CSPNL
Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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amkor flip
Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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95Pb
Abstract: FCCSP amkor RDL
Text: data sheet W A F E R L E V E L PAC K AG I N G CSPnl Features: Wafer Level Packaging CSPnl™ Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP Chip Scale Package products. Through the
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Untitled
Abstract: No abstract text available
Text: PROVIDED UNDER NDA — PROPRIETARY AND CONFIDENTIAL — DO NOT DISTRIBUTE FAN5903 Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs Features Description • • FAN5903 is a high-efficiency, low-noise, synchronous, step-down, DC-DC converter designed for powering
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FAN5903
FAN5903
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CY7C68033
Abstract: CY7C68034 E200
Text: CY7C68033, CY7C68034 EZ-USB NX2LP-Flex Flexible USB NAND Flash Controller CY7C68033/CY7C68034 Silicon Features • Certified compliant for bus- or self-powered USB 2.0 operation TID# 40490118 ■ Single-chip, integrated USB 2.0 transceiver and smart SIE
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CY7C68033,
CY7C68034
CY7C68033/CY7C68034
48-MHz,
24-MHz,
12-MHz
CY7C68033
CY7C68034
E200
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WLCSP flip chip
Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters
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LT56B
Abstract: pcb 8051 e604-1 e626
Text: CY7C68033 CY7C68034 EZ-USB NX2LP-Flex Flexible USB NAND Flash Controller EZ-USB® NX2LP-Flex™ Flexible USB NAND Flash Controller CY7C68033/CY7C68034 Silicon Features • Certified compliant for bus- or self-powered USB 2.0 operation TID# 40490118
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CY7C68033
CY7C68034
CY7C68033/CY7C68034
64-byte
LT56B
pcb 8051
e604-1
e626
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230UART1
Abstract: CY7C68033 CY7C68034 E200 t-con tv lcd
Text: CY7C68033/CY7C68034 EZ-USB NX2LP-Flex Flexible USB NAND Flash Controller EZ-USB® NX2LP-Flex™ Flexible USB NAND Flash Controller CY7C68033/CY7C68034 Silicon Features • Certified compliant for bus- or self-powered USB 2.0 operation TID# 40490118
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CY7C68033/CY7C68034
CY7C68033/CY7C68034
230UART1
CY7C68033
CY7C68034
E200
t-con tv lcd
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Untitled
Abstract: No abstract text available
Text: CY7C68033/CY7C68034 EZ-USB NX2LP-Flex Flexible USB NAND Flash Controller EZ-USB® NX2LP-Flex™ Flexible USB NAND Flash Controller CY7C68033/CY7C68034 Silicon Features • Certified compliant for bus- or self-powered USB 2.0 operation TID# 40490118
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Untitled
Abstract: No abstract text available
Text: FAN5903 Buck Converter with Bypass Mode for 3G / 3.5G / 4G PAs Features • • Description 2.7 V to 5.5 V Input Voltage Range VOUT Range from 0.4 V to 3.5 V or VIN Small Form Factor Inductor o 2012 470 nH or 540 nH for Minimal PCB Area o 2520 1.0 µH for Higher Efficiency
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FAN5903
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Heading
Abstract: No abstract text available
Text: SENtral Motion Coprocessor General Description The SENtral Motion Coprocessor is a custom integrated circuit that makes it easy to quickly incorporate, optimize and operate multiple motion sensors on mobile consumer electronics devices. SENtral employs and manages a user-specified
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WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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AN69061
AN69061
WLCSP smt
EIA-481-D-2008
Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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8051 microcontroller interface with gps
Abstract: No abstract text available
Text: CY7C68033/CY7C68034 EZ-USB NX2LP-Flex Flexible USB NAND Flash Controller EZ-USB® NX2LP-Flex™ Flexible USB NAND Flash Controller CY7C68033/CY7C68034 Silicon Features • Certified compliant for bus- or self-powered USB 2.0 operation TID# 40490118
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CY7C68033/CY7C68034
CY7C68033/CY7C68034
64-byte
8051 microcontroller interface with gps
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SPSZ
Abstract: voicecoil driver
Text: TLS2205 VOICE-COIL MOTOR DRIVER, SPINDLE-MOTOR DRIVER, AND VOLTAGE MONITOR SLFS040 - DECEMBER 1993 Single-Chip Voice-Coil Motor Driver and Spindle-Motor Driver DL PACKAGE TOP VIEW Precision Dual-Voltage Monitor SCLK[ ] MTRCLK ]D V CC ] AUXIN ] AUXOUT sdata[
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TLS2205
SLFS040
56-Terminal
64-Terminal
SPSZ
voicecoil driver
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