B32655
Abstract: No abstract text available
Text: EPCOS Product Brief 2013 Film Capacitors Power Capacitor Chip B25655 for e-Mobility Applications www.epcos.com Technology Film assembly 1 Metal-end spray layer 2) Free margin 3) Metallization, flat or CSP w. / wo. structuring Process flow 4) Heavy-edge 5) Precise extension and
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B25655
B32655
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csp process flow diagram
Abstract: jedec Package Shipping Trays
Text: 2.0 µBGA* PACKAGE/PRODUCT PROCESS FLOW Wafer Fabrication Fab 2.1 Overview The µBGA package cross-sectional diagram is illustrated below Figure 3 and displays the various materials used to manufacture the package. This section outlines the µBGA package
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CBG064-052A
Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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ic 6116 datasheet from texas instruments
Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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Pb95Sn5
Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377
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DS2411:
DS2415:
DS2417:
DS2432:
DS2433:
DS2502:
DS2760:
DS2761:
DS2762:
DS9503:
Pb95Sn5
pcb warpage in ipc standard
ROSIN FLUX TYPE ROL0
EIA-746
IPC-6012A
MAXIM Assembly Locations OF CODE
underfill dispense needle
FR4 substrate height and thickness
DS2761X
J-STD-004 sn63pb37
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40B5
Abstract: 42B2 RT54SX-S TQ100
Text: v4.1 eX Family FPGAs FuseLock Leading Edge Performance • • • • • 240 MHz System Performance 350 MHz Internal Performance 3.9 ns Clock-to-Out Pad-to-Pad • • • Specifications • • • • • 3,000 to 12,000 Available System Gates Maximum 512 Flip-Flops (Using CC Macros)
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circuit diagram for Basic Stamp 2
Abstract: csp process flow diagram C1995 DP83200SMT DP83256
Text: DP83200SMT XLNT Manager TM FDDI Station Management SMT Software Support Package General Description The XLNT ManagerTM Software Package completely implements all required and most optional FDDI SMT Protocol functions It comes complete with well documented source
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DP83200SMT
circuit diagram for Basic Stamp 2
csp process flow diagram
C1995
DP83256
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Untitled
Abstract: No abstract text available
Text: v3.0 eX Automotive Family FPGAs FuseLock Specifications • • • • • 3,000 to 12,000 Available System Gates Maximum 512 Flip-Flops Using CC Macros 0.22µm CMOS Process Technology Up to 132 User-Programmable I/O Pins • • • • Features • •
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Untitled
Abstract: No abstract text available
Text: v3.1 eX Automotive Family FPGAs FuseLock Specifications • • • • • 3,000 to 12,000 Available System Gates Maximum 512 Flip-Flops Using CC Macros 0.22µm CMOS Process Technology Up to 132 User-Programmable I/O Pins • • • • Features • •
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Untitled
Abstract: No abstract text available
Text: v3.0 eX Automotive Family FPGAs FuseLock Specifications • • • • • 3,000 to 12,000 Available System Gates Maximum 512 Flip-Flops Using CC Macros 0.22µm CMOS Process Technology Up to 132 User-Programmable I/O Pins • • • • Features • •
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100-PIN TQFP XILINX DIMENSION
Abstract: xilinx xc9536 digital clock xc9536-pc44 XC95216XL xc95144 pin diagram XC95108XL XC9536 XC95144 XC9500 pinout XC9536XL Series
Text: Ann Duft Xilinx, Inc. 408 879-4726 publicrelations@xilinx.com Kathy Keller Oak Ridge Public Relations (408) 253-5042 kathy.keller@oakridge.com FOR IMMEDIATE RELEASE XILINX ANNOUNCES NEWEST MEMBER OF INDUSTRY’S FASTEST GROWING CPLD FAMILY New XC95144 device targets sweet spot of ISP CPLD market with lowest price per macrocell
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XC95144
1998--Xilinx,
XC9500
100-PIN TQFP XILINX DIMENSION
xilinx xc9536 digital clock
xc9536-pc44
XC95216XL
xc95144 pin diagram
XC95108XL
XC9536
XC9500 pinout
XC9536XL Series
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Untitled
Abstract: No abstract text available
Text: v4.2 eX Family FPGAs FuseLock Leading Edge Performance • • • • • 240 MHz System Performance 350 MHz Internal Performance 3.9 ns Clock-to-Out Pad-to-Pad • • • Specifications • • • • • 3,000 to 12,000 Available System Gates Maximum 512 Flip-Flops (Using CC Macros)
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Silicon Sculptor II
Abstract: 40B5 42B2 RT54SX-S TQ100 180-pin
