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    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 1/23/06 C2 7454- JM .1OD [2.54] a .OSD [1 -27] (9) PIN# 1 .100 [2.64] «.035 [0.89] ±.003 [D.OB] (ID) § 4» |$|0.Q O 6 [ a i g f l 4* 4» -Z50 [6.35] 1 - ,.m [ 3,25] .125 [3.18] (2) - e .450 [11.43] B 0.006 [ 0 .15] P.C.B. RECOMMENDED HOLE LAYOUT


    OCR Scan     		PDF PR026-01. CT650042

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 1/23/06 C2 7454 JM 1/29/09 C3 8642 TA APP’D. BY .125 [3.18] ±.010 [0.25] -.650 [16.51] MAX.- □ .627 [15.93] MAX. B B □V .248 [6.30] .125 [3.17] 2 NOTES: .100 [2.54] (8) 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY


    OCR Scan     		PDF PR026-01. CT650042

    Untitled

    Abstract: No abstract text available
    Text: 2 DATE REV ECN 1/23/06 C2 7454 JM 1/29/09 C3 8642 TA APP'D. BY .125 [3.18] ±.010 [0.25] -.650 [16.51] MAX.- □ .627 [15.93] MAX. B .248 [6.30] .125 [3.17] 2 NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF