CSP DEFECTS Search Results

S10357-01

Abstract: S10356-01
Contextual Info: Si photodiodes S10356-01 S10357-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.

Contextual Info: Si photodiodes S10356-01 S10357-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.

Contextual Info: Si photodiodes S10355-01 S10356-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.

Contextual Info: Si photodiodes S10355-01 S10356-01 Back-illuminated type photodiodes employing CSP structure The S10355-01 and S10356-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.

dycostrate

Abstract: CH-2074 without underfill
Contextual Info: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP

Contextual Info: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and

48-PIN

Abstract: FBGA048-P-0808 LH28F800BGH-L LH28F800BG-L TSOP048-P-1220
Contextual Info: LH28F800BG-L/BGH-L FOR TSOP, CSP LH28F800BG-L/BGH-L (FOR TSOP, CSP) 8 M-bit (512 kB x 16) SmartVoltage Flash Memories DESCRIPTION The LH28F800BG-L/BGH-L flash memories with SmartVoltage technology are high-density, low-cost, nonvolatile, read/write storage solution for a wide

LH28F800SG

Abstract: 48-PIN FBGA048-P-0808 LH28F800SGH-L LH28F800SG-L TSOP048-P-1220
Contextual Info: LH28F800SG-L/SGH-L FOR TSOP, CSP LH28F800SG-L/SGH-L (FOR TSOP, CSP) 8 M-bit (512 kB x 16) SmartVoltage Flash Memories DESCRIPTION The LH28F800SG-L/SGH-L flash memories with SmartVoltage technology are high-density, low-cost, nonvolatile, read/write storage solution for a wide

sharp LRS1360

Abstract: LRS1B03 LRS1B04 LRS1B05 LRS1B06 LRS1B07 sram 3.3 16bit
Contextual Info: NEW PRODUCT INFORMATION LRS1B05 4-chip Stacked CSP Combination Memory * Under development < Outline > LRS1B05, consisting of a 64-Mbit flash memory , a 12-Mbit SRAM and a 16-Mbit RAM, is a composite memory chip that is being developed by applying stacked CSP technology to integrate the constituent memories into a large-capacity,

8 bit memory ic

Abstract: flash memory IC-032 SRAM LCD PANEL 32"
Contextual Info: NEW PRODUCT INFORMATION LR-S1366/67 32 M Flash Memory + 8 M SRAM Stacked CSP Combination Memory LR-S1368/69 32 M Flash Memory + 12 M SRAM Stacked CSP Combination Memory Outline Under Development LR-S1366/67 and LR-S1368/69 are combination memories that realize great capacity on single chips using Sharp’s

RJ63YC100

Abstract: LR36B15 LR36b03 LR38627 RJ2321 LR388H3 IR2E67M pq1cx41h2zpq RJ2341 sharp RJ63YC100
Contextual Info: CONTENTS Sharp Efforts Towards a Green Society . 2 Developing Devices with High Environmental Performance. 4 Raising the Level of Environmental Performance in Factories . 5 TFT LCD 6 LSI REG PACKAGES 32 CSP Chip Size Package .

transistor b 1238

Abstract: 15 ball CSP thermal analysis on pcb uBGA device MARKing intel air conditioning bumper 28F008SC IR 126 D 24
Contextual Info: 7.0 QUALITY AND RELIABLITY ENGINEERING PACKAGE CERTIFICATION 7.1 Introduction The µBGA package is a chip-scale package CSP , which utilizes a polyimide tape with eutectic solder balls. The µBGA package offers an application in smaller form factors with

28F6408J3

Abstract: 28F6408J3A Intel SCSP
Contextual Info: 3 Volt Intel StrataFlash Memory Stacked-CSP 28F6408J3 Preliminary Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flash Memory plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology

Contextual Info: TPS62650 TPS62651 CSP-9 SLVS808B – AUGUST 2009 – REVISED JULY 2011 www.ti.com 800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING Check for Samples: TPS62650, TPS62651 FEATURES DESCRIPTION • • •

Contextual Info: TPS62650 TPS62651 CSP-9 SLVS808B – AUGUST 2009 – REVISED JULY 2011 www.ti.com 800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING Check for Samples: TPS62650, TPS62651 FEATURES DESCRIPTION • • •

MO-195

Abstract: Intel BGA Solder BGA PACKAGE OUTLINE flash memory databook World transistors databook 28F008B3 28F016B3 28F016S3 28F160B3 28F160S3
Contextual Info: 1.0 THE µBGA* PACKAGE: INTEL’S LATEST FLASH MEMORY PACKAGE 1.1 Introduction During the last several years, Intel’s Flash Memory Components Division has conducted research on next-generation Chip-Size Packaging CSP for flash memory. Intel’s customers in

Contextual Info: TPS62650 TPS62651 CSP-9 SLVS808B – AUGUST 2009 – REVISED JULY 2011 www.ti.com 800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING Check for Samples: TPS62650, TPS62651 FEATURES DESCRIPTION • • •

252633

Abstract: INTEL STRATAFLASH 1.8V
Contextual Info: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash

JESD22-B117

Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
Contextual Info: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP

l18scsp

Abstract: 128L18 48F3300L0YDQ0 48F3300L0ZDQ0 28F128L18 28F128L30 251902 RD48F3300L0YDQ0 INTEL STRATAFLASH
Contextual Info: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash

SAC266

Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
Contextual Info: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.

LRS1816

Abstract: LRS1B03 LRS1B04 LRS1B06 LRS1B07 sharp page buffer
Contextual Info: NEW PRODUCT INFORMATION LRS1B03/04/06/07 4-chip Stacked CSP Combination Memory < Outline > A multitude of multimedia services, including the distribution of information, electronic settlements of accounts and even TV-phones, are predicted thanks to improved baud rates in next generation cellular phones.

Contextual Info: CSP-9 TPS62650-Q1 www.ti.com SLVSB62A – MARCH 2012 – REVISED MARCH 2012 800-mA, 6-MHz High-Efficiency Step-Down Converter With I2C Compatible Interface in Chip-Scale Packaging Check for Samples: TPS62650-Q1 FEATURES • • • APPLICATIONS 1 23 •

TOKO coil

Abstract: lqm21p
Contextual Info: CSP-9 TPS62650-Q1 www.ti.com SLVSB62A – MARCH 2012 – REVISED MARCH 2012 800-mA, 6-MHz High-Efficiency Step-Down Converter With I2C Compatible Interface in Chip-Scale Packaging Check for Samples: TPS62650-Q1 FEATURES • • • APPLICATIONS 1 23 •