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    DAP 08 Search Results

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    DAP 08 Price and Stock

    Amphenol Communications Solutions MRDAP08CBPA00

    CIRC CBL 8POS PLUG TO PLUG 3.28'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MRDAP08CBPA00 Box 2 1
    • 1 $41.57
    • 10 $35.333
    • 100 $30.0375
    • 1000 $28.15948
    • 10000 $28.15948
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    Newark MRDAP08CBPA00 Bulk 19 1
    • 1 $24.78
    • 10 $24.78
    • 100 $24.78
    • 1000 $24.78
    • 10000 $24.78
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    Master Electronics MRDAP08CBPA00
    • 1 $46.88
    • 10 $45.48
    • 100 $31.2
    • 1000 $31.2
    • 10000 $31.2
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    Amphenol Communications Solutions MRDAP08CBPC00

    CIRC CBL 8POS PLUG TO PLUG 9.84'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MRDAP08CBPC00 Box 2 1
    • 1 $48.86
    • 10 $41.53
    • 100 $35.3068
    • 1000 $33.25836
    • 10000 $33.25836
    		Buy Now
    Newark MRDAP08CBPC00 Bulk 20 1
    • 1 $29.57
    • 10 $29.57
    • 100 $29.57
    • 1000 $29.57
    • 10000 $29.57
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    Master Electronics MRDAP08CBPC00
    • 1 $55.1
    • 10 $40.71
    • 100 $37.23
    • 1000 $37.23
    • 10000 $37.23
    		Buy Now

    OMRON Industrial Automation R7D-AP08H

    SERVO DRIVER 4.4A 200V LOAD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey R7D-AP08H Bulk 1
    • 1 $1342
    • 10 $1342
    • 100 $1342
    • 1000 $1342
    • 10000 $1342
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    Amphenol Communications Solutions MRDAP08M15000

    HARSH MRD, IP67, 8PIN, CABLE SID
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MRDAP08M15000 Box 100
    • 1 -
    • 10 -
    • 100 $9.3065
    • 1000 $9.3065
    • 10000 $9.3065
    		Buy Now
    Newark MRDAP08M15000 Bulk 100
    • 1 -
    • 10 -
    • 100 $12.2
    • 1000 $10.59
    • 10000 $10.59
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    Amphenol Communications Solutions MRDAP08CAPA00

    CIRC CBL 8POS PLUG TO WIRE 3.28'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MRDAP08CAPA00 Box 1
    • 1 $25.35
    • 10 $21.547
    • 100 $18.3167
    • 1000 $16.35268
    • 10000 $16.35268
    		Buy Now
    Newark MRDAP08CAPA00 Bulk 1
    • 1 $25.86
    • 10 $21.23
    • 100 $16.85
    • 1000 $16.22
    • 10000 $16.22
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    Find more DAP 08 price and stock on Findchips.com

    DAP 08 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DA-P-08 Morethanall Din Plug Assy Type Scan PDF

    DAP 08 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    DAP 08

    Abstract: No abstract text available
    Text: 44L PLCC Package & DAP Size Standardization Product Change Notice PCN0804 v1.0 June 30, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.


    Original     		PCN0804 JESD46-C, QR-8016 DAP 08 PDF

    R6094 pmt divider circuit

    Abstract: Hamamatsu r6094 741 amplifier schmatic R6094 E7718 pmt active divider circuit C7950 R5929 A7719 C7950-01
    Text: HIGH VOLTAGE POWER SUPPLY SOCKET ASSEMBLY WITH WIDE BANDWIDTH AMPLIFIER DAP-TYPE PRELIMINARY DATA C7950 SERIES The C7950 series is a DAP type socket assembly designed for 28 mm (1-1/8") diameter, head-on and side-on photomultiplier tubes (PMT). The C7950


    Original     		C7950 C7950 SE-171-41 TACC1034E02 R6094 pmt divider circuit Hamamatsu r6094 741 amplifier schmatic R6094 E7718 pmt active divider circuit R5929 A7719 C7950-01 PDF

    AIC331

    Abstract: PD3048 TAS1020B TLV320AIC33 SLAA301 AIC33EVM TLV320AIC3x AIC33
    Text: Application Report SLAA301 – July 2006 Using TDM Function to Interface Four TLV320AIC33 Codecs With a Single Host Processor Wendy Fang . DAP - Industrial Audio


