MIL-D-3464 type 1
Abstract: MIL-D-3464 MIL-D-3464 type 1 and 2 MILD-3464 MIL-D3464 Furnace
Text: Plastic Package Moisture-Induced Cracking Introduction With the older “through-hole” technology packages such as the Dual In-line Package DIP , soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where
|
Original
|
|
PDF
|
JEDEC J-STD-033b
Abstract: MIL-D-3464 type 1 MIL-D-3464 MIL-D-3464 type 1 and 2 J-STD-033B MIL-B-81705 MILD-3464 LEAD FRAME SURFACE MOUNT QFP JEDEC tray MIL-D-3464 type 2
Text: Plastic Package Moisture-Induced Cracking Introduction Problem Summary With the older “through-hole” technology packages such as the Dual In-line Package DIP , soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where
|
Original
|
CSP-9-111S2)
CSP-9-111S2.
JEDEC J-STD-033b
MIL-D-3464 type 1
MIL-D-3464
MIL-D-3464 type 1 and 2
J-STD-033B
MIL-B-81705
MILD-3464
LEAD FRAME SURFACE MOUNT
QFP JEDEC tray
MIL-D-3464 type 2
|
PDF
|
all ic data
Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile
|
Original
|
|
PDF
|
all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
|
Original
|
|
PDF
|
Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
|
Original
|
conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
|
PDF
|
all ic data
Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as
|
Original
|
CH09WIP
all ic data
Intel reflow soldering profile BGA
infrared heating gun
82425EX
intel 80486 DX4
hot air bga
land pattern for TSOP
TSOP infrared
80c196kb 1988
land pattern QFP 208
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Web Site: www.parallax.com Forums: forums.parallax.com Sales: sales@parallax.com Technical: support@parallax.com Office: 916 624-8333 Fax: (916) 624-8003 Sales: (888) 512-1024 Tech Support: (888) 997-8267 Gas Sensor Board (#27983) The Gas Sensor Board is designed to work in conjunction with one of the gas sensors listed below (not
|
Original
|
|
PDF
|
LPG GAS SENSOR
Abstract: CO Gas sensor gas sensor gas module sensor CO Sensor "Co Sensor" alcohol sensor module Hair Curler LPG GAS SENSOR application basic stamp BS2 ic
Text: Web Site: www.parallax.com Forums: forums.parallax.com Sales: sales@parallax.com Technical: support@parallax.com Office: 916 624-8333 Fax: (916) 624-8003 Sales: (888) 512-1024 Tech Support: (888) 997-8267 CH4 (Methane) Gas Sensor Module (#27930) CO (Carbon Monoxide) Gas Sensor Module (#27931)
|
Original
|
|
PDF
|
circuit diagram of very long range remote control
Abstract: RC-90023A SM10 SM20 wagner PADS Soldering and desoldering Cracking furnaces lambda transistor PWB series lambda ENC61000-4-2
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. APPLICATION NOTES SM10 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
|
Original
|
|
PDF
|
ENC61000-4-2
Abstract: SM10 UL-1950 SM10-24S05 TDK lambda 24 VDC power supply 1206B104K101N SM10-24D15 IMC process inductor
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. Instruction Manual SM10 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
|
Original
|
DRS24
N2510B2510BA
N1810B1810BA
N1410B1410BA
ENC61000-4-2
SM10
UL-1950
SM10-24S05
TDK lambda 24 VDC power supply
1206B104K101N
SM10-24D15
IMC process inductor
|
PDF
|
SM10
Abstract: SM20 CONN36
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. APPLICATION NOTES SM20 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
|
Original
|
|
PDF
|
SM20
Abstract: SM20-24S12 SM20-24S15 UL-1950 1320UH IMC process inductor
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. Instruction Manual SM20 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
|
Original
|
DRS24
N2510B2510BA
N1810B1810BA
N1410B1410BA
SM20
SM20-24S12
SM20-24S15
UL-1950
1320UH
IMC process inductor
|
PDF
|
TDK lambda 24 VDC power supply
Abstract: Tokin CY55 k101n DRS24 CY55 CY55Y5 SM30 UL-1950
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. Instruction Manual SM30 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
|
Original
|
DRS24
N2510B2510BA
N1810B1810BA
N1410B1410BA
TDK lambda 24 VDC power supply
Tokin CY55
k101n
CY55
CY55Y5
SM30
UL-1950
|
PDF
|
Lambda Electronics
Abstract: SM10 SM20 SM30 Lambda diode
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. APPLICATION NOTES SM30 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
|
Original
|
|
PDF
|
|
|
footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
|
Original
|
FG860
FG900
FG1156
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
TSOP 86 land pattern
BAV 235
BGA and QFP Package
xc4010e-pq208
leadframe C7025
QFP PACKAGE thermal resistance
CB228
|
PDF
|
schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
|
Original
|
FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
|
PDF
|
pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
|
Original
|
|
PDF
|
xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
|
Original
|
UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
|
PDF
|
xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
|
Original
|
UG112
UG072,
UG075,
XAPP427,
xilinx part marking
xilinx topside marking
UG112
qfn 3x3 tray dimension
FGG484
HQG160
reballing
top marking 957 so8
FF1148
fcBGA PACKAGE thermal resistance
|
PDF
|
qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
|
Original
|
UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
|
PDF
|
XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
|
Original
|
UG112
UG072,
UG075,
XAPP427,
XILINX/part marking Hot
SMT, FPGA FINE PITCH BGA 456 BALL
PC84/PCG84
XCDAISY
TT 2076
XC2VP7 reflow profile
SPARTAN-II xc2s50 pq208
sn63pb37 solder SPHERES
qfn 3x3 tray dimension
HQG160
|
PDF
|
BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
|
Original
|
UG112
UG072,
UG075,
XAPP427,
BFG95
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Cat.No. Z127–E1–1 V600 RFID System R/W Heads and SRAM Data Carriers OPERATION MANUAL V600 RFID System R/W Heads and SRAM Data Carriers Operation Manual Produced August 1998 Notice: OMRON products are manufactured for use according to proper procedures by a qualified operator
|
Original
|
V600-H06-T
V600-D2KR01-T
470-kHz
V600-H06
V600-D2KR01.
Z127-E1-1
|
PDF
|
EIAJ-IC-121
Abstract: EIAJ-IC-121 Method 20 EIAJ-IC-121-18 EIAJIC-121 MIL-STD-202E-101D MIL-STD-202E 101D
Text: QUALITY ASSURANCE 2. QUALITY ASSURANCE S-M O S Systems, Inc., supported by the foundation of results acquired through experience in the adoption of low-pow er CMOS LSI for SEIKO quartz watches, has been providing highly reliable products that have set new
|
OCR Scan
|
|
PDF
|