SECS II wafer map format
Abstract: C075EE UV-tape
Text: SL2 ICS50 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136530 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L Label ICs on an NXP C075EE process
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ICS50
C075EE
ICS5001EW/V7
SECS II wafer map format
UV-tape
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Untitled
Abstract: No abstract text available
Text: SL2ICS5311EW/V7 Wafer addendum Rev. 3.0 — 8 May 2008 Product data sheet 131030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process
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SL2ICS5311EW/V7
C075EE
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uv-tape
Abstract: ICODE SLI-S SECS II wafer map format
Text: SL2ICS5301EW/V7L Wafer addendum Rev. 3.0 — 19 March 2008 Product data sheet 153430 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process
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SL2ICS5301EW/V7L
C075EE
uv-tape
ICODE SLI-S
SECS II wafer map format
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SECS II wafer map format
Abstract: wafer map format uv-tape ICS53 LCR meter for ICs package
Text: SL2 ICS53 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135830 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S Label ICs on an NXP C075EE process
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ICS53
C075EE
ICS5301EW/V7
SECS II wafer map format
wafer map format
uv-tape
ICS53
LCR meter for ICs package
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UV-tape
Abstract: wafer map
Text: SL2 ICS51 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136630 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L HC Label ICs on an NXP C075EE
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ICS51
C075EE
ICS5101EW/V7
15Contents
UV-tape
wafer map
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SECS II wafer map format
Abstract: C075EE uv-tape ICODE SLI-S ICS5401 SL2ICS54 wafer map format
Text: SL2 ICS54 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135930 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S HC Label ICs on an NXP C075EE
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ICS54
C075EE
ICS5401EW/V7
15Contents
SECS II wafer map format
C075EE
uv-tape
ICODE SLI-S
ICS5401
SL2ICS54
wafer map format
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ICODE Coil design guide
Abstract: M92x 156932
Text: SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 Product data sheet addendum 150030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP
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SL2ICS2001DW/V1D
C075EE
ICODE Coil design guide
M92x
156932
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LB-412
Abstract: ICODE SLI ICS20 SL2ICS20 IBIS wafer map format
Text: INTEGRATED CIRCUITS ADDENDUM SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification Product Specification Revision 3.0 Public Philips Semiconductors December 2002 Philips Semiconductors Product Specification Rev.3.0 December 2002 Bumped Wafer Specification
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SCA74
LB-412
ICODE SLI
ICS20
SL2ICS20
IBIS wafer map format
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Z2450
Abstract: sl3ics3001, ucode hsl SL3ICS30 UCODE hsl Z915 C075EE
Text: SL3ICS3001 UCODE HSL bumped wafer specification Rev. 3.0 — 6 July 2009 070730 Product data sheet addendum PUBLIC 1. General description The SL3ICS3001FW is a contactless tag IC designed for tags and labels for RFID and AIDC system applications. This specification describes electrical, physical and dimensional properties of Au-bumped,
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SL3ICS3001
SL3ICS3001FW
SL3ICS3001
SL3ICS3001FW/V1
Z2450
sl3ics3001, ucode hsl
SL3ICS30
UCODE hsl
Z915
C075EE
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