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    D2196 Search Results

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    D2196 Price and Stock

    ITT Interconnect Solutions DD21962

    DSUB DD MALE GUIDE PIN PLATE
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    DigiKey DD21962 Bag 630 1
    • 1 $60.91
    • 10 $49.654
    • 100 $42.325
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    Mouser Electronics DD21962 338
    • 1 $63.46
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    • 100 $45.44
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    Interstate Connecting Components DD21962
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    Avnet Abacus DD21962 25 Weeks 500
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    Master Electronics DD21962
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    ITT Interconnect Solutions DD21961

    DSUB GUIDE PIN PLATE FEMALE
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    DigiKey DD21961 Bag 328 1
    • 1 $104.7
    • 10 $85.364
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    Mouser Electronics DD21961 46
    • 1 $124.91
    • 10 $124.91
    • 100 $88.35
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    Newark DD21961 Bulk 3 1
    • 1 $81.55
    • 10 $77.57
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    Interstate Connecting Components DD21961
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    Avnet Abacus DD21961 14 Weeks 500
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    Master Electronics DD21961
    • 1 $119.65
    • 10 $119.65
    • 100 $86.7
    • 1000 $82.86
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    Murata Manufacturing Co Ltd LDD21967M03A-068

    RF FILTER SIGNAL 967MHZ 0805
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey LDD21967M03A-068 Reel 4,000
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    Avnet Americas LDD21967M03A-068 Reel 4,000
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    Mersen Electrical Power D219653

    Fuse-Link, NH, Ceramic, Double Indicator, Size 000 gG, 500VAC, 250VDC, 40A | Mersen D219653
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS D219653 Bulk 5 Weeks 9
    • 1 -
    • 10 $89.29
    • 100 $84.82
    • 1000 $71.43
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    ITT Interconnect Solutions DD21961 (ALTERNATE: 021961-0000)

    Connector, D-sub, Rectangular, D, D, 50, | ITT Cannon DD21961
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS DD21961 (ALTERNATE: 021961-0000) Bulk 13 Weeks 500
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    D2196 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)


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    PDF D2196 D2240 D100ersâ LBSA2000

    Untitled

    Abstract: No abstract text available
    Text: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —


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    PDF D2196 D1002 LBSA1800

    LINDNER fuses

    Abstract: 500765 lindner IEC 60947-3 ac-22b switch disconnector fuse 250A 690V nh00gg50v125 NT NH LINDNER fuses P218766 1b769 C2237
    Text: 38103-FER NH-fuses A4-engl 22.10.2003 15:50 Uhr Seite 3 NH-Fuse system Low voltage 38103-FER NH-fuses A4-engl 22.10.2003 14:01 Uhr Seite 2 NH-fuses Utilization Categories The utilization category is marked by two letters. The first letter indicates the breaking-capacity range, and the


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    PDF 38103-FER Full-rNH3AM69V355-1 NH3AM69V400-1 NH3AM69V425-1 NH3AM69V450-1 NH3AM69V500-1 NH000AM69V2-1 NH000AM69V4-1 NH000AM69V6-1 LINDNER fuses 500765 lindner IEC 60947-3 ac-22b switch disconnector fuse 250A 690V nh00gg50v125 NT NH LINDNER fuses P218766 1b769 C2237

    bergquist

    Abstract: D2196
    Text: Gap Filler 2000 Two-Part Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 2000 PROPERTY Color / Part A • Thermal conductivity: 2.0 W/m-K • Ultra-conforming, designed for fragile and low-stress applications


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction


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    PDF 100SF 1100SF 1100SF

    gf3500s35

    Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


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    PDF 3500S35 D2196 E1269 3500S35 gf3500s35 GF-3500 D2196 GF35 D149 D150 D2240 D257 D792

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 1000 Two-Part Thermally Conductive,Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming,designed for fragile and low-stress applications


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    PDF D2196

    Untitled

    Abstract: No abstract text available
    Text: Liqui-Bond SA 1000 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits • High thermal performance • Eliminates need for mechanical fasteners • Low viscosity for ease of screening or stenciling • Can achieve a very thin bond line


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    PDF D2196 D2240 LBSA1000

    bergquist

    Abstract: No abstract text available
    Text: Gap Filler 1000 Two-Part Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming, designed for fragile and low-stress applications


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    PDF D2196 bergquist

    Untitled

    Abstract: No abstract text available
    Text: TG4040-2K Thermally Conductive Liquid Gap Filling Material Description TG4040-2K is a thermally conductive, liquid gap filling material. The product is supplied as two components which can be cured at room temperature or at an elevated temperature to give excellent thermal and mechanical performance.


