BUBBLE DISPLAY Search Results

BLH load cell

Contextual Info: PLB Accumark Vishay BLH Transducers Single Point Bench Scale FEATURES ∑ Rugged Square Structural Tubing Scale Base ∑ USDA Approved 304 Stainless Steel Option ∑ Integral Bubble Level ∑ Compatible with All BLH Transmitters, Indicators, and Network Products

Contextual Info: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 UY ultra - yellow MADE IN GERMANY Tol.: +0,20 Epoxy Bubble 2,00 - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 3,20 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD SMD - 180O ANGLE HIGH POWER OUTPUT CR 50 UB ultra-blue MADE IN GERMANY 5/03 ALL MEASUREMENTS IN MM 2,00 - 0,05 1,20 0,50 Tol.: +0,20 Epoxy Bubble 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MY mega - yellow MADE IN GERMANY Tol.: +0,20 Epoxy Bubble 2,00 - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 3,20 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MR mega - red MADE IN GERMANY 2,00 3,20 Features Tol.: +0,20 Epoxy Bubble - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 6/03 MAX Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UDG ultra-deep-green MADE IN GERMANY 8/99 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 10 HR hyper red MADE IN GERMANY 2,00 Tol.: +0,20 Epoxy Bubble 3,20 - 0,05 MAX 1,20 0,50 ALL MEASUREMENTS IN MM MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UDB ultra-deep-blue MADE IN GERMANY 8/99 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UHG ultra-high-green MADE IN GERMANY 5/03 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MHG mega - high - green MADE IN GERMANY 2,00 3,20 Features Tol.: +0,20 Epoxy Bubble - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 5/03 MAX Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UHB ultra-high-blue MADE IN GERMANY 3/05 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MHB mega - high - blue MADE IN GERMANY 2,00 3,20 Features Tol.: +0,20 Epoxy Bubble - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 5/03 MAX Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MYG mega - yellow - green MADE IN GERMANY Tol.: +0,20 Epoxy Bubble 2,00 - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 3,20 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

Contextual Info: CERAMIC CHIP SMD O O SMD - 180 ANGLE HIGH POWER OUTPUT CR 10 PG pure green MADE IN GERMANY ALL MEASUREMENTS IN MM Tol.: +0,20 Epoxy Bubble 3,20 - 0,05 MAX 1,20 0,50 2,00 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion

IC 74ls32

Abstract: intel 8086 microprocessor LT 7220 8086 microprocessor kit manual IC 74LS74 BPK72 BPK-70 IC746 IC820 3103* intel
Contextual Info: in te T APPLICATION NOTE AP-119 December 1982 ORDER NUMBER: 310367-002 6-15 AP-119 characteristics of the BPK 72 and is intended to further ease the design effort required in the im­ plem entation of bubble mem ory systems. INTRODUCTION To date, a m ajor obstacle in the im plem entation of

interfacing of 8257 devices with 8085

Abstract: IC 7430 IC-7430 BPK-72 Bubble Memory 8085 microprocessor BPK72 7430E IC7406 8085 Manual 6116 interface 8085
Contextual Info: in tJ APPLICATION NOTE AP-150 O ctober 1983 IN T E L C O RPO RATIO N, 1982 6-86 O C TO B E R 1983 O R D ER N U M B ER : 210849-002 AP-150 8085 TO BPK 72 INTERFACE INTRODUCTION Bubble Memory is quickly emerging as the preferred high density storage medium for a variety of microprocessor

NSA1198

Abstract: NSA1588A NSA1188 NSA7120 NSA598 NSA1166 NSA0038 NSA1605 NSA1541A NSA5120A
Contextual Info: Monolithic Multidigit Array Displays Features: Applications: N a tio n al’s LED num eric arrays are PC board mounted, magnified, monolithic, 7 or 14 segment red digits arranged in various combinations of up to 14 digits per array. These arrays, with digit

NSA1198

Abstract: NSA5140A NSA1188 NSA 1198 NSA1588A 1588a led NSA0038 nsa 1588A 1588A NSA7120
Contextual Info: Monolithic Multidigit Array Displays Features: Applications: N ational’s LED num eric arrays are PC board mounted, magnified, monolithic, 7 or 14 segment red digits arranged in various combinations of up to 14 digits per array. These arrays, with digit heights of 100,110 and 140 mils 2.54, 2.794 and

KCS057QV1AJ-G32

Abstract: PH-BLC08-K3 G318 G320 7 segment INCOMING Plate INSPECTION kcs057qv1aj LCD 2002 B318 B319 BHR-03VS-1
Contextual Info: 1. Application This data sheet defines the specification for a 320x3 ×240 dot, STN Transmissive color dot matrix type Liquid Crystal Display with CFL backlight. 2. Construction and Outline (320×3)×240 dots, COB type LCD with CFL backlight. Backlight system

wintek lcd

Abstract: wintek display Wintek WINTEK SPECIFICATION
Contextual Info: m m m tz m m n m W IN T E K C O R P O R A T IO N SPECIFICATIONS FOR LIQUID CRYSTAL DISPLAY : B A IK O M C U STO M ER : WK-TZ3001 -RG-E W-1006-050 M O D EL D RIV IN G S C H E M E : 1/4 Duty 1/3 Bias Vop:3.0V DATE : 18 .Ju n .1998 A PPRO VED BY APPROVED [ 5 *

LCD toshiba tlc 292

Abstract: MC33172D RT8070 74HC74-A MF50FD nippon chemi-con date code Kyocera lcd B238 104j capacitor G240
Contextual Info: １．Application This data sheet defines the specification for a 240x3 ×320 dot, STN transflective color dot matrix type Liquid Crystal Display with CFL backlight. ２．Construction and Outline (240×3)×320 dots, COB type LCD with CFL backlight. Backlight system

PH-BLC08-K3

Abstract: Kyocera lcd Kyocera lcd cross reference JIS-K5400 MC33172D display TABLET 40 pin 74hc74a lcd touch ROHM Electronics B238
Contextual Info: １．Application This data sheet defines the specification for a 240x3 ×320 dot, STN Transflective color dot matrix type Liquid Crystal Display with CFL backlight and Touch Panel. ２．Construction and Outline (240×3)×320 dots, COB type LCD with CFL backlight and Touch Panel.

ILI9222

Abstract: ILItek vacuum cleaner circuit diagram ILI9221 edt display 8x 8 led dot matrix ET018003DM edt lcd 220H full color dot matrix 8 x 8
Contextual Info: EXAMINED BY : FILE NO . EMERGING DISPLAY APPROVED BY: TECHNOLOGIES CORPORATION ISSUE :APR.03, 2007 TOTAL PAGE : 23 VERSION : CUSTOMER ACCEPTANCE M OD EL CAS-51581 1 SPECIFICATIONS NO . : ET018003DM U R oH S FOR M ESSRS : CUSTOMER'S APPROVAL : _

ILItek

Abstract: ILI9221 ILI9222 220H edt lcd et02 CAS-51580
Contextual Info: EXAMINED BY : FILE NO . EMERGING DISPLAY APPROVED BY: TECHNOLOGIES CORPORATION ISSUE : APR.04, 2007 TOTAL PAGE : VERSION : CUSTOMER ACCEPTANCE M OD EL CAS-51580 22 1 SPECIFICATIONS NO . : ET020003DM U R oH S FOR M ESSRS : CUSTOMER'S APPROVAL : _