    Original     		SLAA301 TLV320AIC33 TLV320AIC33 AIC331 PD3048 TAS1020B SLAA301 AIC33EVM TLV320AIC3x AIC33 PDF

    ECM microphone

    Abstract: electret condenser microphone preamplifier block diagram OF CONDENSER MICROPHONE two wire electret microphone AIC33 condenser microphone preamplifier from texas AIC33EVM electret condenser microphone preamplifier from texas microphone filter electret condenser mic 3 pin
    Text: Application Report SLAA275 – November 2005 Using the Digital Microphone Function on TLV320AIC33 With AIC33EVM/USB-MODEVM System Wendy Fang and Mark Toth . DAP Group


    Original     		SLAA275 TLV320AIC33 AIC33EVM/USB-MODEVM TLV320AIC33 AIC33 ECM microphone electret condenser microphone preamplifier block diagram OF CONDENSER MICROPHONE two wire electret microphone condenser microphone preamplifier from texas AIC33EVM electret condenser microphone preamplifier from texas microphone filter electret condenser mic 3 pin PDF

    DAN801

    Abstract: No abstract text available
    Text: DAN 801, DAP 801 200mW . power semiconductor power electronics igbt bridge rectifier diode thyristor cib rectifier ipm driver inverter converter "  Diode arrays Silicon rectifiers arrays Forward Current: 0,1 A Reverse Voltage: 80 to / V Publish Data


    Original     		200mW) DAN801 PDF

    L2208

    Abstract: No abstract text available
    Text: MICRO LINEAR 25E D • bGH341A 0000331 5 ■ October 1989 7T<7 ^ Micro Linear PRELIMINARY ML2200, ML2208 Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The ML2200 and ML2208 Data Acquisition Peripherals DAP are monolithic CMOS data acquisition subsystems. These


    OCR Scan     		bGH341A ML2200, ML2208 16-Bit L2200BCJ L2200BIJ L2200CC L2200CIJ L2208 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: ALSO AVAILABLE High Temperature High Voltage Disc Capacitors Call Factory for More Information DAP up to 220°C


    Original     		RT1814 RT1824 RT2225 RT2824 RT3933 RT4844 RT5854 RT6864 RT9650 RT13565 PDF

    RT5854

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;


    Original     		1000ohms RT1814 RT5854 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;


    Original     		1000ohms RT1814 PDF

    capacitor 100-10L

    Abstract: L2208B L2200 "100-10l" L2208
    Text: October 1994 PRELIM INARY Micro Linear ML2200, ML2208 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The M L2200 and M L2208 Data Acquisition Peripherals DAP are monolithic CM O S data acquisition subsystems. These data acquisition peripherals feature an input


    OCR Scan     		L2200 L2208 12-bit 16-bit L2200B L2208B L2200C, L2200D capacitor 100-10L "100-10l" PDF

    RT6864

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS L MECHANICAL: DAP up to 220°C Code B PEEK up to 240°C Code P Leads: Solder coated copper clad steel is standard;


    Original     		RT1814 RT6864 PDF

    TSC2301SPI

    Abstract: AT91RM9200 PXA250 TSC2301
    Text: Application Report SLAA187 - December 2003 TSC2301 WinCE Generic Drivers Yannick Chammings—WinCE Consultant, ADESET Inc., France ychammings@adeset.com Wendy X. Fang —Application Engineer, DAP Group, Texas Instruments, Dallas, TX, USA ABSTRACT This application report presents the basic concept and methodology to develop the TSC2301


    Original     		SLAA187 TSC2301 TSC2301 TSC2301SPI AT91RM9200 PXA250 PDF

    SWT-1MS4T2B1M53QES-5

    Abstract: No abstract text available
    Text: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Case Material: Actuator: Bushing: Housing: Terminal: Mechanical Life: Contact Resistance: Diallyl Phthalate DAP UL94V-0 Brass, Chrome Plated Brass, Nickel Plating Stainless Steel Brass 40,000 make and break cycles


