cerdip z PACKAGE
Abstract: No abstract text available
Text: a 8-Lead CERDIP Package Z-Suffix Dimensions shown in inches and (mm) 0.005 (0.13) MIN 8 0.055 (1.4) MAX 5 0.310 (7.87) 0.220 (5.59) PIN 1 1 4 0.100 (2.54) BSC 0.320 (8.13) 0.290 (7.37) 0.405 (10.29) MAX 0.200 (5.08) MAX 0.200 (5.08) 0.125 (3.18) 0.060 (1.52)
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Lattice Semiconductor Package Diagrams 256-Ball fpBGA
Abstract: LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304
Text: Package Diagrams October 2011 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL
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20-Pin
300-Mil)
208-ball
25-ball
332-ball
100-pin
120-pin
128-pin
160-pin
208-pin
Lattice Semiconductor Package Diagrams 256-Ball fpBGA
LAttice top marking
BB 1704
672-BALL
SCM40
AC12
MO-220
MO-275
84 pin plcc lattice dimension
fcbga-304
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d1684
Abstract: 84-Pin QFN FCBGA304 1704B MachXO2 Family Lattice Semiconductor Package Diagrams 256-Ball fpBGA 132-ball 284-BA x45e2
Text: Package Diagrams November 2012 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL
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20-Pin
300-Mil)
GS-003.
d1684
84-Pin QFN
FCBGA304
1704B
MachXO2 Family
Lattice Semiconductor Package Diagrams 256-Ball fpBGA
132-ball
284-BA
x45e2
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CDFP3-F28
Abstract: GDIP1-T28 HS1-1840RH-8 HS1-1840RH-Q HS-1840RH HS9-1840RH-Q 1840RH HS1840RH
Text: HS-1840RH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection March 1995 Features Pinouts • Radiation Environment - Gamma Rate γ 1 x 108 RAD(Si)/s - Gamma Dose (γ) 2 x 105 RAD(Si) HS1-1840RH 28 LEAD SIDEBRAZE CERDIP
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HS-1840RH
HS1-1840RH
GDIP1-T28,
MIL-STD-1835
1000ns
038mm)
CDFP3-F28
GDIP1-T28
HS1-1840RH-8
HS1-1840RH-Q
HS-1840RH
HS9-1840RH-Q
1840RH
HS1840RH
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14.5M 1982
Abstract: AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40
Text: Package Diagrams November 2010 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL
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20-Pin
300-Mil)
1020-ball
1152-ball
1704-ball
492-Ball
208-ball
25-ball
332-ball
100-pin
14.5M 1982
AC12
MO-220
MO-275
ANSI Y14.5
FCBGA304
fcbga-304
ansi-y14.5m-1982
LAttice bottom marking
SCM40
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OP42
Abstract: TL072 AD712 LT1057 MC34082 OP215 OP249 pm7545 c3999
Text: a Dual, Precision JFET High-Speed Operational Amplifier OP249 PIN CONNECTIONS +IN A 3 A B – + + – 4 V– 8 V+ 7 OUT B 2 1 20 19 NC 3 V+ NC OUT A 1 –IN A 2 NC 20-Terminal LCC RC Suffix 8-Lead Cerdip (Z Suffix), 8-Lead Plastic Mini-DIP (P Suffix) OUT A
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OP249
20-Terminal
AD712,
LT1057,
OP215,
TL072
MC34082
OP42
AD712
LT1057
MC34082
OP215
OP249
pm7545
c3999
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QP7C291
Abstract: 5962-8765004LA
Text: QP7C291A / QP7C292A March 28, 2006 2K x 8 Reprogrammable PROM Features • 5V ±10% VCC, commercial, industrial and military • Direct replacement for Cypress PROMs • Windowed Packages available for reprogrammability • Direct replacement for bipolar PROMs
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QP7C291A
QP7C292A
300-mil
600-mil
QP7C291A,
QP7C292A
Mil-Std-1835
Mil-Std-883
Mil-PRF-38535,
QP7C291
5962-8765004LA
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GDIP1-T24
Abstract: CYPRESS 7C291A QP7C291A-50WMB QP7C291AL-35JI GDIP3-T24 7C291A 5962-8873402la 5962-8765002JA QP7C291A-35TMB 600-MIL
Text: QP7C291A / QP7C292A October 9, 2007 2K x 8 Reprogrammable PROM Features • 5V ±10% VCC, commercial, industrial and military • Direct replacement for Cypress PROMs • Windowed Packages available for reprogrammability • Direct replacement for bipolar PROMs
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QP7C291A
QP7C292A
300-mil
600-mil
QP7C291A,
QP7C292A
paC291A
Mil-Std-1835
GDIP1-T24
CYPRESS 7C291A
QP7C291A-50WMB
QP7C291AL-35JI
GDIP3-T24
7C291A
5962-8873402la
5962-8765002JA
QP7C291A-35TMB
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CERAMIC LEADLESS CHIP CARRIER
