Untitled
Abstract: No abstract text available
Text: Agilent B4622B DDR/2/3/4 and LPDDR/2/3 Protocol Compliance and Analysis Toolset Data Sheet Features • Automated real-time and post process DDR/2/3/4 or LPDDR/2/3 protocol compliance measurements. • Identifies DDR/2/3/4 or LPDDR/2/3 state machine, protocol compliance, and protocol level
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B4622B
5991-1063EN
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ddr ram repair
Abstract: 32MX16 DDR repair SQ12-010 4MX16 8MX16
Text: Selecting a Die Product • Stacked die offers smallest package, lower cost, improved reliability • SDR/DDR, LP-SDR, LP-DDR, PSRAM • 1.8V, 2.5V and 3.3V • Speed and temperature grades • Technical support, assembly information, SIP/ MCP level testing
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SC2597SETRC
Abstract: No abstract text available
Text: SC2597 Low Voltage DDR Termination Regulator POWER MANAGEMENT Features Description The SC2597 is designed to meet the latest JEDEC specification for low power DDR3 and DDR4, while also supporting DDR and DDR2. The SC2597 regulates up to + 3A for VTT and up to + 40mA for VREF.
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SC2597
SC2597
SC2597SETRC
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Untitled
Abstract: No abstract text available
Text: SiT8004 for Computing Low Power Oscillator for DDR and PCI • Features, Benefits and Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Lowest power, high frequency oscillator with 6.4mA typical active current 133 MHz, 133.33MHz, 133.33333MHz output frequencies for DDR and PCI applications
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SiT8004
33MHz,
33333MHz
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ddr ram repair
Abstract: JESD79E JESD209 JESD209A DDR1 Ram Jedec JESD209 E2678A DDR 2 RAM REPAIR DSA91304A N5426A
Text: Agilent U7233A DDR1 Compliance Test Application with LPDDR and mobile-DDR Support for Infiniium Series Oscilloscopes Data Sheet Test, debug and characterize your DDR1 designs quickly and easily The Agilent Technologies U7233A DDR1 compliance test application
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U7233A
U7233A
JESD79E
JESD209A
application1571
5989-7366EN
ddr ram repair
JESD209
DDR1 Ram
Jedec JESD209
E2678A
DDR 2 RAM REPAIR
DSA91304A
N5426A
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PDF
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mobile MOTHERBOARD CIRCUIT diagram
Abstract: usb to WiFi adapter circuit diagram mobile repair tutorial I7 motherboard circuit diagram ddr3 MTBF intel motherboard repair intel motherboard circuit diagram rPGA-989 3g mobile MOTHERBOARD CIRCUIT diagram usb WiFi circuit diagram
Text: MATXM-CORE-411-WR Embedded Development Kit for MicroATX Motherboard PRELIMINARY DATA SHEET MicroATX motherboard offers significant performance and power-saving options nn rPGA989 socket Socket G with Intel Core i7 processor at 2.66 GHz nn One 2GB DDR SO-DIMM
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MATXM-CORE-411-WR
rPGA989
MATXM-CORE-411-WR)
MATXMCORE411WR-D0
mobile MOTHERBOARD CIRCUIT diagram
usb to WiFi adapter circuit diagram
mobile repair tutorial
I7 motherboard circuit diagram
ddr3 MTBF
intel motherboard repair
intel motherboard circuit diagram
rPGA-989
3g mobile MOTHERBOARD CIRCUIT diagram
usb WiFi circuit diagram
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V3100
Abstract: v5000 ATI TECHNOLOGIES AMD Athlon 64 X2 athlon x2 ATI 200M dvi dual link DVI to VGA 250M V5100
Text: FireGL V3100 • Built on ATI’s native PCI Express x16 lane architecture • Outstanding entry-level workstation performance and highest quality utilizing 4 pixel pipelines and 2 geometry engines • 128 MB DDR unified graphics memory • Dual display support via DVI
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V3100
V3100
v5000
ATI TECHNOLOGIES
AMD Athlon 64 X2
athlon x2
ATI 200M
dvi dual link
DVI to VGA
250M
V5100
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DVI to VGA
Abstract: ATI TECHNOLOGIES 2048x1536 AMD Athlon 64 X2 athlon x2 bridgeless graphics card ati OpenGL v5000 V7100
Text: FireGL V5100 • Built on ATI’s native PCI Express x16 lane architecture • Outstanding mid-range workstation performance and highest quality utilizing 12 pixel pipelines and 6 geometry engines • 128 MB DDR unified graphics memory • Dual display support via two
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V5100
DVI to VGA
ATI TECHNOLOGIES
2048x1536
AMD Athlon 64 X2
athlon x2
bridgeless
graphics card ati
OpenGL
v5000
V7100
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intel 2816 eeprom
Abstract: E2940A PAR64 E2925B E2928A E2929B E2930B practical application of parity checker "network interface cards"
Text: Agilent Technologies E2930B Exerciser and Protocol Analyzer for PCI-X 2.0 Technical Overview Key Specifications • Support for PCI-X Mode 1 and 2 Mode 2 up to 266 MT/s DDR • 64 bit data and addressing • Exerciser (option #300) with full capabilities,
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E2930B
5968-3506E
5968-1915E
5968-9577E
5968-8984E
5968-3500E
5968-9694E
5988-0448ENDE
5968-6948E
5968-6949E
intel 2816 eeprom
E2940A
PAR64
E2925B
E2928A
E2929B
E2930B
practical application of parity checker
"network interface cards"
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tag a2