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    PDF TG4040-2K TG4040-2K D2240 D2196

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 1500 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1500 • Thermal conductivity:1.8 W/mK PROPERTY Color / Part A IMPERIAL VALUE Yellow • Optimized shear thinning characteristics for


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    PDF D2196 D2240

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 2000 Two-Part Thermally Conductive,Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 2000 PROPERTY Color / Part A • Thermal conductivity: 2.0 W/m-K • Ultra-conforming,designed for fragile and low-stress applications


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    PDF D2196 D2240

    CR200

    Abstract: No abstract text available
    Text: TflexTM CR200 Series Gap Filler Material Preliminary TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part, silicone-based thermal gap filler that has low viscosity prior to curing. Tflex™ CR200 is ideal for applications where large gap tolerances are present.


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    PDF CR200 50ral A16845-00

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


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    PDF 3500S35 D2196 3500S35

    NH0GG50V63-1

    Abstract: 1F651 NH000GG50V50
    Text: General Purpose IEC Fuses General Purpose IEC Fuses NH Fuses Plain Blades gG 400V, 500V, 690V gG 500V Size 000 to 3 - Isolated Lug NH-fuses, 500VAC gG with isolated metal gripping lugs (SGL), double indicator, contact blades, complying with DIN VDE 0636 Part 201


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    PDF 500VAC NH000GG50V2-1 NH000GG50V4-1 NH000GG50V6-1 NH000GG50V10-1 NH000GG50V16-1 NH000GG50V20-1 NH000GG50V25-1 NH000GG50V32-1 NH000GG50V35-1 NH0GG50V63-1 1F651 NH000GG50V50

    NH1GG50V200

    Abstract: NH1GG50V250 nh00gg50v125 NH3GG50V500-1 NH2GG50V315 NH00GG50V160 NH000GG50V63-1 NH3GG50V630 NH000GG50V100-1 NH000GG50V63
    Text: General Purpose IEC Fuses General Purpose IEC Fuses NH Fuses Plain Blades gG 400V, 500V, 690V aM 500V, 690V NH Fuse System DIN 57 636/VDE 0636 Parts 1, 10, 21, 22, 201 IEC 60269-2 DIN 43 620 Parts 1 to 4 (Standard dimensions) The use category is identified by two letters, the first indicating the


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    PDF 636/VDE GPEU23 NH1GG50V200 NH1GG50V250 nh00gg50v125 NH3GG50V500-1 NH2GG50V315 NH00GG50V160 NH000GG50V63-1 NH3GG50V630 NH000GG50V100-1 NH000GG50V63

    NH000GG50V63-1

    Abstract: NH1GG50V200 NH3GG50V630 NH000GG50V100-1 IEC 60269-2 NH000GG50V100 V215528 NH000GG50V40 NH000GG50V25 NH000GG50V50
    Text: General Purpose IEC Fuses General Purpose IEC Fuses NH Fuses Plain Blades gG 400V, 500V, 690V aM 500V, 690V NH Fuse System DIN 57 636/VDE 0636 Parts 1, 10, 21, 22, 201 IEC 60269-2 DIN 43 620 Parts 1 to 4 (Standard dimensions) The use category is identified by two letters, the first indicating the


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    PDF 636/VDE GPEU23 NH000GG50V63-1 NH1GG50V200 NH3GG50V630 NH000GG50V100-1 IEC 60269-2 NH000GG50V100 V215528 NH000GG50V40 NH000GG50V25 NH000GG50V50

    bergquist

    Abstract: No abstract text available
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


    Original
    PDF 3500S35 D2196 3500S35 bergquist