D3386 Search Results
D3386 Price and Stock
Mercury Electronic Ind Co Ltd MQF326D33-864.000-2.5--30-85XTAL OSC TCXO 864.0000MHZ LVDS |
|||||||||||
Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
![]() |
MQF326D33-864.000-2.5--30-85 |
|
Buy Now | ||||||||
Mercury Electronic Ind Co Ltd MQF326D33-864.000-1.0--40-85XTAL OSC TCXO 864.0000MHZ LVDS |
|||||||||||
Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
![]() |
MQF326D33-864.000-1.0--40-85 |
|
Buy Now | ||||||||
Mercury Electronic Ind Co Ltd MQF576D33-864.000-1.0--40-85XTAL OSC TCXO 864.0000MHZ LVDS |
|||||||||||
Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
![]() |
MQF576D33-864.000-1.0--40-85 |
|
Buy Now | ||||||||
Mercury Electronic Ind Co Ltd MQF576D33-864.000-2.5--30-85XTAL OSC TCXO 864.0000MHZ LVDS |
|||||||||||
Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
![]() |
MQF576D33-864.000-2.5--30-85 |
|
Buy Now | ||||||||
Mercury Electronic Ind Co Ltd VMQF326D33-864.000-1.0--40-85XTAL OSC VCTCXO 864.0000MHZ LVDS |
|||||||||||
Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
![]() |
VMQF326D33-864.000-1.0--40-85 |
|
Buy Now |
D3386 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
RO4403
Abstract: Rogers RO4003 rt/duroid 5880 RO4450F rogers 5880 RO3006 RO4350B rogers laminate materials RO4450B RO3210
|
Original |
6010LM, RO3003 RO3035 RO3203 RO3006 RO3206 RO3010 RO3210 RO4003C RO4350B RO4403 Rogers RO4003 rt/duroid 5880 RO4450F rogers 5880 RO3006 rogers laminate materials RO4450B RO3210 | |
Contextual Info: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible |
Original |
MP-06503 | |
Contextual Info: 54AC11194, 74AC11194 4-BIT BIDIRECTIONAL UNIVERSAL SHIFT REGISTERS TI0110— D 3386, NOVEM BER 1989 • Parallel-to-Serial, S erial-to-Parallel C onversions • L eft o r Right Shifts • Parallel S ynchronous Loading • D irect O verriding Clear 54AC11 1 9 4 . . j package |
OCR Scan |
54AC11194, 74AC11194 TI0110-- 54AC11 500-m | |
Contextual Info: Technical Data September, 2010 3M Thermally Conductive Adhesive Transfer Tapes 9882 • 9885 • 9890 Product Description 3M™ Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are designed to provide a preferential heattransfer path between heat-generating components and heat sinks or other cooling devices e.g., fans, heat spreaders or |
Original |
225-3S-06 | |
Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE |
Original |
||
D172DContextual Info: 74ACT11175 QUADRUPLE D-TYPE FLIP-FLOP WITH CLEAR S CAS 089 - D3385, D E CEM BER 1989 - REVISED APRIL 1993 • * Inputs Are TTL-Voltage Compatible ■ * Buffered Clock and Direct Clear Inputs I I I DW OR N PACKAGE TOP VIEW * Applications Include: Buffer/Storage |
OCR Scan |
74ACT11175 D3385, 0CHM443 D172D | |
Contextual Info: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible |
Original |
HT-04503 | |
Contextual Info: Bond-Ply 660B Silicone-Free Formulation,High Performance Thermally Conductive Material Features and Benefits • Designed to replace mechanical fasteners or screws • For applications that require electrical isolation • Double-sided pressure sensitive |
Original |
D3386 3100USF | |
bergquist
Abstract: astm D149 ASTM-D-3386 D149 BP100 D1002 D374 D412
|
Original |
||
Contextual Info: Bond-Ply 660B Silicone-Free Formulation, High Performance Thermally Conductive Material Features and Benefits • Designed to replace mechanical fasteners or screws • For applications that require electrical isolation • Double-sided pressure sensitive |
Original |
D3386 E1356 3100USF | |
Adhesive Tape
Abstract: PDS_BP100_1011
|
Original |
||
D3386
Abstract: 74AC11194 D338 TIO110 54AC11194 cjbn
|
OCR Scan |
54AC11194, 74AC11194 TI0110â D3386, 54ac11194 D3386 74AC11194 D338 TIO110 54AC11194 cjbn | |
comparative tracking index ceramicContextual Info: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible |
Original |
HT-07006 comparative tracking index ceramic | |
Contextual Info: 54AC11194, 74AC11194 4-BIT BIDIRECTIONAL UNIVERSAL SHIFT REGISTERS T I0 1 1 0 — 0 3 3 8 6 , N O V E M B E R 19 6 9 • Parallel-to-Serial, Serial-to-Parallel Conversions 54AC11194 . . . j p a c k a g e 74AC i 1w . . d w o r n p a c k a g e TOP VIEW • Left or Right Shifts |
OCR Scan |
54AC11194, 74AC11194 54AC11194 500-mA 300-mil | |
|