TCR500
Abstract: SiCr wire bond 60k4
Text: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.
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S-PMC00M107-N
TCR500
SiCr
wire bond
60k4
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silver epoxy
Abstract: No abstract text available
Text: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the life span of their products comes to an end by scrutinizing the materials incorporated and their
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silver epoxy
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Mil-Std-883 Wire Bond Pull Method 2011
Abstract: 28-pin SOJ SRAM 9749 cel 9200 8361H CY62256V JESD22
Text: Cypress Semiconductor Qualification Report QTP# 97496, VERSION 1.1 March 1999 256K SRAM, R42 Technology, Fab 4 Qualification CY62256V* 32K x 8 Micro Power Asynchronous SRAM 2.7V - 3.6V CY62256V25* 32K x 8 Micro Power Asynchronous SRAM (2.3V - 2.7V) CY62256V18*
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CY62256V*
CY62256V25*
CY62256V18*
CY62256V
28-pin,
300-mil
CY622=
85C/85
CY62256V-VC
Mil-Std-883 Wire Bond Pull Method 2011
28-pin SOJ SRAM
9749
cel 9200
8361H
CY62256V
JESD22
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MC100EL91
Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 100H646
Text: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and
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AND8072/D
MC100EL91
MC100EPT25
MC100LVEP16
MC10LVEP16
100H646
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Si3N4
Abstract: antimony trioxide epoxy molding TELEFUNKEN catalog
Text: Vishay Telefunken The Constituents of Semiconductor Components Document Number 82601 05.01 www.vishay.com 1 Vishay Telefunken Table of Contents The Constituents of Semiconductor Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Abstract: No abstract text available
Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a
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DS550R
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tsmc design rule
Abstract: 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model
Text: Cypress Semiconductor Product Qualification Report QTP# 002105 VERSION 1.0 October, 2000 High Accuracy EPROM Programmable Single-PLL Clock Generator L28 Technology, CTI fab 2 and TSMC fab 2A, Taiwan CY2077 390 kHz - 133MHz at 5V 390 kHz -100 MHz at 3.3V CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
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CY2077
133MHz
CY2077SC/CY2077ZC
CY2280-OC
85C/85
tsmc design rule
1120008
tsmc
tsmc cmos
MIL-STD-883C method 2011
tsmc Activation Energy
tsmc cmos model
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PQFP 176
Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●
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144-Pin
100-Pin
256-Pin
780-Pin
256-Pin
68-Pin
PQFP 176
240 pin rqfp drawing
EP3C5E144
EP1K50-208
processor cross reference
EP3C16F484
MS-034 1152 BGA
84 FBGA thermal
TQFP 144 PACKAGE DIMENSION
FBGA 1760
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7C11483
Abstract: PECVD 8361H CY62128B CY62148B
Text: Cypress Semiconductor Product Qualification Report QTP# 004405 VERSION 1.0 January, 2001 Micro Power Asynchronous R52LD-5R Technology Fab 4 Cypress CY62148B 512K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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R52LD-5R
CY62148B
CY62428B
CY62128B
CY62148B,
192HRS
30C/60
7C11483
PECVD
8361H
CY62148B
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CY2304
Abstract: CY2308
Text: Cypress Semiconductor Product Qualification Report QTP# 98204 VERSION 2.0 October, 2000 Zero Delay Buffer, 3.3V L28 Technology, Fab 2 CY2305/CY2309 10-MHz to 100/133-MHZ CY2304/CY2308 10-MHz to 133-MHZ CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell
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CY2305/CY2309
10-MHz
100/133-MHZ
CY2304/CY2308
133-MHZ
CY2304
/CY2305
/CY2308
/CY2309*
CY2308
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AL3000A
Abstract: EME-6300H PALCE20V8
Text: Qualification Report November 1995, QTP# 95173, Version 1.0 PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL PAL is a registered trademark of Advanced Micro Devices, Inc. CYPRESS SEMICONDUCTOR PAGE 2 PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part
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PALCE20V8
7C320B
PALCE20V8-PC
PALCE20V8-JC
AL3000A
EME-6300H
PALCE20V8
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CYPRESS an2394
Abstract: CONDUCTIVE INK FLEX CIRCUITS CONDUCTIVE INK FOR FLEX CIRCUITS AN2394 chemtronics chemtronics capacitive Cypress Projected Capacitive touch sensor design 5 PEN PC TECHNOLOGY references Capacitive Cypress touch panel
Text: A Designer's Guide to Rapid Prototyping of Capacitive Sensors on Any Surface By Mark Lee, Senior Application Engineer, Cypress Semiconductor Corp. Executive Summary This article will discuss how to replace the mechanical buttons on a product with a smooth and sleek touch-sensitive surface.
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footprint jedec MS-026 TQFP
Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES
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Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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Ablebond 8380
Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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FIT4
Abstract: EME-6300H PALCE20V8
Text: Qualification Report April 1996, QTP# 96037, Version 1.0 PALCE20V8 Flash Erasable, Reprogramable CMOS PAL PAL is registered trademark of Advanced Micro Devices, Inc. PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:
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PALCE20V8
24-Pin
7C320A
PALC22V10D-JC
3495158508B
349520602B
FIT4
EME-6300H
PALCE20V8
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FIT4
Abstract: EME-6300H PALCE16V8
Text: Qualification Report April 1996, QTP# 96023, Version 1.0 PALCE16V8 Flash Erasable, Reprogramable CMOS PAL PAL is registered trademark of Advanced Micro Devices, Inc. PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:
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PALCE16V8
20-Pin
7C316A
PALC22V10D-JC
3495158508B
349520602B
FIT4
EME-6300H
PALCE16V8
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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D2863-77
Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
Text: GENERAL INFORMATION Packages INTRODUCTION P lastic surface-mount package designs were developed in the late 1970s in answer to the demand for costeffective solutions to achieving greater board density without sacriÞcing reliability or functionality. Recent developments in these
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1970s
D2863-77
Plastic Encapsulate Diodes
bond wire copper
hermetic packages PCB land
circuit for wind mill
footprint plcc 208
cmos methane SENSOR
land pattern PQFP 208
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Ablebond 8380
Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that
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CH12WIP
Ablebond 8380
smema
DA6523
nozzle heater
X3304
Theta-JC
5th mechnical engineering date sheet
alpha Resistors slide
cut template DRAWING
Die Attach epoxy stamping
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CMOS handbook
Abstract: error 41 barrier EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 fbga Substrate design guidelines BGA PACKAGE OUTLINE
Text: Section II. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for MAX II devices. It contains the required printed circuit board PCB layout guidelines, device pin tables, and package specifications.
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CERAMIC PIN GRID ARRAY wire lead frame
Abstract: IPC-SM-780 nickel corrosion electroplating
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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Glossary-11
CERAMIC PIN GRID ARRAY wire lead frame
IPC-SM-780
nickel corrosion electroplating
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IPC-SM-780
Abstract: No abstract text available
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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IPC-SM-780
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