    Original     		UL94V-0 100mA SWT-1MS4T2B1M53QES-5 SWT-1MS4T2B1M53QES-5 PDF

    capacitor 100-10L

    Abstract: 100-10L SCX15DNC 100-10L WD SENSYM scx15dnc 100-10L AD DD118 ML2208 ML2200 ML2208CCP
    Text: October 1994 PRELIM IN ARY Micro Linear ML2200, ML2208 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The M L2200 and M L2208 Data Acquisition Peripherals DAP are monolithic CM O S data acquisition subsystems. These data acquisition peripherals feature an input


    OCR Scan     		ML2200, ML2208 12-Bit ML2200 ML2208 16-bit ML2200B capacitor 100-10L 100-10L SCX15DNC 100-10L WD SENSYM scx15dnc 100-10L AD DD118 ML2208CCP PDF

    RT3933

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE 225°C HIGH VOLTAGE RADIAL LEADED CAPACITORS XHT and NPO DIELECTRIC Consult factory for requirements above 225°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;


    Original     		1000ohms RT3933 PDF

    dap 001

    Abstract: DAP 011 dap 002 DAP 015 dap 010 DAP 018 DAP+015
    Text: • Highly reliable dual-metal PV contact. • Available in a variety of spring thick­ nesses and platings. • For right-angle p.c. board mounting. • Two different housing materials: DAP and polyester. • Connectors made of polyester are stackable end-to-end.


    OCR Scan     		MIL-M-14, dap 001 DAP 011 dap 002 DAP 015 dap 010 DAP 018 DAP+015 PDF

    DAP 08

    Abstract: dap 010
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing L32.5x5C 32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 09/08 3.50 5.00 28X 0.50 A B 6 6 PIN 1 INDEX AREA 24 1 3.50 5.00 3.10 Exp. DAP 8 17 4X PIN #1 INDEX AREA 32 25 0.15 32X 0.25 4


    Original     		5m-1994. DAP 08 dap 010 PDF

    72-X

    Abstract: B556 10X10D DAP 08
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing L72.10x10D 72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 11/08 10.00 A 4X 8.50 PIN 1 INDEX AREA B 55 6 72 1 54 68X 0.50 Exp. DAP 6.00 Sq. 10.00 18 37 4X PIN 1 INDEX AREA 6 0.15 36 19 72X 0.24


    Original     		10x10D AMSEY14 5m-1994. 72-X B556 10X10D DAP 08 PDF

    SWT-1MS5T1B2M53QES

    Abstract: No abstract text available
    Text: 1 2 3 4 5 6 7 8 9 A A B B C C D D SPECIFICATIONS Case Material: Actuator: Bushing: Housing: Terminal: Mechanical Life: Contact Resistance: Diallyl Phthalate DAP UL94V-0 Brass, Chrome Plated Brass, Nickel Plating Stainless Steel Brass 40,000 make and break cycles


    Original     		UL94V-0 100mA SWT-1MS5T1B2M53QES SWT-1MS5T1B2M53QES PDF

    DAP 08

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing L68.10x10B 68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 11/08 PIN 1 INDEX AREA 6 10.00 A 4X 8.00 B 52 PIN 1 INDEX AREA 6 68 51 1 35 17 64X 0.50 Exp. DAP 7.70 Sq. 10.00 0.15 4X 34 18 68X 0.55


    Original     		10x10B AMSEY14 5m-1994. DAP 08 PDF

    DAP 08

    Abstract: DAP 015 L8 Package 200a6 dap 010
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2B 8 LEAD MICRO THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE µTDFN WITH E-PAD Rev 0, 04/08 2.00 A 6 PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.60±0.050 EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050


    Original     		5m-1994. DAP 08 DAP 015 L8 Package 200a6 dap 010 PDF

    DAP 08

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5A 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 06/08 2.50 4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6 PIN 1 INDEX AREA 4X 6 24X 0.50 A 1 3.50 Exp. DAP 3.50 0.10 M C A B 4 28X 0.25 0.15


    Original     		5m-1994. DAP 08 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5C 28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 9/08 2.50 4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6 PIN 1 INDEX AREA 4X 6 24X 0.50 A 1 3.50 Exp. DAP 3.50 0.10 M C A B 4 28X 0.25


    Original     		5m-1994. PDF

    DAP 08

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE TDFN WITH E-PAD Rev 0, 04/08 2.00 6 PIN #1 INDEX AREA A B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.60±0.050 EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050


    Original     		5m-1994. DAP 08 PDF