xilinx 1200
Abstract: cas number 14808-60-7
Text: 100% Material Declaration Data Sheet FT64 PK232 v1.1 March 19, 2012 Average Weight: 0.2450g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Component Weight/ Substance Weight (grams) Component Percent of Total
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PK232
2450g
1333-86-inx
xilinx 1200
cas number
14808-60-7
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peak atlas DCA55
Abstract: ATLAS dca55 DCA55 thyristor-triac specifications A 103 TRANSISTOR pinout 220MV ATLAS III pinout all type of triac how to test transistor SK17
Text: atlas component analyser PRODUCT BRIEF Model: DCA55 The Peak Atlas A fresh approach to component analysis has resulted in the fantastic Peak Atlas, an intelligent, slim and invaluable tool. A world of detailed component data has never been so accessible. Just connect your component any way round and
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DCA55
GP23A
peak atlas DCA55
ATLAS dca55
DCA55
thyristor-triac specifications
A 103 TRANSISTOR pinout
220MV
ATLAS III
pinout all type of triac
how to test transistor
SK17
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PDF
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E317132
Abstract: ELECTROMAGNETIC Underwriters Laboratories
Text: FOKY2.E317132 - Electromagnetic Interference Filters - Component Page 1 of 1 FOKY2.E317132 Electromagnetic Interference Filters - Component Page Bottom Electromagnetic Interference Filters - Component See General Information for Electromagnetic Interference Filters - Component
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E317132
E317132
ELECTROMAGNETIC
Underwriters Laboratories
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PDF
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QII54005-10
Abstract: No abstract text available
Text: 6. Component Editor QII54005-10.0.0 The SOPC Builder component editor provides a GUI to support the creation and editing of the Hardware Component Description File _hw.tcl file that describes a component to SOPC Builder. You use the component editor to do the following:
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QII54005-10
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material declaration
Abstract: VO48
Text: 100% Material Declaration Data Sheet VO48 PK176 v2.0 February 12, 2008 Material Declaration Data Sheet Average Weight: 0.543 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight
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PK176
material declaration
VO48
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1747-CP3 CABLE CONFIGURATION
Abstract: 2711C-CBL-AB03 2711-CBL-PM05 1761-CBL-PM02 siemens mpi RS232 interface cable 2711C-T6T 2711C-T6C 2711C-CBL-UU02 2711C-K3M 2711C-T10C
Text: Technical Data PanelView Component Specifications Catalog Numbers 2711C-F2M, 2711C-K2M, 2711C-T3M, 2711C-K3M, 2711C-T6M, 2711C-T6C, 2711C-T6T, 2711C-T10C PanelView Component Family Topic Page PanelView Component Family 1 Environmental Specifications 2 Certifications
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2711C-F2M,
2711C-K2M,
2711C-T3M,
2711C-K3M,
2711C-T6M,
2711C-T6C,
2711C-T6T,
2711C-T10C
Micro800
RA-DU002,
1747-CP3 CABLE CONFIGURATION
2711C-CBL-AB03
2711-CBL-PM05
1761-CBL-PM02
siemens mpi RS232 interface cable
2711C-T6T
2711C-T6C
2711C-CBL-UU02
2711C-K3M
2711C-T10C
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PDF
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pl232
Abstract: PL-232 34590-94-8 silver sulfate 14808-60-7 epoxy resin PK232
Text: 100% Material Declaration Data Sheet FT64 PK232 v1.0 May 6, 2008 100% Material Declaration Data Sheet Average Weight: 0.245 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight
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PK232
pl232
PL-232
34590-94-8
silver sulfate
14808-60-7
epoxy resin
PK232
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PDF
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pk205
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet PC20 PK205 v1.1 January 16, 2012 Average Weight: 0.68189g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die attach material Mold Compound 7440-21-3 100.00 Component % of Total
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PK205
68189g
pk205
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pollution
Abstract: No abstract text available
Text: Product catalogue | Electronics housings | Component housings for mounting on DIN rail | CH20M - modular component housing | CH20M6 - modular component housing, width of 6 mm General ordering data Order No. Part designation Version 2418600000 CH20M6 BP 4P-4P BK
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CH20M
CH20M6
SolidCH20M6
pollution
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BT 8123
Abstract: FF484
Text: 100% Material Declaration Data Sheet FF484 PK402 v1.2 September 28, 2012 Average Weight: 4.1856g Component Substance Description CAS Number or Description Percentage of Component Silicon Die (FPGA) Doped silicon 7440-21-3 Use in Product Component Weight/
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FF484
PK402
1856g
secret19/10
BT 8123
FF484
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PDF
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Untitled
Abstract: No abstract text available