Abstract: cerdip z PACKAGE DIODE SMD A6 cy7c291 CY7C293A-30QMB PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC w14 smd transistor CY7C291A CY7C292A CY7C293A
Text: 1CY 7C29 2A CY7C291A CY7C292A/CY7C293A 2K x 8 Reprogrammable PROM Features identical, but are packaged in 300-mil 7C291A, 7C293A and 600-mil wide plastic and hermetic DIP packages (7C292A). The CY7C293A has an automatic power down feature which reduces the power consumption by over 70% when deselected. The 300-mil ceramic package may be equipped with an
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CY7C291A
CY7C292A/CY7C293A
300-mil
7C291A,
7C293A)
600-mil
7C292A)
CY7C293A
300-mil
CERAMIC LEADLESS CHIP CARRIER
cerdip z PACKAGE
DIODE SMD A6
cy7c291
CY7C293A-30QMB
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
w14 smd transistor
CY7C291A
CY7C292A
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C2716
Abstract: C2717 C2718 w16 SMD CY7C271-45WC cy7c271 cy7c271-45wmb
Text: CY7C271 CY7C274 32K x 8 Power Switched and Reprogrammable PROM Features HIGH , the 7C271/7C274 automatically powers down into a low-power stand-by mode. The CY7C271 is packaged in the 300-mil slim package. The CY7C274 is packaged in the industry standard 600-mil package. Both the 7C271 and 7C274 are
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CY7C271
CY7C274
300-mil
7C271)
7C271/7C274
CY7C274
600-mil
7C271
C2716
C2717
C2718
w16 SMD
CY7C271-45WC
cy7c271-45wmb
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semiconductor c243
Abstract: transistor c243 CY7C243-45QMB c243 diode c2432 C2434 C2437 cerdip z PACKAGE DN2540N5-G CY7C243
Text: 1CY 7C24 4 CY7C243 CY7C244 4Kx8 Reprogrammable PROM Features Functional Description • CMOS for optimum speed/power The CY7C243 and CY7C244 are high-performance 4K x 8 CMOS PROMs. The CY7C243 and CY7C244 are packaged in 300-mil-wide and 600-mil-wide packages respectively. The reprogrammable packages are equipped with an erasure window. When exposed to UV light, these PROMs are erased and
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CY7C243
CY7C244
CY7C243
CY7C244
300-mil-wide
600-mil-wide
semiconductor c243
transistor c243
CY7C243-45QMB
c243 diode
c2432
C2434
C2437
cerdip z PACKAGE
DN2540N5-G
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7C271
Abstract: 7C274 CY7C271 CY7C274
Text: 74 CY7C271 CY7C274 32K x 8 Power Switched and Reprogrammable PROM HIGH , the 7C271/7C274 automatically powers down into a low-power stand-by mode. The CY7C271 is packaged in the 300-mil slim package. The CY7C274 is packaged in the industry standard 600-mil package. Both the 7C271 and 7C274 are
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CY7C271
CY7C274
7C271/7C274
CY7C271
300-mil
CY7C274
600-mil
7C271
7C274
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C2613
Abstract: C2614 c2615 C2611 C2617 7C261 7C264 CY7C261 CY7C263 CY7C264
Text: CY7C261 CY7C263/CY7C264 8K x 8 Power-Switched and Reprogrammable PROM Features Functional Description The CY7C261, CY7C263, and CY7C264 are high-performance 8192-word by 8-bit CMOS PROMs. When deselected, the 7C261 automatically powers down into a low-power standby mode. It is packaged in a 300-mil-wide package. The 7C263
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CY7C261
CY7C263/CY7C264
CY7C261,
CY7C263,
CY7C264
8192-word
7C261
300-mil-wide
7C263
7C264
C2613
C2614
c2615
C2611
C2617
CY7C261
CY7C263
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Untitled
Abstract: No abstract text available
Text: ANALOG DEVICES FEA TU RES HIGH SPE E D 50 M H z Unity Gain Stable Operation 300 V/ is Slew Rate 120 ns Settling Time Drives Unlimited Capacitive Loads High Speed, Low Power Dual Op Amp CONNECTION DIAGRAMS 8-Pin Plastic (N and Cerdip (Q) Packages 16-Pin Small Outline
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EIA-481A
16-Pin
20-Pin
AD827
AD539
AD827
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27C400 eprom
Abstract: 27C400 AU-AIS intel i5 27C400-150V10 27C400-200V10 intel 2802 D814 diagram BY524 D814
Text: 27C400 4M 256K x 16 or 512K x 8 CHMOS EPROM • . • Word-Wide or Byte-Wide Configurable ■ 4M 40-Pin Mask ROM Compatible -4 0 -L e a d CERDIP Package ■ Low Power Dissipation — 50 m A M ax A c tiv e @ 5 M H z — 100 ju.A Max Standby ■ High Performance
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27C400
40-Pin
40-Lead
27C400
