DAP 08 Search Results

DAP 08

Contextual Info: 44L PLCC Package & DAP Size Standardization Product Change Notice PCN0804 v1.0 June 30, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.

R6094 pmt divider circuit

Abstract: Hamamatsu r6094 741 amplifier schmatic R6094 E7718 pmt active divider circuit C7950 R5929 A7719 C7950-01
Contextual Info: HIGH VOLTAGE POWER SUPPLY SOCKET ASSEMBLY WITH WIDE BANDWIDTH AMPLIFIER DAP-TYPE PRELIMINARY DATA C7950 SERIES The C7950 series is a DAP type socket assembly designed for 28 mm (1-1/8") diameter, head-on and side-on photomultiplier tubes (PMT). The C7950

AIC331

Abstract: PD3048 TAS1020B TLV320AIC33 SLAA301 AIC33EVM TLV320AIC3x AIC33
Contextual Info: Application Report SLAA301 – July 2006 Using TDM Function to Interface Four TLV320AIC33 Codecs With a Single Host Processor Wendy Fang . DAP - Industrial Audio

ECM microphone

Abstract: electret condenser microphone preamplifier block diagram OF CONDENSER MICROPHONE two wire electret microphone AIC33 condenser microphone preamplifier from texas AIC33EVM electret condenser microphone preamplifier from texas microphone filter electret condenser mic 3 pin
Contextual Info: Application Report SLAA275 – November 2005 Using the Digital Microphone Function on TLV320AIC33 With AIC33EVM/USB-MODEVM System Wendy Fang and Mark Toth . DAP Group

DAN801

Contextual Info: DAN 801, DAP 801 200mW . power semiconductor power electronics igbt bridge rectifier diode thyristor cib rectifier ipm driver inverter converter "  Diode arrays Silicon rectifiers arrays Forward Current: 0,1 A Reverse Voltage: 80 to / V Publish Data

L2208

Contextual Info: MICRO LINEAR 25E D • bGH341A 0000331 5 ■ October 1989 7T<7 ^ Micro Linear PRELIMINARY ML2200, ML2208 Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The ML2200 and ML2208 Data Acquisition Peripherals DAP are monolithic CMOS data acquisition subsystems. These

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: ALSO AVAILABLE High Temperature High Voltage Disc Capacitors Call Factory for More Information DAP up to 220°C

RT5854

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;

capacitor 100-10L

Abstract: L2208B L2200 "100-10l" L2208
Contextual Info: October 1994 PRELIM INARY Micro Linear ML2200, ML2208 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The M L2200 and M L2208 Data Acquisition Peripherals DAP are monolithic CM O S data acquisition subsystems. These data acquisition peripherals feature an input

RT6864

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS L MECHANICAL: DAP up to 220°C Code B PEEK up to 240°C Code P Leads: Solder coated copper clad steel is standard;

TSC2301SPI

Abstract: AT91RM9200 PXA250 TSC2301
Contextual Info: Application Report SLAA187 - December 2003 TSC2301 WinCE Generic Drivers Yannick Chammings—WinCE Consultant, ADESET Inc., France ychammings@adeset.com Wendy X. Fang —Application Engineer, DAP Group, Texas Instruments, Dallas, TX, USA ABSTRACT This application report presents the basic concept and methodology to develop the TSC2301

SWT-1MS4T2B1M53QES-5

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Case Material: Actuator: Bushing: Housing: Terminal: Mechanical Life: Contact Resistance: Diallyl Phthalate DAP UL94V-0 Brass, Chrome Plated Brass, Nickel Plating Stainless Steel Brass 40,000 make and break cycles

capacitor 100-10L

Abstract: 100-10L SCX15DNC 100-10L WD SENSYM scx15dnc 100-10L AD DD118 ML2208 ML2200 ML2208CCP
Contextual Info: October 1994 PRELIM IN ARY Micro Linear ML2200, ML2208 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The M L2200 and M L2208 Data Acquisition Peripherals DAP are monolithic CM O S data acquisition subsystems. These data acquisition peripherals feature an input

RT3933

Contextual Info: HIGH TEMPERATURE 225°C HIGH VOLTAGE RADIAL LEADED CAPACITORS XHT and NPO DIELECTRIC Consult factory for requirements above 225°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;

dap 001

Abstract: DAP 011 dap 002 DAP 015 dap 010 DAP 018 DAP+015
Contextual Info: • Highly reliable dual-metal PV contact. • Available in a variety of spring thick­ nesses and platings. • For right-angle p.c. board mounting. • Two different housing materials: DAP and polyester. • Connectors made of polyester are stackable end-to-end.

DAP 08

Abstract: dap 010
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L32.5x5C 32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 09/08 3.50 5.00 28X 0.50 A B 6 6 PIN 1 INDEX AREA 24 1 3.50 5.00 3.10 Exp. DAP 8 17 4X PIN #1 INDEX AREA 32 25 0.15 32X 0.25 4

72-X

Abstract: B556 10X10D DAP 08
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L72.10x10D 72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 11/08 10.00 A 4X 8.50 PIN 1 INDEX AREA B 55 6 72 1 54 68X 0.50 Exp. DAP 6.00 Sq. 10.00 18 37 4X PIN 1 INDEX AREA 6 0.15 36 19 72X 0.24

SWT-1MS5T1B2M53QES

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C D D SPECIFICATIONS Case Material: Actuator: Bushing: Housing: Terminal: Mechanical Life: Contact Resistance: Diallyl Phthalate DAP UL94V-0 Brass, Chrome Plated Brass, Nickel Plating Stainless Steel Brass 40,000 make and break cycles

DAP 08

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L68.10x10B 68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 11/08 PIN 1 INDEX AREA 6 10.00 A 4X 8.00 B 52 PIN 1 INDEX AREA 6 68 51 1 35 17 64X 0.50 Exp. DAP 7.70 Sq. 10.00 0.15 4X 34 18 68X 0.55

DAP 08

Abstract: DAP 015 L8 Package 200a6 dap 010
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2B 8 LEAD MICRO THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE µTDFN WITH E-PAD Rev 0, 04/08 2.00 A 6 PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.60±0.050 EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050

DAP 08

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5A 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 06/08 2.50 4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6 PIN 1 INDEX AREA 4X 6 24X 0.50 A 1 3.50 Exp. DAP 3.50 0.10 M C A B 4 28X 0.25 0.15

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5C 28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 9/08 2.50 4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6 PIN 1 INDEX AREA 4X 6 24X 0.50 A 1 3.50 Exp. DAP 3.50 0.10 M C A B 4 28X 0.25

DAP 08

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE TDFN WITH E-PAD Rev 0, 04/08 2.00 6 PIN #1 INDEX AREA A B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.60±0.050 EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050