Text: v4.3 eX Family FPGAs FuseLock Leading Edge Performance • • • • • 240 MHz System Performance 350 MHz Internal Performance 3.9 ns Clock-to-Out Pad-to-Pad • • • Specifications • • • • • 3,000 to 12,000 Available System Gates Maximum 512 Flip-Flops (Using CC Macros)
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40B5
Abstract: 42B2 RT54SX-S 49-pin
Text: v3.2 eX Automotive Family FPGAs u e Specifications • • • • • 3,000 to 12,000 Available System Gates Maximum 512 Flip-Flops Using CC Macros 0.22 µm CMOS Process Technology Up to 132 User-Programmable I/O Pins • • • • Features • •
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lifepo4
Abstract: No abstract text available
Text: MP2623 Stand-Alone, 2A, 1- or2-Cell Switching LiFePO4 Battery Charger The Future of Analog IC Technology DESCRIPTION FEATURES The MP2623 is a monolithic, DC-DC, stepdown, switching charger for a 1-or-2-cell serial LiFePO4 battery. It has an integrated high-side
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MP2623
MP2623
lifepo4
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DG3000
Abstract: No abstract text available
Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as
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DG3001,
DG3002,
DG3003
DG3003
DG3001
DG3002
DG3000
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sustain circuits for plasma tv
Abstract: sustain driver for plasma tv plasma display address electrode driving igbt for plasma tv circuit for driving address electrodes PDP igbt display plasma heat sink design guide, IGBT BD-2249 pdp driver plasma tv circuit diagram
Text: www.fairchildsemi.com AN- 9038 PDP Panel Drive System Using PDP-SPMTM Module By S.N. Kim, D.C. Choi, J.E. Yeon, C.K. Kim Contents 1. Introduction 2. Plasma Display Panel 2.1. Consist of an AC PDP Panel 2.2. Commercial Driving Scheme for AC PDPs 2.3. Driving Methods for AC PDPs
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TRANSISTOR SMD MARKING CODE LF
Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin
Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
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LM431
AN-1112
TRANSISTOR SMD MARKING CODE LF
SMD SOT23 transistor MARK ck
TRANSISTOR SMD MARKING CODE loc
TRANSISTOR SMD MARKING CODE SAW
BGA-3000
transistor smd marking KA
Zener diode smd marking ck
diode SMD MARKING CODE SAW
smd transistor marking HR
MARKING BA SMD IC CODE 8-pin
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transistor smd G46
Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Text: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG
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N32-2400
22142J
transistor smd G46
fluke 52 k/j Thermocouple
7512 pin diodes in micro semi data sheet
smd transistor marking ey
SMD MARKING CODE h5
MCP Technology Trend
BGA-64 pad
AMD reflow soldering profile BGA
SMD MARKING CODE l6
BGA Solder Ball 0.6mm
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m26123
Abstract: MP26123 MP26123DR MP26123DR-LF-Z MP2612 2A24V mp26
Text: MP26123 2A,24V Input, 600kHz 2/3-Cell Switching Li-ion Battery Charger The Future of Analog IC Technology DESCRIPTION The MP26123 is a monolithic DC-DC stepdown switching charger for 2- or 3-cell Li-ion battery packs. It has an integrated high-side power MOSFET can output up to a 2A charge
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MP26123
600kHz
MP26123
MO-220,
m26123
MP26123DR
MP26123DR-LF-Z
MP2612
2A24V
mp26
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vishay siliconix code marking 3 SMD
Abstract: DG3003DB-T1-E1 si89 si8902 mw-6 SMD CHIP s11030
Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as
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DG3001,
DG3002,
DG3003
DG3003
DG3001
DG3002
vishay siliconix code marking 3 SMD
DG3003DB-T1-E1
si89
si8902
mw-6 SMD CHIP
s11030
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Untitled
Abstract: No abstract text available
Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as
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DG3001,
DG3002,
DG3003
DG3003
DG3001
DG3002
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Untitled
Abstract: No abstract text available
Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as
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DG3001,
DG3002,
DG3003
DG3003
DG3001
DG3002
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Untitled
Abstract: No abstract text available
Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as
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DG3001,
DG3002,
DG3003
DG3003
DG3001
DG3002
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