27C400 eprom
AU-AIS
intel i5
27C400-150V10
27C400-200V10
intel 2802
D814 diagram
BY524
D814
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Untitled
Abstract: No abstract text available
Text: PACKAGE DIAGRAM O U T L I N E S CERDIP C o n t in u e d REV DCN 04 17521 _ DESCRIPTION_ U PD A TE D 05 I8089 REVI SED 06 ? ? ' TO S T A N D A R D I Z E A, CHA NGED — — rh r~ i >=zp— ^ Q, & S DIMENSIONS b1 MIN DATE APPROVED 06/20/90
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D18-1
08OTES:
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Untitled
Abstract: No abstract text available
Text: HS-1840RH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection March 1995 Features • Pinouts Radiation Environment - Gamma Rate ^ 1 x 108 RAD(Si)/s - Gamma Dose (y) 2 x 105 RAD(Si) HS1-1840RH 28 LEAD SIDEBRAZE CERDIP
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HS-1840RH
HS1-1840RH
GDIP1-T28,
MIL-STD-1835
1000ns
500MQ
038mm)
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Untitled
Abstract: No abstract text available
Text: *S Y N E R G Y L 0 G IC ORDERIN G INFORMATION S E M IC O N D U C T O R SY XXX XXX XXX H SPECIAL PROCESSING if any B = Burn-In TR= Tape and Reel H TEM PERATURE RANGE C= I= Commercial Industrial H PACKAGE IDENTIFIER D= F= J= P= Z= X= H Cerdip Cerpack PLCC (Plastic Leaded Chip Carrier)
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Super-300K
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Untitled
Abstract: No abstract text available
Text: *SYNERGY lo g ic o r d e r in g in fo rm a tio n S E M IC O N D U C T O R SY XXX XXX XXX SPECIAL PROCESSING if any B = Burn-In TR = Tape and Reel TEM PERATURE RANGE C= I= Commercial Industrial PACKAGE IDENTIFIER D= F= J= P= Z= X= Cerdip Cerpack PLCC (Plastic Leaded Chip Carrier)
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Super-300K
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IC LM 7812
Abstract: No abstract text available
Text: THOM SO N MIL ET S P A T I A U X SSE D • =102bô72 DDD 0 4^ S 3ai ■ THCM LINEAR COMPONENTS DESCRIPTION PRODUCT PACKAGE en o_ CO GO c o LU 1— "O CN a L l_ Z ït ; • £ <r> <=> O ' « w '• KJ LU s 5 c o LU COMPARATORS - SINGLE LM 111 TO 99 CERDIP 8
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Untitled
Abstract: No abstract text available
Text: PACKAGE DIAGRAM OUTLIN ES CERDIP C o n tin u e d R EV DON 06 175 17 _DESCRIPTION_ U P D A TE D TO S T A N D A R D I Z E DATE APPROVED DWG e " ü cz? cz? mp czp ü ü ü Ü Ü Ü cz? S1 ill A -SEATING P L A N E NOTES: ( U N L E S S OTHERWISE SPECI FI ED)
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D24-1
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556 IC TIMER
Abstract: Dual 8 pin DIL 555 IC ic 556 dual timer ic 555 timer ic 555 8 pin
Text: T H O M SO N MIL ET S P A T I A U X SSE D • ^Q2bfl72 O D D O M T ? ISM B I T H C M LINEAR COMPONENTS 7 o_ DESCRIPTION PRODUCT PACKAGE LLJ ►— c o oo 0 9 Q S CO oo oo 'O OS z FILTERS TS 8511 Low pass cauer 7th order filter + 2 op-amps CERDIP 16 CERAM IC DIL 16
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Q2bfl72
556 IC TIMER
Dual 8 pin DIL 555 IC
ic 556 dual timer
ic 555 timer
ic 555 8 pin
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AD797
Abstract: No abstract text available
Text: 21 - • » 09 • A * i i i i :® E : 0 . 9 n V / / 'H z 61kHz ♦THD:-120dB («20kHz) I x - h :20V /ß n tt s m x tiV B . ♦ i Ü Ä S ü t :50mA a fé x?im-AW± v o n sm 'm V o w ssssgö AtlMTmS. • t.° V'SfUt® 8-Pin Plastic Mini-DIP (N), Cerdip (Q) and SOIC (R)
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AD797
-120dB
20kHz)
AD797A/S
AD797B
-20kHz,
Av-10,
AD797
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diode U3J
Abstract: Smd diode u3j csi24 CY7C292A-20DC CY7C291A-35DMB
Text: CY7C291A CY7C292A/CY7C293A P Yi.PX : V«*1 2K X 8 Reprogrammable PROM identical, but are packaged in 300-mil 7C291A, 7C293A and 600-mil wide plastic and hermetic DIP packages (7C292A). The CY7C293A has an automatic power down feature which reduces the power consumption by over 70% when deselect
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300-mil
600-mil
CY7C291A
CY7C292A/CY7C293A
300-mil
7C291A,
7C293A)
7C292A)
CY7C293A
diode U3J
Smd diode u3j
csi24
CY7C292A-20DC
CY7C291A-35DMB
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