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    CERAMIC CHIP CARRIER LCC 28 Search Results

    CERAMIC CHIP CARRIER LCC 28 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R80186 Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 Visit Rochester Electronics LLC Buy
    5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    MR82510/B Rochester Electronics LLC Serial I/O Controller, 1 Channel(s), CMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    X28C512EM-12 Rochester Electronics LLC EEPROM, 64KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Visit Rochester Electronics LLC Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    CERAMIC CHIP CARRIER LCC 28 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
    Text: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40mil Package width x package length 420 × 420mil Sealing method Metal seal LCC-32C-A06 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		PDF LCC-32C-A06 WQFN032-C-S420-1 40mil 420mil 32-pad LCC-32C-A06) C32007SC-4-3 CERAMIC LEADLESS CHIP CARRIER a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 68 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1
    Text: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 Lead pitch 50mil Package width x package length 450 × 550mil Sealing method Metal seal 32-pad ceramic LCC LCC-32C-A01 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		PDF LCC-32C-A01 WQFN032-C-R450-1 50mil 550mil 32-pad LCC-32C-A01) CERAMIC LEADLESS CHIP CARRIER 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 68 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1

    kyocera CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
    Text: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count


    Original     		PDF STK11C68-L STK12C68-L STK14C88-L STK-91-01-2303 PB-CA1771 STK-91-01-2803 STK-40-05-007 MO-041 CQCC3-N28 5x10-8 kyocera CERAMIC LEADLESS CHIP CARRIER LCC Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40 mil Package width x package length 420 × 420 mil Sealing method Metal seal


    Original     		PDF LCC-32C-A06 WQFN032-C-S420-1 32-pad LCC-32C-A06) C32007SC-4-3 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal


    Original     		PDF LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32

    Untitled

    Abstract: No abstract text available
    Text: 8 Megabit FLASH EEPROM DPZ1MM8NG DESCRIPTION: The DPZ1MM8NG is a 1 Meg x 8 CMOS FLASH Electrically Erasable and Programmable nonvolatile memory devices. The DPZ1MM8NG is a 40 Pin ceramic Leadless Chip Carrier LCC , hermetically sealed making the module suitable for commercial,


    Original     		PDF 150ns 30A136-00

    E-44-1

    Abstract: 44-Terminal CERAMIC LEADLESS CHIP CARRIER LCC 44
    Text: 0.100 2.54 0.064 (1.63) 44-Terminal Ceramic Leadless Chip Carrier [LCC] (E-44-1) Dimensions shown in inches and (millimeters) 0.055 (1.40) 0.045 (1.14) 40 39 0.662 (16.82) SQ 0.640 (16.27) 0.050 (1.27) BSC 0.075 (1.91) REF 44 6 1 7 0.028 (0.71) 0.022 (0.56)


    Original     		PDF 44-Terminal E-44-1) 22106-A E-44-1 CERAMIC LEADLESS CHIP CARRIER LCC 44

    7142LA25L48B

    Abstract: 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA
    Text: IDT Military Offerings FIFO Military Offerings Logic Military Offerings Multi-Port Military Offerings SRAM Military Offerings May 2005 FIFO Military Offerings FIFO Military Selector Guide by Part Number FIFO Military Selector Guide (by SMD Number) Obsolete Part List and Replacement Guide


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 7200L20TDB 7200L30TDB 7201LA20DB 7201LA30DB 7142LA25L48B 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA

    IDT54FCT541ATDB

    Abstract: 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA
    Text: FIFO MILITARY SELECTOR GUIDE As Of: November 1, 2001 FIFO Military Offerings Page FIFO Military Selector Guide by Part Number . 3-4 FIFO Military Selector Guide (by SMD Number) . 5 Obsolete Part List and Replacement Guide . 6-8


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 72404L15DB 72404L35DB 7200L20TDB 7200L30TDB IDT54FCT541ATDB 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA

    CERAMIC LEADLESS CHIP CARRIER LCC 68

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		PDF 180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC

    LM747 pinout

    Abstract: LM741 pinout LM741 op amp datasheet and circuit 8601401HX LM741 block diagram LM741 LM741 Application LM741 regulator lm741 comparator lm723 14 pin
    Text: Mil Aero Analog Surface Mount Products General Description Features National Semiconductor’s Mil Aero Analog Group offers a large range of military qualified linear devices in surface mount configurations Hardware is available in two small hermetically sealed outlines the Leadless Chip Carrier


    Original     		PDF MIL-STD-883 MIL-M-38510 LM747 pinout LM741 pinout LM741 op amp datasheet and circuit 8601401HX LM741 block diagram LM741 LM741 Application LM741 regulator lm741 comparator lm723 14 pin

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: NEW ENGLAND SEMICONDUCTOR POWER MOSFETS N CHANNEL LCC-3 PACKAGE LCC-3 CERAMIC CHIP CARRIER s✓ b v dss VOLTS PEAK Id AMPS R dS oii @0.5 ID OHMS Qg nc Ciss pf* NSLC120 100 9.2 0.27 15 350 NSLC220 200 5.0 0.80 15 450 NSLC320 400 3.3 1.80 20 350 NSLC420 500


    OCR Scan     		PDF NSLC120 NSLC220 NSLC320 NSLC420 NSLC130 NSLC230 NSLC140 NSLC240 NSLC340 NSLC440

    Untitled

    Abstract: No abstract text available
    Text: MOSFETS N CHANNEL POWER MOSFETS - SURFACE MOUNT PACKAGE LCC-3 CERAMIC CHIP CARRIER cy>*S VOr DEVICE TYPE r DS ON CISS p f* VOLTS PEAK 'd AMPS SNLC120 100 9.2 0.27 15 350 SNLC220 200 5.0 0.80 15 450 SNLC320 400 3.3 1.80 20 350 SNLC420 500 2.5 3.08 20 350 SNLC130


