DBI CPU Search Results

RGB to MIPI DSI LCD

Abstract: MIPI DSI specification TC3587 mipi dbi lcd panel
Contextual Info: TC358762XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358762XBG Mobile Peripheral Devices Overview TC358762XBG chip de-serializes the stream into a parallel one. The parallel output bus can be either a DPI or a DBI bus. The usage of either DPI or DBI

VGA ramdac

Abstract: AD12 AF10 AN1217 isa bus schematics 41 md easy pin
Contextual Info: $33/,&$7,21 127 Migrating from STPC Consumer-S to STPC Consumer-II 7`ÃUT@DBI@VSD@ÃÉÃEHC@SWe  2YHUYLHZ This document describes how to design for the STPC Consumer-S in a way that it can be replaced by the STPC Consumer-II once silicon becomes available.

AC14

Abstract: AC10 AC12 AD10 AD12 AE10 AE13 AF10 AN1218 STPC
Contextual Info: $33/,&$7,21 127 Prototyping with STPC Consumer-S for STPC Elite production 7`ÃUT@DBI@VSD@ÃÉÃEHC@SWe  2YHUYLHZ This document describes how to design for the STPC Elite in a way that it can be prototyped by the STPC Consumer-S. The purpose is to start a STPC Elite design prior to silicon

C27-C36

Abstract: TP5000 M1535 a1 RS200M TP4506 TP5056 TP4721 TP5860 J5027 TP4456
Contextual Info: 1 2 3 4 12 3 4 5 6 7 8 9 6 . M 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 DBI# 0:3 K2 K4 L6 K1 L3 M6 L2 M3 M4 N1 M1 N2 N4 N5 T1 R2 P3 P4 R3 T2 U1 P6 U3 T4 V2 R6 W1 T5 U4 V3 W2 Y1 AB1 1 2 3 4 4 12 4 12 B H_ADS# H_BNR# H_BPRI# L5 ADSTB0#

TP4506

Abstract: TP5000 AR803 TP6244 thermistor SCK D54 TP5056 R767 TP5310 TP6311 TP4765
Contextual Info: 1 2 HD# 0:63 1 1 3 4 N C 5 6 HA#(3:31) C D 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 1,4 29 H_REQ#(0:4) 30 31 1 32 2 33 4 35 1,4 36 DBI#(0:3) 1 38 2 39 3 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 1, 4 1 1, 4 1 4 4 1, 4

Contextual Info: 19-3349; Rev 1; 11/04 5-Output PMIC with DC-DC Core Supply for Low-Cost PDAs Applications Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 250mA ♦ Main LDO 3.3V, 500mA ♦ SD Card Output 3.3V, 500mA

Maxim PMIC

Abstract: 3525 PWM max8593
Contextual Info: 19-3349; Rev 0; 8/04 5-Output PMIC with DC-DC Core Supply for Low-Cost PDAs Applications Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 250mA ♦ Main LDO 3.3V, 500mA ♦ SD Card Output 3.3V, 500mA

Contextual Info: 19-3349; Rev 2; 4/05 5-Output PMICs with DC-DC Core Supply for Low-Cost PDAs Applications PDAs Organizers Cellular and Cordless Phones MP3 Players Handheld Devices Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 400mA

838v

Abstract: 3525 PWM 3.7v battery charger circuit diagram
Contextual Info: 19-3349; Rev 2; 4/05 5-Output PMICs with DC-DC Core Supply for Low-Cost PDAs Applications PDAs Organizers Cellular and Cordless Phones MP3 Players Handheld Devices Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 400mA

Contextual Info: ArcticLink III BX6 Solution Platform Data Sheet •••••• I2C Client Platform Highlights Serial Peripheral Interface SPI Master • CPU interface for configuring and controlling internal registers and look-up tables (LUT). NOTE: The MIPI interface can also be used instead

MIPI SCI-2

Abstract: MIPI 1 lane
Contextual Info: ArcticLink III VX3 Solution Platform Data Sheet •••••• High Definition Visual Enhancement Engine VEE HD+ and Display Power Optimizer (DPO HD+) Solution Platform Highlights High Definition Visual Enhancement Engine • VEE HD+ compensates for different viewing

M30621MCP-XXXGP

Abstract: M30622MEP-XXXFP M30622MEP M30622F8PGP M16C M30626FHPFP M30622M6P-XXXFP M30622M6P-XXXGP M30622M8P-XXXFP M30623M6P-XXXGP M30624MGP-XXXFP
Contextual Info: M16C/62 Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0210Z Rev.2.10 Nov. 07, 2003 1. Overview The M16C/62 group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,

SIM900 S2-1040S-Z1K18

Abstract: sim900 s2-1040s-z SIM900D SIM900 S2-1040S-Z0927 ME431MP SIM900 SIM900 S2-1040S-Z0912 SIM900 S2-1040S-Z093K sim5216 SIM5320E
Contextual Info: Wireless Technologies GSM/UMTS/CDMA GPS/GALILEO/GLONASS RFID Bluetooth ISM ZigBee/WiFi Antennas & accessories www.microdis.net 1 no More Wires Microdis Electronics acts as a high-tech distributor for many years, collecting experience in wireless communication devices. We offer not only the latest technology

