ACTEL CCGA 624 mechanical
Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections
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AC190
624-pin
CG624)
CG1152)
1272-pin
ACTEL CCGA 624 mechanical
CCGA
ACTEL CCGA 1152 mechanical
CG1152
pogo pin cleaning
CGS624
a440 ceramic
actel package mechanical drawing
RTAX2000
90Pb 10Sn solder paste
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LGA voiding
Abstract: CCGA APD-SCC-201 IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy
Text: CLASP CERAMIC COLUMN GRID ARRAY TECHNOLOGY FOR FLIP CHIP CARRIERS S. Ray, M. Interrante, L. Achard * , M. Cole, I. DeSousa(*), L. Jimarez, G. Martin, and C. Reynolds, IBM Microelectronics Division Hopewell Jct., NY (*) IBM Canada, Bromont, QUE Biography Sudipta Ray is a Senior Engineer in Interconnections
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67F4333,
F52977,
APD-SCC-201
LGA voiding
CCGA
IBM ccga
67F4333
ceramic rework
810E
N100
cte table flip chip substrate
cte table epoxy
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IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
Abstract: entek Cu-56 CCGA Kester 953 Flux PEAK TRAY bga IBM ccga 23n50 Cu-56 APD-SBSC-101 T- 200x thinner
Text: Ceramic Column Grid Array Assembly and Rework User’s Guide July 25, 2002 Copyright International Business Machines Corporation 2002. Copyright and Disclaimer All Rights Reserved Printed in the United States of America July 25, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or
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RAD750
Abstract: RAD750 processor RAD750 software reference manual RAD750 board software RAD750TM IBM ccga
Text: RAD750TM Microprocessor Datasheet Version 1.1 8/1/00 Lockheed Martin Space Electronics & Communications Systems Preliminary and subject to change without notice Cleared for Public Domain Release DoD/00-S-1682, 4/00 Notices Before using this information and the product it supports, be sure to read the general information on the
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RAD750TM
DoD/00-S-1682,
RAD750
RAD750 processor
RAD750 software reference manual
RAD750 board software
IBM ccga
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cmos XOR Gates
Abstract: IBM ccga
Text: IBM Microelectronics ASIC 5SE Standard Cell/Gate Array Value ASIC for high function and price-performance applications Highlights • Extensive portfolio of cores for your data processing, communications, and consumer applications • Designs up to 2.8 million gates
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07SA14217401*
SA14-2174-01
cmos XOR Gates
IBM ccga
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250 mhz IBM PowerPC Processor
Abstract: IBM PCI Express serdes architecture ibm ASIC SRAM SA-12E IBM ASIC Products ibm ip IBM supports ccga 0.25-um standard cell library IBM ASIC
Text: Standard cell/gate array ASIC for mainstream and cost-sensitive applications SA-12E ASIC Highlights Integration and performance deliver exceptional value. The IBM SA-12E ASIC is a standard 0.25-µm process technology cell and gate array ASIC, featuring a
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SA-12E
SA14-2173-03
250 mhz IBM PowerPC Processor
IBM PCI Express serdes architecture
ibm ASIC SRAM
IBM ASIC Products
ibm ip
IBM supports ccga
0.25-um standard cell library
IBM ASIC
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S1998
Abstract: Coffin-Manson Equation CBGA manson 100C 110C N100 N50M IBM supports ccga CBGA 304 motorola
Text: CBGA FATIGUE LIFE IMPROVEMENT Marie S. Cole, Gregory B. Martin, Peter J. Brofman and Lewis S. Goldmann IBM Microelectronics Hopewell Jct, New York 12533 Biography Marie Cole is a Senior Engineer in Ceramic Packaging Applications at IBM Microelectronics. She holds a B.S.
