Untitled
Abstract: No abstract text available
Text: AMPMODU Interconnection System Short Point Crimp Snap-In Receptacle Contacts Material and Finish .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp
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C7025,
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567297-2
Abstract: No abstract text available
Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp
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C7025,
567297-2
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PDF
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104480-9 crimp tool
Abstract: No abstract text available
Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish: Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A—Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin-lead in
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C7025,
104480-9 crimp tool
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PDF
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Untitled
Abstract: No abstract text available
Text: AMPMODU Interconnection System Short Point, Crimp Snap-In Wire-Applied Contacts and Housings Product Facts • Short point of contact mates with .169 [4.29] to .259 [6.58] long post ■ Double-row housings are end-to-end and side-to-side stackable ■ Terminates 32-20 AWG
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Untitled
Abstract: No abstract text available
Text: 104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-4 Product Details Active Print Email Check Pricing & Availability
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com/catalog/pn/en/104480-4
13-Jun-2012
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FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
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ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
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PDF
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C7025 strip specification
Abstract: 103960-1 tyco 108-25034 1307819 103672-3 103673-3 104480-9 crimp tool amp 20 pin shrouded header latches amp tyco applicator AMP Application Specification 114-25026
Text: Catalog 1307612 Revised 7-01 Product Facts • Receptacle assemblies mate with .025 [0.64] sq. posts; mating post length is .200 [5.08] min., .250 [6.35] max. ■ Proven AMPMODU receptacle contact design; dual cantilever beams, built-in antioverstress, completely
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Tyco 108-25007
Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
Text: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold
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tyco 108-25034
Abstract: 6-104909-5 103672-3 tyco 114-25026 103957-1 1-103688-3 5-103634-1 5-103735-9 5-103908-4 C7025
Text: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold
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530902-8
Abstract: 102387-3 1039799 82007 1307819 1-103686-5 Tyco crimp tool 91517-1 104480-8 2-87175-1 Tyco 108-25007
Text: AMPMODU Interconnection System Locking Clip Contacts and Housings Product Facts • Self-retaining contacts provide permanent connection with quick connect and disconnect ■ Fast, easy installation with no additional locking hardware required ■ Mates with .025 [0.64]
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E28476
530902-8
102387-3
1039799
82007
1307819
1-103686-5
Tyco crimp tool 91517-1
104480-8
2-87175-1
Tyco 108-25007
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PDF
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2032b
Abstract: 085002 6-103958-1 amp quality crimping handbook 87733-1 UL 2896 11027 UL 94v-2 mt 4407 1-87666-6
Text: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010
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244252
Abstract: 86016-2 crimp tool 16500-3 1307819
Text: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010
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0001AMPMODU
244252
86016-2 crimp tool
16500-3
1307819
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PDF
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AMPMODU I
Abstract: amp quality crimping handbook 244252 1-87666-6
Text: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010
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000150AMPMODU
AMPMODU I
amp quality crimping handbook
244252
1-87666-6
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PDF
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326 004 mte
Abstract: 5-147278-1 93 pin connector 534974-4 102387-3 1-87666-6 86016-2 102387-1 534204-5 534974-4 1-102536-1
Text: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010
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MO-83-AF
Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Text: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
MO-83-AF
PQFP moisture sensitive handling and packaging
footprint jedec MS-026 TQFP
schematic impulse sealer
BGA 11x11 junction to board thermal resistance
EIA standards 481
JEDEC MS-026 footprint
eftec 64
EFTEC-64
footprint jedec MS-026 TQFP 128
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PDF
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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din 42802
Abstract: AMP,simel insulated crimp lugs raychem catalog termination kit and splicing kit cma 10024 531220-2 simel AMP 2-520128-2 7483 Raychem 55A CATALOG 42770-2
Text: Catalog 296642 Focused Product Guide Revised 3-99 Input/Output Connectors Index Table of Contents Section One: Input/Output Connector Click Below Subminiature D, HDP-20 Crimp, Snap-In Connector AMPLIMITE Crimp, Snap-In Contacts and Solder Contacts, Size 20 D
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HDP-20
HDF-20
HDJ-20
HD-22
HD-20
HDE-20
Weight--14
din 42802
AMP,simel insulated crimp lugs
raychem catalog termination kit and splicing kit
cma 10024
531220-2
simel
AMP 2-520128-2
7483
Raychem 55A CATALOG
42770-2
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PDF
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JEDEC Package Code MS-026-AED
Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Text: • Packages and Thermal Characteristics November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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Untitled
Abstract: No abstract text available
Text: 1 , 5 t ° 05 s^g 0.3 3.3to 1 9.0 CIRCUIT DIAGRAM _r | (|) tu . to co ^ © © d) HOLE LAYOUT, TOP VIEW ^ 0 05 I 6x 00.9 C: COMMON PIN Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:
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300mA,
70mOhm
50/60Hz,
200gf
C7025,
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PDF
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Untitled
Abstract: No abstract text available
Text: 9.0 _r “L CO CO 1 = _ !_ _ = [ o ,1 .5 T csi oo +1 LO 3 ^ CO CO / ,0 .8 P.C.B. LAND DIMENSION Viewed from the switch mounting face CIRCUIT DIAGRAM C Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength:
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OCR Scan
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70mOhm
50/60HZ,
/-150gf
C7025,
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PDF
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Untitled
Abstract: No abstract text available
Text: 9.0 HOLE LAYOUT 0.05 TOP VIEW 6x 0 O.9 r 1.5 t 0 . 05 -x.y -x 2.5 b . 2.5 a 2.0 LO 0.3 L 3.3 . CIRCUIT DIAGRAM Vr// -q C: COMMON PIN 0.25 Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:
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70mOhm
50/60HZ,
/-100gf
C7025,
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PDF
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Untitled
Abstract: No abstract text available
Text: Catalog 296642 Focused Product Guide ampm odu .025 [0 .64] Revised 7-98 Printed Circuit Board Connectors Continued Interconnection System - Mod. IV Wire-Applied Housings, Double-Row,
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C7025,
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PDF
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104480-9
Abstract: 567297-2
Text: AMPMODU .100 [2.54] Centerline Wire-to-Board Receptacles Catalog 1307612 Revised 7-01 Short Point Crimp Snap-In Receptacle Contacts Material and Finish: .068 [1.73] .060 [1.52] .460 [11.68] rv n . I t — Related Product Data: Performance Characteristics—
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C7025,
104480-9
567297-2
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PDF
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567297-2
Abstract: No abstract text available
Text: Catalog 1307612 MTE Interconnection System Revised 7-01 In te rc h an g e ab le C o n tacts, W ire C rim p S nap -In Material and Finish: Short Point Receptacles .068 Copper alloy C7025, plated as follows: Plating A— Duplex plated .000030 [0.00076] min. gold on contact area,
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C7025,
567297-2
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PDF
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