M30622F8PGP

Abstract: M16C/62P M30622F8PFP M16C M30626FHPFP hardware manual op amp marking P3 M30622M6P-XXXFP M30622M6P-XXXGP M30622M8P-XXXFP M30622M8P-XXXGP M30623M6P-XXXGP
Contextual Info: M16C/62P Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0230Z Rev.2.30 Sep 01, 2004 1. Overview The M16C/62P Group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the highperformance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,

TC358762 De-serializer Display Bridge

Abstract: Product Brief DSI DBI RGB666
Contextual Info: Product Brief Highlights • De-serializer display bridge for connectivity of panels using legacy parallel interface to the Baseband or Application Processors with MIPI Display Serial Interface. • Solutions are based on the latest versions of industry standard MIPI

m30622

Abstract: M30624FGPFP M30622F8PGP M30620FCPFP M16C/62P M30622MHP-XXXGP M30622F8PFP M30624FGPGP M30626FHPGP REJ03B0001-0241
Contextual Info: M16C/62P Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0001-0241 Rev.2.41 Jan 10, 2006 Overview The M16C/62P Group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the high performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin, 100-pin and 128-pin

MIPI HDMI bridge

Contextual Info: ArcticLink III BX6 Solution Platform Data Sheet •••••• Platform Highlights Applications Overview Serial Peripheral Interface SPI Master The ArcticLink III BX6 solution platform is a display interface bridge device enabling the connection of a

ILI9481

Abstract: ili94
Contextual Info: MULTI-INNO TECHNOLOGY CO., LTD. LCD MODULE SPECIFICATION Model : MI0347AT-1 Revision Engineering Date Our Reference 1.0 MODULE NO.: MI0347AT-1 Ver 1.0 Table of Contents Coversheet. 1

ir530

Abstract: ir530 Mosfet C1005C0G1H470JT DBI CPU C1005X5R0J105M C3216X7R1E105K MAX8594 MAX8594EVKIT MBR0530 MAXIM label
Contextual Info: 19-3537; Rev 0; 1/05 MAX8594 Evaluation Kit The MAX8594 evaluation kit EV kit is a fully assembled and tested circuit board that evaluates the MAX8594 5output PMIC with DC-DC core supply for low-cost PDAs. The MAX8594 COR1 4MHz step-down DC-DC converter supplies a pin-selectable 1V or 1.3V output at

9ROM

Abstract: as db2 hf nu ATFB mwsj NJU6623A NJU6623AFG1 TQFP100 ZZ1SB350 ZZISEG52
Contextual Info: NJU6623A 15 «ri K'V h 7 i l h ' J 7 ^ X L C D a > h n - 7 K7^A* m s NJU6623AltJ51fj1 frayiWMtLCDTAn-jyW U t , fl 0 ttli» * » Œ a t> /W * i'Ay 7<ía* . ¡JUBA*' -YMîW/ i^U-ÍROM/ ram, * * f ->ram, i - m m m j y m v m . ftísm mx-mmztizto » » Œ a t V W m y Mn* lis

Contextual Info: 19-3089; Rev 4; 4/09 KIT ATION EVALU E L B A AVAIL High-Efficiency, Low-IQ PMICs with Dynamic Core for PDAs and Smart Phones Features The MAX1586/MAX1587 power-management ICs are optimized for devices using Intel XScale microprocessors, including Smart Phones, PDAs, internet appliances, and other portable devices requiring substantial

ON4521

Abstract: 1586C MAX1587AETL MAX1587CETL MAX1586 MAX1586AETM MAX1586B MAX1586BETM MAX1586CETM MAX1587
Contextual Info: 19-3089; Rev 3; 12/08 KIT ATION EVALU E L B AVAILA High-Efficiency, Low-IQ PMICs with Dynamic Core for PDAs and Smart Phones Features The MAX1586/MAX1587 power-management ICs are optimized for devices using Intel XScale microprocessors, including Smart Phones, PDAs, internet appliances, and other portable devices requiring substantial

MAX1586CETM

Abstract: ON4521 MAX1586 MAX1586AETM MAX1586B MAX1586BETM MAX1587 MAX1587AETL MAX1587CETL IN4527
Contextual Info: 19-3089; Rev 4; 4/09 KIT ATION EVALU E L B A AVAIL High-Efficiency, Low-IQ PMICs with Dynamic Core for PDAs and Smart Phones Features The MAX1586/MAX1587 power-management ICs are optimized for devices using Intel XScale microprocessors, including Smart Phones, PDAs, internet appliances, and other portable devices requiring substantial

1N4148

Abstract: MAX1724 MAX8588 MAX8588ETM
Contextual Info: 19-3527; Rev 0; 3/05 High-Efficiency, Low-IQ PMIC with Dynamic Core for PDAs and Smartphones Features The MAX8588 power-management IC is optimized for devices using Intel X-Scale microprocessors, including smartphones, PDAs, internet appliances, and other