMM Sockets, Low Seating Plane LSP , Low Level Contact Resistance (LLCR), Lead-free, 1.00mm Pitch, 240 circuits The ultimate high-density memory interconnect for multi-processor server chipsets, Aerodynamic DDR3 DIMM sockets maximize air flow as well as space and


    Original     		USA/KC/2012 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		W3J512M64G-XPBX W3J512M64G-XLBX PDF

    w3j128m72

    Abstract: w3j512m72
    Text: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		W3J512M72G-XPBX W3J512M72G-XLBX 1600Mb/s w3j128m72 w3j512m72 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J512M72K-XPBX W3J512M72K-XLBX *ADVANCED 4GB – 512M x 72 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		W3J512M72K-XPBX W3J512M72K-XLBX 1600Mb/s W3J512M72K-XLBX PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		W3J512M72G-XPBX W3J512M72G-XLBX 1600Mb/s W3J512M72G-XLBX PDF

    L9D340G64BG2I15

    Abstract: DDR3-1066 DDR3-1333 L9D340G64B L9D340G64BG2
    Text: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 22mm, 13 x 21 matrix w/ 271balls


    Original     		L9D340G64BG2 271balls LDS-L9D340G6BG2-A L9D340G64BG2I15 DDR3-1066 DDR3-1333 L9D340G64B L9D340G64BG2 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 1.5V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1,333, 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count


    Original     		W3J128M72G-XLBX W3J128M72G-XPBX 1600Mb/s PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count


    Original     		W3J128M72K-XLBX W3J128M72K-XPBX 1600Mb/s PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J256M72G-XLBX W3J256M72G-XPBX ADVANCED* 2GB - 256M x 72 DDR3 SDRAM FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Package: • 375 Plastic Ball Grid Array PBGA , 20.5mm x 23.5mm  40%* Space savings vs. FBGA  Reduced part count


    Original     		W3J256M72G-XLBX W3J256M72G-XPBX W3J128M73G W3J128M72G 75mm2 75mm2 PDF

    W3J512M32G

    Abstract: M41K256M32
    Text: W3J512M32G-XBX W3J512M32G T -XB2X W3J512M36/40G(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:


    Original     		W3J512M32G-XBX W3J512M32G W3J512M36/40G x36/40 M41K256M32 PDF

    M41K256M32

    Abstract: No abstract text available
    Text: W3J512M32K-XBX W3J512M36K T -XB2X W3J512M36/40K(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:


    Original     		W3J512M32K-XBX W3J512M36K W3J512M36/40K M41K256M32 PDF

    w3j128m72

    Abstract: W3X128M72-XBI mrd 14b W3J128M72G-XPBX WEDC Cross Reference
    Text: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  30%* Space savings vs. FBGA  Package:  Reduced part count • 375 Plastic Ball Grid Array PBGA , 20.5mm x 21.5mm


    Original     		W3J128M72G-XLBX W3J128M72G-XPBX DDR3-1333 w3j128m72 W3X128M72-XBI mrd 14b W3J128M72G-XPBX WEDC Cross Reference PDF

    DDR3 pcb layout

    Abstract: DDR3 layout DDR3 DIMM 240 pin names DDR3 pcb layout motherboard DDR3 pcb design DDR3 DIMM 240 pin DIMM DDR3 signal assignments DDR3 timing diagram DDR3 DRAM layout DDR3 impedance
    Text: Challenges in implementing DDR3 memory interface on PCB systems: a methodology for interfacing DDR3 SDRAM DIMM to an FPGA Phil Murray, Altera Corporation Feras Al-Hawari, Cadence Design Systems, Inc. CP-01044-1.1 February 2008 Undoubtedly faster, larger and lower power per bit, but just how do you go about


    Original     		CP-01044-1 DDR3 pcb layout DDR3 layout DDR3 DIMM 240 pin names DDR3 pcb layout motherboard DDR3 pcb design DDR3 DIMM 240 pin DIMM DDR3 signal assignments DDR3 timing diagram DDR3 DRAM layout DDR3 impedance PDF