    OCR Scan     		PDF SNLC320 SNLC420 SNLC130 SNLC230 SNLC330 SNLC430 SNLC140 SNLC240 SNLC340 SNLC440

    Dense-Pac Microsystems dpz1MM

    Abstract: DPZ1M
    Text: DENSE-PAC 8 Megabit FLASH EEPROM VI I C K O S Y ST HM $ D PZ1M M 8N G D E SC R IP T IO N : The DPZ1MM8NG is a 1 Meg x 8 CMOS FLASH Electrically Erasable and Programmable nonvolatile memory devices. The DPZ1MM8NC is a 40 Pin ceramic Leadless Chip Carrier LCC , hermetically


    OCR Scan     		PDF 150ns 100ns 120ns 30A136-00 Dense-Pac Microsystems dpz1MM DPZ1M

    Untitled

    Abstract: No abstract text available
    Text: 19-2863; Rev O; 7/90 , /M /JX IA 1 Low-Powor, M onolithic CMOS Analog M ultiplexers _ General Description .Applications Control Systems Fmaturmm ♦ Drop-In Upgrade for Industry-Standard ’7501/7502/7503" ♦ Low-Power Consumption: 6mW Max ♦ Operable with ±4.5V to ±18V Supplies


    OCR Scan     		PDF MX7501KN MX7501C/D* MX7501JN MX7501/7502/7503

    Untitled

    Abstract: No abstract text available
    Text: MSM4256K/V/W/J-45/55/70 Issue 1.0 : September 1989 256K X 4 M o n o l i th ic CMOS SRAM MSM4256K/V/W/J ADVANCE PRODUCT INFORMATION 262,144 x 4 CMOS High Speed Static RAM Features Pin Definition Package Type - ’K ,'V Fast Access Times of 45/55/70 nS JEDEC Standard 28 pin DIP Footprint


    OCR Scan     		PDF MSM4256K/V/W/J-45/55/70 MSM4256K/V/W/J 350mW MIL-STD-883B MSM4256KLMB-10 MIL-STD-883B

    mx7508

    Abstract: MX7502SQ
    Text: 19-2863; Rev 0; 7/90 / k l/ I X I A 1 Low-Powor, M onolithicf CMOS Analog M u ltip lo x o n _ Featu its ♦ Drop-In Upgrade for induatry-Standard ‘7501/750 7503" ♦ Low-Power Consumption: 6mW Max ♦ Operable with ±4.5V to ±18V SuppIlM


    OCR Scan     		PDF MX7501/7502/7503 MX7501 MX7502 MX7508 MX7501, MX7502SQ

    28dw6

    Abstract: atmel 614 J029 CERAMIC LEADLESS CHIP CARRIER AT27HC256 AT27HC256R at27hc256rl-70di AT27HC256RL AT27HC256R-55 5962-86063 01
    Text: it *• Features • Bipolar Speed in JEDEC Standard EPROM Pinout Read Access Time - 55ns 28-Lead 600 mil CERDIP and OTP Plastic DIP 32-Pad LCC, JLCC and OTP PLCC • Low Power CMOS Operation 100 jiA max. Standby 50 mA max. Active at 10 MHz • High Output Drive Capability


    OCR Scan     		PDF 28-Lead 32-Pad AT27HC256/L AT27HC256R AT27HC256RL AT27HC256R/RL OO89A-120O 28dw6 atmel 614 J029 CERAMIC LEADLESS CHIP CARRIER AT27HC256 AT27HC256R at27hc256rl-70di AT27HC256RL AT27HC256R-55 5962-86063 01

    Untitled

    Abstract: No abstract text available
    Text: Features • Bipolar Speed in JEDEC Standard EPROM Pinout Read Access Time • 55ns 28-Lead 600 mil CERDIP and OTP Plastic DIP 32-Pad LCC, JLCC and OTP PLCC • Low Power CMOS Operation 100 jiA max. Standby 50 mA max. Active at 10 MHz • High Output Drive Capability


    OCR Scan     		PDF 28-Lead 32-Pad AT27HC256/L 089A-12/90

    RC 7503

    Abstract: ST 7502 MX7501 MX7501JN MX7501JQ MX7501KN MX7501KQ MX7501SQ MX7502 MX7503
    Text: 19-2863; Rev O; 7/90 , /M /JX IA 1 Low-Powor, Monolithic CMOS Analog Multiplexers _ General Description .Applications Control Systems Fmaturmm ♦ Drop-In Upgrade for Industry-Standard ’7501/7502/7503" ♦ Low-Power Consumption: 6mW Max ♦ Operable with ±4.5V to ±18V Supplies


    OCR Scan     		PDF MX7501/7502/7503 MX7501 MX7502 MX7503 MX7501, RC 7503 ST 7502 MX7501JN MX7501JQ MX7501KN MX7501KQ MX7501SQ

    Untitled

    Abstract: No abstract text available
    Text: AT27HC256R/RL Features • Bipolar Speed in JEDEC Standard EPROM Pinout Read Access Time - 55ns 28-Lead 600 mil CERDIP and OTP Plastic DIP 32-Pad LCC, JLCC and OTP PLCC • Low Power CMOS Operation 100 |xA max. Standby 50 mA max. Active at 10 MHz • High Output Drive Capability


    OCR Scan     		PDF AT27HC256R/RL 28-Lead 32-Pad 100ns/byte AT27HC256/L AD883C 28DW6 Military/883C