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IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
Abstract: senju solder bar Coffin-Manson Equation senju solder paste vps BGA reflow guide BGA PROFILING Senju metal solder paste Cu-56 entek Cu-56 06107
Text: CBGA Surface Mount Assembly and Rework User’s Guide May 23, 2002 Copyright International Business Machines Corporation 2002. Copyright and Disclaimer All Rights Reserved Printed in the United States of America May 23, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or
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SA-27E
Abstract: IBM PCI Express serdes architecture
Text: Standard cell/gate array ASIC for mainstream and cost-sensitive applications requiring fast time-to-market SA-27E ASIC Highlights Integration and performance deliver exceptional value. The IBM SA-27E ASIC is a dense, • Gate delay: 33 picoseconds
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SA-27E
SA14-2183-03
IBM PCI Express serdes architecture
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SA-27
Abstract: ibm ASIC SRAM IBM ASIC 0.03 um CMOS technology
Text: ASIC for high performance and high density applications ASIC SA-27 Standard Cell/Gate Array Highlights 0.12 µm effective channel length high performance Designs of up to 12 million gates Copper metallurgy for high performance in sub-quartermicron technology
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SA-27
07SA14217201*
SA14-2172-01
ibm ASIC SRAM
IBM ASIC
0.03 um CMOS technology
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27e transistor
Abstract: IBM "embedded dram" SA-27E SA-27 epbga ibm sram
Text: Standard cell/gate array value ASIC for high-function, high-density applications Blue Logic SA-27E ASIC Highlights Embedded DRAM with integrated built-in self test and redundancy Copper metallurgy for price/ performance in sub-0.18 µm logic process 0.11 µm effective channel length
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SA-27E
SA-27
07SA14218301*
SA14-2183-01
27e transistor
IBM "embedded dram"
epbga
ibm sram
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ibm ASIC SRAM
Abstract: xnor cmos SA-12E ccga IBM IBM ccga
Text: Value ASIC for high function and price-performance applications ASIC SA-12E Standard Cell/Gate Array Highlights Extensive portfolio of cores 0.18 µm effective channel length high performance Designs of up to 10 million gates 0.05 µW/MHz/gate power dissipation
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SA-12E
07SA14217302*
SA14-2173-02
ibm ASIC SRAM
xnor cmos
ccga IBM
IBM ccga
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ibm ASIC SRAM
Abstract: IBM "embedded dram" IBM supports ccga
Text: Standard cell/gate array ASIC for high-function, high-density applications Blue Logic Cu-11 ASIC Highlights 0.11-µm L drawn enables designs of up to 40 million gates Advanced technologies include copper metallurgy and low-k dielectric Choice of packaging options
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Cu-11
07SA14245100*
SA14-2451-00
ibm ASIC SRAM
IBM "embedded dram"
IBM supports ccga
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SA-12E
Abstract: SA-27 SA-27E xnor cmos IBM ASIC Products SA-12
Text: Premium ASIC for high performance, high density, and low power applications ASIC SA-12 Standard Cell/Gate Array Highlights 0.18 µm effective channel length high performance Up to 3.4 million wireable gates in production today Optimized for low 2.5 volt operation
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SA-12
07SA14216503*
SA14-2165-03
SA-12E
SA-27
SA-27E
xnor cmos
IBM ASIC Products
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ceramic rework
Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability
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25x25x1
ceramic rework
CCGA
BGA Solder Ball collapse
90Pb 10Sn solder paste
304-pin ltcc
MPC105
MPC106
MPC107
BGA PROFILING
spray nozzles
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P09N03
Abstract: No abstract text available
Text: PRELIMINARY PMC-Sierra, Inc. PM9311/2/3/5 ETT1 CHIP SET Data Sheet PMC-2000164 ISSUE 1 ENHANCED TT1™ SWITCH FABRIC PM9311/2/3/5 Enhanced TT1 Chip Set Enhanced TT1 Switch Fabric Datasheet Preliminary: April 2000 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
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PMC-2000164
PM9311/2/3/5
P09N03
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76byte