Abstract: ARGB888 CY7C68013A ITU656 RGB565 RGB888 ECP2-50 RGB-16 802.3 CRC32
Text: LCD-Pro IP user manual UM0011 v1.0 – 14 July 2009 User Manual: Overview This document describes the LCD-Pro IP architecture, including the next cores: UltiEVC display controller, UltiEBB 2D graphic accelerator, UltiEMC DDR memory controller, UltiVidin video input core, UltiDMA DMA controller, UltiSPI2AHB SPI
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UM0011
DS0031)
tag a2
ARGB888
CY7C68013A
ITU656
RGB565
RGB888
ECP2-50
RGB-16
802.3 CRC32
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se97btp
Abstract: SE97B hwson8 footprint SE97 JESD22-A114 JESD22-A115 JESD78 TSE2002B1
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
se97btp
hwson8 footprint
SE97
JESD22-A114
JESD22-A115
JESD78
TSE2002B1
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RS232 LABVIEW
Abstract: lx800 modbus RS485 TPC-2106T TPC-2512 778805-90
Text: 12 in. Industrial Touch Panel Computer NI TPC-2512 NEW! • 12.1 in. SVGA TFT color LCD touch screen with 800 x 600 resolution • 500 MHz AMD LX800 processor • 512 MB DDR SDRAM memory • NEMA4/IP65-compliant front panel NI Hardware Support Communication Ports
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TPC-2512
LX800
NEMA4/IP65-compliant
10/100BASE-T)
RS232
RS232/485)
51635A-01*
51635A-01
2008-9844-161-101-D
RS232 LABVIEW
modbus RS485
TPC-2106T
778805-90
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PDF
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SE97BTP
Abstract: DDR3 memory SE97 SE97B
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
771-SE97BTP547
SE97BTP
DDR3 memory
SE97
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Untitled
Abstract: No abstract text available
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
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Untitled
Abstract: No abstract text available
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 04 — 25 November 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
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SE97
Abstract: JESD22-A114 JESD22-A115 JESD78 SE98 TS3000B1 E010H
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 04 — 25 November 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
SE97
JESD22-A114
JESD22-A115
JESD78
SE98
TS3000B1
E010H
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hwson8 footprint
Abstract: SE97 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 Diode BAW 62 SE98B
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 03 — 17 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
hwson8 footprint
SE97
1E70H
JESD22-A114
JESD22-A115
JESD78
SE98
Diode BAW 62
SE98B
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Untitled
Abstract: No abstract text available
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 02 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
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SE97
Abstract: S98A 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 SE98APW jedec MO229 INTEL nehalem CPU
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 01 — 5 March 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
SE97
S98A
1E70H
JESD22-A114
JESD22-A115
JESD78
SE98
SE98APW
jedec MO229
INTEL nehalem CPU
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VIBRATION labview
Abstract: labview fpga TFT LCD display Human Machine Interface TPC-20061 lx800 PCI-104 lcd touch RS232 LABVIEW modbus TPC200
Text: Industrial Windows CE Touch Panel Computer NI TPC-2012 • 12.1 in. SVGA TFT LCD touch screen with 800 x 600 resolution • GX3 LX800 500 MHz • 256 MB DDR SDRAM memory and 128 MB CompactFlash storage • Communication ports • 2 Hi-Speed USB • 1 Ethernet 10/100BaseT
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TPC-2012
LX800
10/100BaseT)
RS232
RS232/485
NEMA4/IP65-compliant
TPC-2012
51457A-01*
51457A-01
VIBRATION labview
labview
fpga TFT LCD display Human Machine Interface
TPC-20061
PCI-104
lcd touch
RS232 LABVIEW
modbus
TPC200
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SE97A
Abstract: SE97B DDR3 DIMM SE97 SE97PW jedec MO229 JESD22-A114 JESD22-A115 JESD78 SE97TK
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 04 — 30 January 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE97A
SE97B
DDR3 DIMM
SE97
SE97PW
jedec MO229
JESD22-A114
JESD22-A115
JESD78
SE97TK
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SE975
Abstract: INTEL nehalem CPU SE97 SE97B
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 05 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE975
INTEL nehalem CPU
SE97
SE97B
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hwson8 footprint
Abstract: SE97 SE97B JESD22-A114 JESD22-A115 JESD78 SE97PW SE97TK SE97TL DDR3 SODIMM SPD JEDEC
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 07 — 29 January 2010 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
hwson8 footprint
SE97
SE97B
JESD22-A114
JESD22-A115
JESD78
SE97PW
SE97TK
SE97TL
DDR3 SODIMM SPD JEDEC
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SE97
Abstract: SE97B JESD22-A114 JESD22-A115 JESD78 SE97PW SE97TK SE97TL ic 741 working as comparator
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 06 — 17 August 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE97
SE97B
JESD22-A114
JESD22-A115
JESD78
SE97PW
SE97TK
SE97TL
ic 741 working as comparator
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