crystal HCJ
Abstract: HCJ crystal si 13003 br crystal hcj 30 motor 42SH power supply for magnetron optical pickup unit iron bh curve hdd motor hitachi hitachi optical pickup
Text: Neodymium-Iron-Boron Magnets NEOREC series Issue date: December 2008 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
|
Original
|
PDF
|
2002/95/EC,
crystal HCJ
HCJ crystal
si 13003 br
crystal hcj 30
motor 42SH
power supply for magnetron
optical pickup unit
iron bh curve
hdd motor hitachi
hitachi optical pickup
|
NEOREC55
Abstract: No abstract text available
Text: 高特性ネオジム磁石 NEOREC55シリーズ High Performance Neodymium-Iron-Boron Magnets NEOREC55 series M-03 製品の小型・軽量化を可能とする高性能磁石 独自の低酸素プロセスと粉体制御技術により磁気特性を大幅にアップした Nd-Fe-B 系焼結磁石です。高い
|
Original
|
PDF
|
NEOREC55
NEOREC55
438kJ/m
NEOREC53
NEOREC50F
NEOREC45
|
Untitled
Abstract: No abstract text available
Text: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,
|
Original
|
PDF
|
XX-X57X-1X
XX-6556-XX
|
Untitled
Abstract: No abstract text available
Text: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,
|
Original
|
PDF
|
XX-X57X-1X
XX-6556-XX
|
a13514
Abstract: D149 D150 D2240 D257 D412 E595
Text: TgardTM 200 Series Thermally Conductive Insulators Innovative Technology for a Connected World High Performance Thermal Interface Products The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric
|
Original
|
PDF
|
A13514-00
a13514
D149
D150
D2240
D257
D412
E595
|
Outgassing
Abstract: E180840 ASTM D2240 CVCM 200 SERIES ADHESIVE GAP PAD ASTM-E595 astm D150 Tpli
Text: Laird Technologies Web site: www.LairdTech.com Item # Tpli 215, Tpli 200 Series Gap Filler Material Tpli™ 200 Series Gap Filler Material Industry Leading Soft Elastomer Gap Filler Tpli 200 Series™ is the premium gap filler. An unique blend of boron nitride and silicone produce Laird Technologies'
|
Original
|
PDF
|
fille00
D5470
Outgassing
E180840
ASTM D2240
CVCM
200 SERIES
ADHESIVE GAP PAD
ASTM-E595
astm D150
Tpli
|
Untitled
Abstract: No abstract text available
Text: CHEMTRONICS CW7250 Technical Data Sheet CircuitWorks Boron Nitride Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Boron Nitride Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. The material
|
Original
|
PDF
|
CW7250
MIL-C-47113
|
Untitled
Abstract: No abstract text available
Text: Material Declaration BH13-1-XXXLF Total mass of unit = 0.8395g Material Location Matelial Name Substrate Alminum ceramic Substance Name Aluminum oxide Silica Magnesium oxide Thick film Metals and oxides Silver Lead monoxide Ⅱ Silica Boron trioxide Zinc oxide
|
Original
|
PDF
|
BH13-1-XXXLF
8395g
|
DP460
Abstract: D1876 epoxy thinner Outgassing 5589H Outgass DP-460 ADHESIVE GAP PAD TC2810+37ML
Text: Technical Data January, 2010 3M Thermally Conductive Epoxy Adhesive TC-2810 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a boron nitride filled, two-part, thermally conductive epoxy adhesive. Key Features • Improved thermal conductivity.
|
Original
|
PDF
|
TC-2810
TC-2810
DP-460
225-3S-06
DP460
D1876
epoxy thinner
Outgassing
5589H
Outgass
ADHESIVE GAP PAD
TC2810+37ML
|
ASTM D2240, D412
Abstract: A1556 D149 D150 D2240 D257 D412 E595 A15561-00
Text: T-gardTM 200 Series Thermally Conductive Insulators Innovative Technology for a Connected World High Performance Thermal Interface Products The T-gard 200 is a high performance interface pad. Consisting of silicon/boron composites, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric strength
|
Original
|
PDF
|
A15561-00
ASTM D2240, D412
A1556
D149
D150
D2240
D257
D412
E595
|
Untitled
Abstract: No abstract text available
Text: TgardTM 200 Series Thermally Conductive Insulators HIGH PERFORMANCE THERMAL INTERFACE PRODUCTS The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric
|
Original
|
PDF
|
A13514-00
|
Thermagon
Abstract: WARTH E1808 Orcus ASTM D412 D149 D150 D2240 D257 D412
Text: T-flex 600 Series T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in
|
Original
|
PDF
|
A13512-00
Thermagon
WARTH
E1808
Orcus
ASTM D412
D149
D150
D2240
D257
D412
|
Untitled
Abstract: No abstract text available
Text: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,
|