Abstract: 386 chip set f10 60s 6K229 siemens confidential Mechanical Incremental Encoder Type E33 MM 74 HC 221 N siemens k25 624 CCGA DIODE C04 06
Text: Released PMC-Sierra, Inc. PM9311/2/3/5 ETT1 CHIP SET Data Sheet PMC-2000164 ISSUE 3 ENHANCED TT1™ SWITCH FABRIC PM9311/2/3/5 Enhanced TT1 Chip Set Enhanced TT1 Switch Fabric Datasheet Issue 3: August 2001 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
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PM9311/2/3/5
PMC-2000164
PM9311/2/3/5
76byte
386 chip set
f10 60s
6K229
siemens confidential
Mechanical Incremental Encoder Type E33
MM 74 HC 221 N
siemens k25
624 CCGA
DIODE C04 06
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aett1
Abstract: R13 p2f CRC-16 PM9311-UC PM9312-UC PM9313-HC PM9315-HC CRC-16 SIEMENS
Text: Released PMC-Sierra, Inc. PM9311/2/3/5 ETT1 CHIP SET Data Sheet PMC-2000164 ISSUE 4 ENHANCED TT1™ SWITCH FABRIC PM9311/2/3/5 Enhanced TT1 Chip Set Enhanced TT1 Switch Fabric Datasheet Issue 4: March 2002 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
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PM9311/2/3/5
PMC-2000164
PM9311/2/3/5
aett1
R13 p2f
CRC-16
PM9311-UC
PM9312-UC
PM9313-HC
PM9315-HC
CRC-16 SIEMENS
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Untitled
Abstract: No abstract text available
Text: Released PMC-Sierra, Inc. PM9311/2/3/5 ETT1 CHIP SET Data Sheet ISSUE 4 ENHANCED TT1™ SWITCH FABRIC 4 01 :1 6: 06 PM PMC-2000164 ct ob er ,2 00 PM9311/2/3/5 Fr id ay ,2 9O Enhanced TT1 Chip Set in er In co n Enhanced TT1 Switch Fabric Issue 4: March 2002
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PM9311/2/3/5
PMC-2000164
PM9311/2/3/5
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PBGA 256 reflow profile
Abstract: bt 2328 pbga 144 BGA cte pbga JESD22-A113 OSP FLIPCHIP CRACK 304-pin dimensions bga jedec thermocouple WELD nsmd smd
Text: Customer Applications Support and Reliability Test Center Page 1 Motorola General Business Information Customer Applications Support and Reliability Test Center Customer support for new and current packaging technology; Package-to-board Interconnect reliability
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ibm x31
Abstract: NP4GS3 IBM3288H2848 PRS64G SA-27E powernp NAL10 sigma datacell IBM ccga IBM supports ccga
Text: IBM Packet Routing Switch PRS64G Datasheet July 10, 2001 Copyright and Disclaimer Copyright International Business Machines Corporation 2000, 2001 All Rights Reserved Printed in the United States of America July 2001 The following are trademarks of International Business Machines Corporation in the United States, or other countries,
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PRS64G
PRS64G
IBM32SW0640DSLCDA250
PRS64G.
IBM64G
PRS64G,
ibm x31
NP4GS3
IBM3288H2848
SA-27E
powernp
NAL10
sigma datacell
IBM ccga
IBM supports ccga
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ibm x31
Abstract: NP4GS3 13n06 IBM3288H2848 SA-27E
Text: IBM PowerPRS 64G Packet Routing Switch Datasheet July 2, 2002 Copyright and Disclaimer Copyright International Business Machines Corporation 2000, 2001, 2002 All Rights Reserved Printed in the United States of America July 2002 The following are trademarks of International Business Machines Corporation in the United States, or other countries,
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PRS64G
PRS64G,
ibm x31
NP4GS3
13n06
IBM3288H2848
SA-27E
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Untitled
Abstract: No abstract text available
Text: IBM Microelectronics ¿Æ i.I h!$& ¡Standard Cell/Gate Array Value ASICfor highjunction and price-performance applications P ro d u c t S p e c ific a tio n s H ig h lig h ts • Extensive portfolio o f cores for your data processing, communications, and
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OCR Scan
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07SA14217401
SA14-2174-01
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PDF
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P09N03
Abstract: dd3saa JDS oc-192 modulator
Text: preliminary D ata S heet PMC-2000164 PM | \ | PMC-Sierra, Inc. PM9311/2/3/5 ETT1 CHIP SET ISSUE 2 ENHANCED TT1 ™ SWITCH FABRIC PM9311/2/3/5 Enhanced TT1 Chip Set Enhanced TT1 Switch Fabric Datasheet
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OCR Scan
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PM9311/2/3/5
PMC-2000164
PMCSS00246
P09N03
dd3saa
JDS oc-192 modulator
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