D1106 Search Results

WPPC-D11064

Abstract: WPPCD11064
Contextual Info: WPPC-D11064 Series SOP Package DC USR/CNR Listed File # 223387 Features Outside Dimension: Unit (mm) 1. O paque type, SOP package. 2. Subm iniature type. o (The volume is sm aller than that of our conventional DIP type by as far as 30%) o 3. Current transfer ratio.

SMD transistor MARKING CODE 43

Abstract: Split System Air Conditioner SMD 6PIN IC MARKING CODE TRANSISTOR SMD MARKING CODE PD TRANSISTOR SMD MARKING CODE 42 SMD transistor code NC D1106 MARKING CODE SMD IC TRANSISTOR SMD MARKING CODE MARKING SMD IC CODE
Contextual Info: ISOCOUPLERTM High REliability Photo Coupler DIP/ SMD/ H WPPC-D11066 Series  USR/CNR Listed File# E223387 Part Numbering System WPPC - (1) D 1 1 06 6 I D (2) (3) (4) (5) (6) (7) (8) - TRU (9) (1) Photo Coupler (2) Input A: AC D: DC (3) Channel 1: 1 Channel

WPPCD11064

Contextual Info: ISOCOUPLER TM High Reliability Photo Coupler DIP/ SMD/ H WPPC-D11064 Series USR/CNR Listed File # 223387 Features Outside Dimension: Unit (mm) 1. Current transfer ratio. (CTR: MIN. 50% at IF = 5mA Vce = 5V) 2. High isolation voltage between input and output.

WPPC-D11064

Contextual Info: High Reliability Photo Coupler DIP/ SMD/ H WPPC-D11064 Series USR/CNR Listed File # 223387 Features Outside Dimension: Unit (mm) 1. Current transfer ratio. (CTR: MIN. 50% at IF = 5mA Vce = 5V) 2. High isolation voltage between input and output. (Viso: 5000VRMS)

Contextual Info: ISOCOUPLER TM High Reliability Photo Coupler DIP/SMD/H WPPC-D11066 Series . USR/CNR Listed File # 223387 Features Outside Dimension: Unit (mm) 1. Current transfer ratio. (CTR: MIN. 60% at IF = 2mA VCE = 5V) 2. High isolation voltage between input and output.

SMD Transistor SS F

Abstract: TRANSISTOR 707 smd transistor 026 transistor smd 06
Contextual Info: ISOCOUPLERTM High REliability Photo Coupler DIP/ SMD/ H WPPC-D11066 Series  USR/CNR Listed File# E223387 Part Numbering System WPPC - (1) D 1 1 06 6 I D (2) (3) (4) (5) (6) (7) (8) - TRU (9) (1) Photo Coupler (2) Input A: AC D: DC (3) Channel 1: 1 Channel

WPPC-D11064

Contextual Info: General Purpose Photo Coupler SOP Package DC WPPC-D11064 Series . Features USR/CNR Listed File # 223387 Outside Dimension: Unit (mm) 1. Opaque type, SOP package. 2. Subminiature type. (The volume is smaller than that of our conventional DIP type by as far as 30%)

WPPC-D11066

Contextual Info: WPPC-D11066 Series High Reliability Photo Coupler DIP /SMD /H . USR/CNR Listed File # 223387 Features Outside Dimension: Unit (mm) 1. Current transfer ratio. (CTR: MIN. 60% at IF = 2mA VCE = 5V) 2. High isolation voltage between input and output.

Contextual Info: ISOCOUPLER TM General Purpose Photo Coupler SOP Package DC WPPC-D11064 Series . Features USR/CNR Listed File # 223387 Outside Dimension: Unit (mm) 1. Opaque type, SOP package. 2. Subminiature type. (The volume is smaller than that of our conventional DIP type by

printer schematic

Contextual Info: High Reliability Photo Coupler I DIP/ SMD H WPPC-D11064 Series USR/CNR Listed File # 223387 Features Outside Dimension: Unit (mm) 1. C u rre n t tra n s fe r ratio. (C T R : M IN . 50% a t If = 5 m A V c e = 5V) 2 . H igh is o la tio n v o lta g e b e tw e e n in p u t and output.

schematic air conditioner

Abstract: WPPC-D11064
Contextual Info: ISOCOUPLER High Reliability Photo Coupler DIP/ SMD/ H WPPC-D11064 Series USR/CNR Listed File # 223387 VDE (File # 40009584) Features Outside Dimension: Unit (mm) 1. Current transfer ratio. (CTR: MIN. 50% at IF = 5mA Vce = 5V) 2. High isolation voltage between input and output.