Text: PK582 v1.0 September 21, 2012 100% Material Declaration Data Sheet FGG400 XC3S400AN Average Weight: 2.0000 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/
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PK582
FGG400
XC3S400AN
12visions
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PDF
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Untitled
Abstract: No abstract text available
Text: PK225 v1.1 September 21, 2012 100% Material Declaration Data Sheet for FF1136 Package Average Weight: 9.9112 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon 7440-21-3 100.00 Solder Bump Component Weight/ Substance Weight
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PK225
FF1136
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PDF
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Untitled
Abstract: No abstract text available
Text: PK584 v1.0 September 28, 2012 100% Material Declaration Data Sheet FG400 XC3S400AN Average Weight: 2.0455 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/
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PK584
FG400
XC3S400AN
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PDF
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butyrolactone
Abstract: xilinx so20
Text: 100% Material Declaration Data Sheet SO20 PK209 v1.1 January 16, 2012 Average Weight: 0.5610 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Component % of Total
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PK209
butyrolactone
xilinx so20
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PDF
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Untitled
Abstract: No abstract text available
Text: PK394 v1.1 January 16, 2012 100% Material Declaration Data Sheet for XC3S1400AN FGG676 Package Average Weight: 3.188g Component Silicon Die (FPGA) Substance Description Silicon CAS# or Description 7440-21-3 % of Component 100.00 Silicon Die (PROM) Component Weight/
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PK394
XC3S1400AN
FGG676
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PDF
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E172884
Abstract: Underwriters Laboratories
Text: NKCR2.E172884 - Auxiliary Devices - Component Page 1 of 1 NKCR2.E172884 Auxiliary Devices - Component Page Bottom Print-friendly version Questions? Previous Page Auxiliary Devices - Component See General Information for Auxiliary Devices - Component E172884
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E172884
E172884
Underwriters Laboratories
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PDF
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FF784
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet FF784 PK404 v1.2 September 28, 2012 Average Weight: 5.5545 g Component Silicon Die (FPGA) Substance Description Doped silicon CAS Number or Description 7440-21-3 Percentage of Component Use in Product Component Weight/
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FF784
PK404
M30/10
FF784
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PDF
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FT256
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet FT256 PK158 v1.3 July 27, 2012 Average Weight: 0.7530g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon 7440-21-3 100.00 Die Attach Use in Product Component Weight/
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FT256
PK158
7530g
7440-22-d
FT256
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PDF
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Untitled
Abstract: No abstract text available
Text: Component Data
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OCR Scan
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PDF
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Untitled
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for VQG64 Package PK129 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/
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VQG64
PK129
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PDF
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Untitled
Abstract: No abstract text available
Text: PK171 v1.3 November 18, 2011 100% Material Declaration Data Sheet for VQ44 Package Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/
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PK171
7440-mponent
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PDF
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Untitled
Abstract: No abstract text available
Text: PK130 v1.4 August 24, 2012 100% Material Declaration Data Sheet for VQG100 Package Average Weight: 0.5392 g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Component Weight/
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PK130
VQG100
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PDF
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Untitled
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for VQ44 Package PK171 v1.4 August 24, 2012 Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/
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PK171
7440-31-5ptions
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PDF
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Untitled
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for VQ64 Package PK172 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/
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PK172
7440-31-5ptions
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