DATE SHEET OF BA FOR THE YEAR 2011 Search Results

On semiconductor date Code

Abstract: motorola MARKING CODE SO-8 MOTOROLA LOT MARKINGS BRD8011/D marking code motorola ic Date Code Formats motorola traceability code 2012 Identification Traceability marking code onsemi Diode date sheet of ba for the year 2011
Contextual Info: AND8002/D ECLinPS , ECLinPS Lite™, ECLinPS Plus™, ECLinPS MAX™, and GigaComm™ Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and

On semiconductor date Code

Abstract: AND8002 AA MARKING CODE SO8 on alpha year and work week date code for semiconductor MOTOROLA LOT MARKINGS On semiconductor LQFP-52 motorola MARKING CODE SO-8 ON Semiconductor marking code
Contextual Info: AND8002/D ECLinPS , ECLinPS Lite™, ECLinPS Plus™, ECLinPS MAX™, and GigaComm™ Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and

MOTOROLA LOT MARKINGS

Abstract: On semiconductor date Code IC Lot Code Identification marking code 6L QFN tray qfn 4x4 AND8002 ase qfn unisem QFN marking code onsemi Diode on alpha year and work week
Contextual Info: AND8002/D Clock Generation and Clock and Data Marking and Ordering Information Guide http://onsemi.com Prepared by: Paul Shockman ON Semiconductor APPLICATION NOTE Introduction This application note describes the device markings and ordering information for the following ON Semiconductor

TX16D11VM2CBA

Abstract: tube APR12 TX16D11 2702-TX16D11VM2C 2702-TX16D11
Contextual Info: HITACHI KAOHSiUNG HITACHI ELECTRONICS CO.LTD P.O. BOX 26-27 2,13TH EAST ST. K.E.P.Z. KAOHSIUNG TAIWAN R.O.C. TEL: 07 821-5811(7 LINE) FAX:(07) 821-5815 FOR M ESSRS : DATE : May. 13.2008 CUSTOMER’S ACCEPTANCE SPECIFICATIONS TX16D11VM2CBA CONTENTS No. ITEM

Contextual Info: Regulations No. KG3F6688/K Total pages Page 13 1 Product Specification 3528 Package Size Type Chip LED Type Number：LNJ024X4ARA Panasonic Unified Parts Number：LNJ024X4ARA Semiconductor Company, Panasonic Corporation Established by Applied by Checked by

EDJ4208EBBG-GN-F

Abstract: EDJ4204EBBG EDJ4208EBBG-DJ-F EDJ4208EBBG ELPIDA DDR3L e1808e
Contextual Info: DATA SHEET 8GB DDR3L SDRAM SO-DIMM EBJ81UG8EBU0 1024M words x 64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization  1024M words × 64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3L SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual

Contextual Info: COVER DATA SHEET 2GB Unbuffered DDR3L SDRAM DIMM EBJ20EF8EDWA 256M words  72 bits, 1 Rank Specifications Features • Density: 2GB • Organization — 256M words  72 bits, 1 rank • Mounting 9 pieces of 2G bits DDR3L SDRAM sealed in FBGA • Package: 240-pin socket type dual in-line memory

E1689E21

Abstract: EDJ2108BCSE ebj20uf8 EBJ20UF8bcf0-dj-f Mounting 8 pieces of 2G bits DDR3 SDRAM sealed in FBGA r065 EDJ2108BCSE-DJ-F Elpida DDR3 manual EDJ2108BC
Contextual Info: DATA SHEET 2GB Unbuffered DDR3 SDRAM DIMM EBJ20UF8BCF0 256M words x 64 bits, 1 Rank Specifications Features • Density: 2GB • Organization  256M words × 64 bits, 1 rank • Mounting 8 pieces of 2G bits DDR3 SDRAM sealed in FBGA • Package: 240-pin socket type dual in line memory

Contextual Info: DATA SHEET 8GB DDR3 SDRAM SO-DIMM EBJ81UG8BAS0 1024M words x 64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization  1024M words × 64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3 SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual in

Contextual Info: Tel : Fax : email : 0044 0 118 979 1238 0044 (0)118 979 1283 info@actcrystals.com ACT HC49/U ( Standard Devices ) The ACT HC49U family is available in industry standard package and specifications. This series offers a broad range of frequencies and tolerances in both standard and industrial temperature

EDJ4208EBBG-GN-F

Abstract: EBJ40UG8EBU0-DJ-F EDJ4204EBBG EBJ40UG8EBU0 EDJ4208EBBG EDJ4208EBBG-DJ-F
Contextual Info: DATA SHEET 4GB DDR3L SDRAM SO-DIMM EBJ40UG8EBU0 512M words x 64 bits, 1 Rank Specifications Features • Density: 4GB • Organization  512M words × 64 bits, 1 rank • Mounting 8 pieces of 4G bits DDR3L SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual

Contextual Info: DATA SHEET 8GB DDR3 SDRAM SO-DIMM EBJ81UG8BAS0 1024M words x 64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization  1024M words × 64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3 SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual in

