D*M STANDARD DENSITY Search Results

Contextual Info: Standard-D How to Order D B M E 25 P V K87 Series D - D-Sub Shell Size Fits Contacts Shell Size Standard 20 High Density (22) E A B C D 9 15 25 37 50 15 26 44 62 78 Class Omit M MM MA MAM C U - Original D* Series - one piece insulator - solder - One piece insulator - commercial - solder

DDM78P

Abstract: 6111 subminiature DD-78 5532 dd 2079152 CIET-22D 030-2042-000
Contextual Info: H igh Density D How to Order — D *M A Crim p Connectors Receptacles Includes Socket Contacts With .120' Through-Mounting Holes Number of Contacts Standard (Shell Size) Version 78 (D) D D M A 78 S - D D M A M 7 8S Plugs (Includes Pin Contacts)* With .120" Through Mounting Holes

Contextual Info: Amphenol D Subminiature Interconnects M Series Standard Density System According to Mil-C-24308 Electrical Materials Current DWV Insulation Res. – 7.5A – 1000Vrms @ Sea Level – 5000 MΩ Mechanical Related Information Shell Standard Shell Space Grade

gsfc 311 d-sub connector

Abstract: esa scc 3401 d-sub 8635-NMB esa 3401 S-311-P10 8635 p s-311-p-4 S-311-P-10 MIL-DTL-24308 3401/001
Contextual Info: D-Sub D*M-NMB Standard density D-Sub, Non Removable Contacts Space Grade Applications Satellite Launcher Space station Shuttle hardware Probe D*M-NMB non-magnetic connectors use the same components as the 3401/001 ESA/SCC and S311-P-10 GSFC connectors. However they

Contextual Info: High Density D D*MA C rim p P rin te d C ircuit See page 342 (See page 343) Performance and Material Specifications MATERIALS AND FINISHES Standard Military Material Finish Shell Steel per A ST M A -620 Insulator Diallyl phthalate glass-filled per M IL-M -14, type SDG-F,

Contextual Info: Micro D Plastic Shell - .050" Contact Spacing M D *B-P C B M D *B -PC B connectors use standard M D *B all plas­ tic shells and are designed for use w ith flex circuitry, printed circuit and m ulti-layer boards. They are easily mounted and soldered and provide

GG1Q

Abstract: GG1Q171
Contextual Info: INTEGRATE» DEVICE m 47E D Mâ2S7?l GG1Q171 b • IDT IDT7M4068 IDT7MB40G8 256K x 8 BiCMOS/CMOS STATIC RAM MODULE Integrated D evice T ech no logy, Inc. FEATURES: DESCRIPTION: • High density 2 megabit C M O S static RAM module • Equivalent to the JE D E C standard for future monolithic

Contextual Info: H igh D ensity D D*MA Crimp P rinted Circuit See page 342 (See page 343) Performance and M aterial Specifications M A TER IA LS A N D FINISH ES Standard Military M aterial Shell Finish Steel per A S T M A -6 2 0 1 ^ Insulator Yellow chromate over cadmium

1507 CONVERTER

Contextual Info: M S C D R B SERIES CUTTING-EDGE TECHNOLOGIES OF EMI/EMC SOLUTIONS S M D P o w e r In d u c to rs • FEATURES Maximum power density. Modified standard products are available. Miniature surface mount design. ■ APPLICATIONS Notebook type PC Desk-top type PC

USART 6402

Abstract: advantages of master slave jk flip flop verilog code for 8254 timer
Contextual Info: Si GEC P L E S S E Y NOVEM BER 1997 S E M I C O N D U C T O R S D S 4830 - 3.0 GSC200 SERIES 0.35|a CMOS STANDARD CELL ASICs INTRODUCTION The GSC200 standard cell ASIC family from GEC Plessey Semiconductors GPS is a standard cell product combining low power, mixed voltage capability with a very high density

Contextual Info: 16 Megabyte CMOS DRAM DENSE-PAC DP3ED4MX32PSW DESCRIPTION: The D P 3 E D 4 M X 3 2 P S W is the 4 M eg x 32 D ynam ic R A M S O D iM M module. The module is constructed of eight 4 M eg x 4 D ynam ic R A M 's w h ich are surface mounted on an industry standard 72-pin S O D IM M substrate.