    W3J512M40G

    Abstract: M41K256M32
    Text: W3J512M32G-XBX W3J512M32GT-XB2X W3J512M40G T -XB3X *PRELIMINARY 2GB – 512M x 32/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count


    Original     		W3J512M32G-XBX W3J512M32GT-XB2X W3J512M40G x36/40 W3J512M36K W3J512M32K M41K256M32 PDF

    DDR3-1066

    Abstract: DDR3-1333 L9D320G32BG6 0-575V
    Text: ADVANCE INFORMATION L9D320G32BG6 2.0 Gb, DDR3, 64 M x 32 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 12mm, 10 x 13 matrix w/ 129 balls • Matrix ball pitch: 1.00mm


    Original     		L9D320G32BG6 LDS-L9D320G32BG6-A DDR3-1066 DDR3-1333 L9D320G32BG6 0-575V PDF

    M41K256M32

    Abstract: No abstract text available
    Text: W3J512M32K-XBX W3J512M32/36/40K T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count


    Original     		W3J512M32K-XBX W3J512M32/36/40K 8n-b6/40K x32-bit M41K256M32 PDF

    MT41K256M8DA

    Abstract: MT41K256M8DA-125 micron ddr3 DDR3 sdram MT41K256M8 640NS PPAP MANUAL for automotive industry
    Text: Preliminary‡ 2Gb: x4, x8, x16 Automotive DDR3 SDRAM Features Automotive DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 banks MT41J256M8 – 32 Meg x 8 x 8 banks MT41J128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • •


    Original     		MT41J512M4 MT41J256M8 MT41J128M16 09005aef84bd8f53 MT41K256M8DA MT41K256M8DA-125 micron ddr3 DDR3 sdram MT41K256M8 640NS PPAP MANUAL for automotive industry PDF

    MT41K256M8DA

    Abstract: MT41K256M8DA-125 MT41K MT41K256M8 mt41k256m8da-125-k 96-Ball MT41K256M8DA125K
    Text: Preliminary‡ 2Gb: x4, x8, x16 Automotive DDR3 SDRAM Features Automotive DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 banks MT41J256M8 – 32 Meg x 8 x 8 banks MT41J128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • •


    Original     		MT41J512M4 MT41J256M8 MT41J128M16 09005aef84bd8f53 MT41K256M8DA MT41K256M8DA-125 MT41K MT41K256M8 mt41k256m8da-125-k 96-Ball MT41K256M8DA125K PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary‡ 2Gb: x4, x8, x16 Automotive DDR3 SDRAM Features Automotive DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 banks MT41J256M8 – 32 Meg x 8 x 8 banks MT41J128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • •


    Original     		MT41J512M4 MT41J256M8 MT41J128M16 78-ball 96-ball 938ps DDR3-2133) 071ns PDF

    Untitled

    Abstract: No abstract text available
    Text: W3J512M72G-XPBX PRELIMINARY* 4GB-512M x 72 DDR3 SDRAM FEATURES  23% I/O reduction vs. FBGA  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  Address/control terminations included  Package:  Differential clock terminations included • 543 Plastic Ball Grid Array PBGA , 23 x 32mm


    Original     		W3J512M72G-XPBX 4GB-512M DDR3-1333 PDF

    b10 45g

    Abstract: srt 8n PS-AC150 DDR3-1066 DDR3-1333
    Text: ADVANCE INFORMATION L9D345G72BG5 4.5 Gb, DDR3, 64 M x 72 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 25mm x 25mm, 16 x 16 matrix w/ 255 balls • Matrix ball pitch: 1.00mm


    Original     		L9D345G72BG5 LDS-L9D345G72BG5-A b10 45g srt 8n PS-AC150 DDR3-1066 DDR3-1333 PDF