EDJ2108BCSE-DJ-F

Abstract: elpida manufacturing code DDR3 pcb layout raw card b so-dimm E1669E30 ebj20uf8 Mounting 8 pieces of 2G bits DDR3 SDRAM sealed in FBGA ELPIDA DDR3 2G Elpida DDR3 manual 204 pin so-DIMM DDR3 connector
Contextual Info: DATA SHEET 2GB DDR3 SDRAM SO-DIMM EBJ20UF8BCS0 256M words x 64 bits, 1 Rank Specifications Features • Density: 2GB • Organization  256M words × 64 bits, 1 rank • Mounting 8 pieces of 2G bits DDR3 SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual in

EBJ20UF8BDU0-GN-F

Abstract: EBJ20UF8BDU0GNF E1795E20 EBJ20UF8BDU0 edj2108bdbg ebj20uf8 Mounting 8 pieces of 2G bits DDR3 SDRAM sealed in FBGA EDJ2108BDBG-DJ-F ELPIDA ddr3 sodimm 204 DDR3 pcb layout raw card f so-dimm
Contextual Info: DATA SHEET 2GB DDR3 SDRAM SO-DIMM EBJ20UF8BDU0 256M words x 64 bits, 1 Rank Specifications Features • Density: 2GB • Organization  256M words × 64 bits, 1 rank • Mounting 8 pieces of 2G bits DDR3 SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual

EDJ4208BBBG-DJ-F

Abstract: EDJ4208BBBG-GN-F EDJ4208BBBG EDJ4204BBBG EBJ81UG8BBU0 E1800E
Contextual Info: DATA SHEET 8GB DDR3 SDRAM SO-DIMM EBJ81UG8BBU0 1024M words x 64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization  1024M words × 64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3 SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual

EDJ4208BASE-GN-F

Abstract: E1717 EBJ81UG8BAS0 EDJ4208BASE-DJ-F
Contextual Info: PRELIMINARY DATA SHEET 8GB DDR3 SDRAM SO-DIMM EBJ81UG8BAS0 1024M words x 64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization  1024M words × 64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3 SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual in

EDJ2108BCSE-DJ-F

Abstract: Elpida DDR3 manual EDJ2108BCSE-DJ-F rev C
Contextual Info: DATA SHEET 4GB Unbuffered DDR3 SDRAM DIMM EBJ41UF8BCF0 512M words x 64 bits, 2 Ranks Specifications Features • Density: 4GB • Organization  512M words × 64 bits, 2 ranks • Mounting 16 pieces of 2G bits DDR3 SDRAM sealed in FBGA • Package: 240-pin socket type dual in line memory

EDJ4208BBBG

Abstract: EDJ4208BBBG-GN-F EDJ4208BBBG-DJ-F EDJ4204BBBG EBJ40UG8BBU0
Contextual Info: DATA SHEET 4GB DDR3 SDRAM SO-DIMM EBJ40UG8BBU0 512M words x 64 bits, 1 Rank Specifications Features • Density: 4GB • Organization  512M words × 64 bits, 1 rank • Mounting 8 pieces of 4G bits DDR3 SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual

Contextual Info: OSLON SSL Ceramic package - 80° radiation pattern Lead Pb Free Product - RoHS Compliant LD CP7P Abkündigung nach OS-PD-2011-016 Obsolete acc. to OS-PD-2011-016 Besondere Merkmale • Gehäusetyp: SMT-Keramikgehäuse mit Silikonverguss und Linse • Typischer Lichtfluss: 515 mW bei 350 mA

Contextual Info: Rev : 005 Product Family Data Sheet LC006A - COB Chip on Board LED Introduction Features • 6.4 COB LED : 18.0 x 13.5 x t 6.4 (mm) · InGaN/GaN MQW LED with long-time reliability · Lead (Pd) free product - RoHS compliant Applications · Spot / Downlighting

MOA8

Abstract: Mifare MOB6 module package mifare classic 1k Contactless smart card module specification MOA8 MF1S503x MOB6 Package MIFARE Type Identification Procedure - Application note, BU-ID Document number 0184 MF1S5035DUH clrc632 antenna e purse
Contextual Info: MF1S503x MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development Rev. 3.1 — 21 February 2011 194031 Product data sheet PUBLIC 1. General description NXP Semiconductors has developed the MIFARE MF1S503x to be used in a contactless

Contextual Info: No. MLPGE11004 PRODUCT SPECIFICATION P/N: FI 212C245032-T Type: MULTILAYER FILTER Soldering: Reflow only Issue date: 14.Feb.2011 Applicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System

Contextual Info: COVER DATA SHEET 4GB Registered DDR3L SDRAM DIMM EBJ40RF4EDWA 512M words 72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words  72 bits, 1 rank • Mounting 18 pieces of 2G bits DDR3L SDRAM sealed in FBGA • Package: 240-pin socket type dual in-line memory

Contextual Info: COVER DATA SHEET 4GB Registered DDR3L SDRAM DIMM EBJ40RF4EDWD EBJ40RF4EDWP 512M words 72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words  72 bits, 1 rank • Mounting 18 pieces of 2G bits DDR3L SDRAM sealed