WPPCD11064

Abstract: WPPC-D11064 diode MARKING 707
Contextual Info: ISOCOUPLER General Purpose Photo Coupler SOP Package DC WPPC-D11064 Series . Features USR/CNR Listed File # 223387 VDE (File # 40009584) Outside Dimension: Unit (mm) 1. Opaque type, SOP package. 2. Subminiature type. (The volume is smaller than that of our conventional DIP type by

MARKING CF

Contextual Info: High Reliability Photo Coupler DIP /SM D /H WPPC-D11066 Series USR/CNR Listed File # 223387 Features Outside Dimension: Unit 1. Current transfer ratio. . •n n (CTR: MIN. 60% at I f = 2mA V ce (mm) i~f , = 5V) D 2. High isolation voltage between input and output.

Contextual Info: General Purpose Photo Coupler SOP Package DC WPPC-D11064 Series . Features USR/CNR Listed File # 223387 Outside Dimension: Unit (mm) 1. Opaque type, SOP package. 2. Subminiature type. (The volume is smaller than that of our conventional DIP type by as far as 30%)

Contextual Info: High Reliability Photo Coupler DIP/ SMD/ H WPPC-D11064 Series USR/CNR Listed File # 223387 Features Outside Dimension: Unit (mm) 1. Current transfer ratio. (CTR: MIN. 50% at IF = 5mA Vce = 5V) 2. High isolation voltage between input and output. (Viso: 5000VRMS)

RT5330

Abstract: D251206 vishay crcw0805 106 40401 D25P/CRCW1206 CRCW0805 crcw1206 datasheet diode b27 ta 562r CRCW2512
Contextual Info: D.P/CRCW Vishay Thick Film, Rectangular, Precision Resistors FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze Solder contacts on Ni barrier layer Excellent stability |ΔR/R| ≤ ± 0.5 % for 1000 h at 70 °C in different environmental conditions

CECC 40401-004

Abstract: CRCW0201 CRCW0603 CRCW0805 CRCW1206 D.-CRCW CRCW0603 0.0 RT1 EIA-575 CRCW2512
Contextual Info: D.-CRCW Vishay Thick Film, Rectangular Chip Resistors FEATURES • • • • • Metal glaze on high quality ceramic Protective overglaze Solder contacts on Ni barrier layer Excellent stability in different environmental conditions High volume product suitable for commercial and special

D12 vishay

Abstract: SMD resistors 2012 marking code BV SMD Transistor 562R D251206 1608 SMD resistors derating dapd11
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

D1208050B

Abstract: guideline pad dimension 1210 CRCW0603 CRCW0805 CRCW1206 D251206 D120805 D110603
Contextual Info: D.-CRCW Vishay Thick Film, Rectangular Chip Resistors FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze Lead bearing 90 % Sn/10 % Pb solder contacts Excellent stability (ΔR/R ≤ ± 0.5 % for 1000 h at 70 °C) in different environmental conditions

attansic f1

Abstract: RC415M Attansic l1 RC415ME asus attansic lan schematic Attansic f2 PAD381 PT6319 d1106
Contextual Info: 5 4 3 F5R BLOCK DIAGRAM 2 1 CPU Yonah Single core Yonah Celeron D D Page 2 AGTL+ 133/166MHz LVDS Page 10 DDR2 533/667 RC415ME CRT Single Channel PCIE Page 11 DUAL DDR2 SO-DIMM Page 12,13,14 Page 5,6,7,8,9 PCIE X4 C C MINICARD SB600 Page 28 LAN 10/100 ATTANSIC L2

Attansic L1

Abstract: pr6239 RC415M RC415ME ICS951463AGLFT ASUS attansic f1 RTS5117 C3902 ICS951463
Contextual Info: 5 4 3 F5R BLOCK DIAGRAM 2 1 CPU Yonah Single core Yonah Celeron D D Page 2 AGTL+ 133/166MHz LVDS Page 10 DDR2 533/667 RC415ME CRT Single Channel PCIE Page 11 DUAL DDR2 SO-DIMM Page 12,13,14 Page 5,6,7,8,9 PCIE X4 C C MINICARD SB600 Page 28 LAN 10/100 ATTANSIC L2

resistors 0201

Abstract: CRCW2512
Contextual Info: D.-CRCW Vishay Thick Film, Rectangular Chip Resistors FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze Solder contacts on Ni barrier layer Excellent stability |ΔR/R| ≤ ± 0.5 % for 1000 h at 70 °C in different environmental conditions

D1106

Abstract: D120805
Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)

Contextual Info: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)