Contextual Info: DRAM Numbering Pie Revision Company Identification See Note Speed (PRAM) Product Family/ Quality Designator Premium D R A M 01 Standard D R A M A1 Synchronous D RA M 03 Functions Supported: Fast Page Mode 1 Nibble Mode 2 3 80 80ns (±10% Vcc) 70 70ns (±10% Vcc)

JIS G3141

Abstract: ANS11008 G3141 JISG3141
Contextual Info: E X A M P L E & O R D E R IN G C O D E R PD I - 15 H S-C D-SIIB CONNECTORS CRIMP SHELLS H NUMBER OF PINS: STANDARD = 9 = 15 = 25 = 37 HIGH DENSITY = 15 = 26 = 44 = 62 GENDER: MALE = FEMALE = S R SPACING: STANDARD = HIGH DENSITY =H BLANK MATING FACE: 2.5mm HEX RIVET

Contextual Info: IBM11M16730B IBM11M16730C 16M x 72 DRAM MODULE Features • 16 8 Pin J E D E C Standard, 8 Byte D ual In-line M em ory M odule • 1 6 M x 7 2 Fast P age M ode D IM M s • Perform ance: • S ystem P erform ance B enefits: - Buffered inputs except R A S , D ata

Contextual Info: High Density D D *M A Crimp Printed Circuit See page 342 (See page 343) Performance and Material Specifications MATERIALS AND FINISHES Standard Military Material Shell Finish Steel per A ST M A -6 20 1 ^ Insulator Yellow chromate over cadmium QQ -P-416 Type II Class 2

SJ 38

Contextual Info: ADVANCE M IC R O N 2 MEG X M T4LD232 X (S) 32 D R A M M O D U LE 2 MEG x 32 _ _ _ _ _ _ _ _ 8 MEGABYTE, 3.3V, OPTIONAL SELF M m o d e ESH’ O D U L E FAST PAGE ° R ED° PAGE FEATURES PIN A SSIG N M E N T (Front View) • JEDEC-standard pinout in a 72-pin single-in-line

Contextual Info: HB56UW873E-6A/7A Preliminary 8,388,608-Word x 72-Bit High Density Dynamic RAM Module 168-pin JE D E C Standard Outline Buffered 8B YTE DIM M HITACHI The H B56U W 873E belongs to 8 Byte D IM M Dual In-line Memory M odule fam ily, and has been developed as an optim ized main memory solution

LM324

Contextual Info: / T L ir m TECHNOLOGY _ LT1413 Single Supply, D ual Precision O p A m p FCflTURCS D C S C M PTIO n Single Supply Operation: The LT1413 is a low cost, upgraded version of Linear Technology's industry standard LT1013 dual, single sup­

8730P

Contextual Info: IBM11M8730P 8M x 72 D R A M M O D U LE Features • 168 Pin JE D E C Standard, 8 Byte Dual In-line M em ory M odule • Au contacts • Optim ized for ECC applications • 8M x72 Fast Page M ode DIMM • System Perform ance Benefits: - • Perform ance: Buffered inputs except RAS, Data

Contextual Info: H igh D ensity D D*M A Crimp P rinted Circuit See page 342 (See page 343) Performance and M aterial Specifications MATERIALS AND FINISHES Standard Military M aterial Shell Finish Steel per A S T M A -6 2 0 1 ^ Insulator Yellow chromate over cadmium Q Q -P-416 Type II Class 2

pin diagram for IC 7476

Abstract: MT16D164 RWS300B-15/R
Contextual Info: M ir H D N 1 1 MEG 8 MEGABYTE, 5V, FAST PAGE MODE FEATURES PIN ASSIGNMENT Front View • JE D E C - and industry-standard pinout in a 168-pin, dual-in-line m em ory m odule (D IM M ) • High-performance C M O S silicon-gate process • Single +5V ±10% pow er supply

Contextual Info: Standard Density D-Sub Amphenol Plug Right Angle Europe Footprint – Front Screwlocks Specifications : Contact Resistance : 20 m? Max Insulator Resistance : 1000 M? Min at 500V DC Current Rating: 5A Dielectric Withstanding Voltage : 1000V AC for 1 minute

Contextual Info: Standard Density D-Sub Amphenol Receptacle Right Angle Europe Footprint – Rear Inserts Specifications : Contact Resistance : 20 m? Max Insulator Resistance : 1000 M? Min at 500V DC Current Rating: 5A Dielectric Withstanding Voltage : 1000V AC for 1 minute

5145154-4

Contextual Info: tifca M em ory & Socket Products M em ory / D IM M Sockets Electronics Standard Edge .0 5 0 Series PCI Connectors • High density .0 5 0 1.27m m centreline contact spacing ■ Easy m ating of high circuit count daughter boards ■ Polarising w eb for positive board-to-connector registration