Original
|
PDF
|
XX-X57X-1X
XX-6556-XX
|
Untitled
Abstract: No abstract text available
Text: Super Thermal Grease Designed for use with heat sinks to effectively dissipate heat generated by electronic devices and circuitry. Ideally used to cool CPUs when over clocking , chipset and graphics cards. Formulated with Boron Nitride, this grease gives super high thermal conductivity without
|
Original
|
PDF
|
D5470
|
|
|
Untitled
Abstract: No abstract text available
Text: RoHS CS32SP Silicon Diode with Silicon Oxide Passivation in a Copper Pill Package Product Environmental Data Sheet CS32SP Semiconductor Silicon Chip – Oxide Passivated Silicon with Boron Doping CAS 1E-10 Silicon Gold Plated Contact 7400-21-3 Contact CS32SP - Package
|
Original
|
PDF
|
CS32SP
CS32SP
1E-10
|
NEOREC55
Abstract: NEOREC-50
Text: M-03 A1 594mm x 841mm 高特性ネオジム磁石 NEOREC55シリーズ High Performance Neodymium-Iron-Boron Magnets NEOREC55 series 新製品 M-03 製品の小型・軽量化を可能とする高性能磁石 独自の低酸素プロセスと粉体制御技術により磁気特性を大幅にアップした Nd-Fe-B 系焼結磁石です。高い残留
|
Original
|
PDF
|
594mm
841mm)
NEOREC55
NEOREC55
NEOREC53
NEOREC50F
NEOREC55A
NEOREC-50
|
Untitled
Abstract: No abstract text available
Text: Cylindrical Neodymium Magnet Part Number : M1219-3 Product Data Sheet DIMENSIONS PICTURE 4 0.158 3 (0.118) Drawings not to scale All dimensions in mm nominal SPECIFICATION Gauss strength at surface 3200 Magnet Material Neodymium Iron Boron Operating Temperature
|
Original
|
PDF
|
M1219-3
|
Untitled
Abstract: No abstract text available
Text: Series X57X - Quick-Release Universal Zero Insertion Force DIP Test Socket ORDERING INFORMATION XX-X57X-1X Plating: 0=Tin over Nickel 0TL=Tin/Lead over Nickel 1=Gold over Nickel 6=Nickel Boron Plated Spinodal 8=hi-temp. socket* No. of pins: 24, 28, 32, 36,
|
Original
|
PDF
|
XX-X57X-1X
XX-6556-XX
|
D149
Abstract: D150 D2240 D257 D412 E595 astm D150
Text: TpliTM 200 Series Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tpli 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad. Tpli™ 200’s exceptional combination of high thermal conductivity and compliancy
|
Original
|
PDF
|
A13519-00
D149
D150
D2240
D257
D412
E595
astm D150
|
D150
Abstract: D2240 D257 D412 E595 D149 TPLITM220
Text: T-pli 200 Series Gap Filler global solutions : local support ™ T-pliTM 200 Series Gap Filler Features and Benefits: Exceptionally soft, highly compressible gap filler • Thermal performance leader T-pli™ 200 is a premium gap filler. A unique blend of boron
|
Original
|
PDF
|
|
NEOREC-50
Abstract: NEOREC55
Text: 高特性ネオジム磁石 NEOREC55シリーズ High Performance Neodymium-Iron-Boron Magnets NEOREC55 series 新製品 E&E-06 製品の小型・軽量化を可能とする高性能磁石 独自の低酸素プロセスと粉体制御技術により磁気特性を大幅にアップした Nd-Fe-B 系焼結磁石です。高い残留
|
Original
|
PDF
|
NEOREC55
NEOREC55
NEOREC53
NEOREC50F
NEOREC55A
NEOREC50F
NEOREC-50
|
"modem applications" -56k 56kbps
Abstract: DFM4100 DFM4200 afe 1000 ATMOS Virata
Text: Boron Product Profile Data Sheet June 2000 KEY FEATURES Description Single Chip Broadband Access Modem Boron is a single-chip solution for fast Internet access. It extends Virata’s ATOM device technology, delivering a product-on-a-chip, enabling highly-integrated G.992.1 and G.992.2 interoperable and compatible ADSL equipment.
|
Original
|
PDF
|
56Kbps
"modem applications" -56k 56kbps
DFM4100
DFM4200
afe 1000
ATMOS Virata
|
HCJ crystal
Abstract: crystal HCJ NEOREC46HF crystal hcj 30 NEOREC45SH motor 42SH HCJ 33.33 crystal HCJ 33.33 M koe sheet optical pickup unit
Text: Neodymium-Iron-Boron Magnets NEOREC series Issue date: May 2010 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
|
Original
|
PDF
|
2002/95/EC,
HCJ crystal
crystal HCJ
NEOREC46HF
crystal hcj 30
NEOREC45SH
motor 42SH
HCJ 33.33 crystal
HCJ 33.33 M
koe sheet
optical pickup unit
|
neodymium
Abstract: gunther neodymium magnet AE043 M1219-10
Text: FORM AE043 ISS1 PRODUCT DATA SHEET Comus Group of Companies Supplied by 2.0 .079 22.0 (.866) Drawings not to scale All dimensions in mm (inches) SPECIFICATION Magnet material Surface flux measurement (gauss) Grade/Energy density Operating temperature Neodymium Iron Boron (NdFeB) Nickel plated
|
Original
|
PDF
|
AE043
M1219-10
neodymium
gunther
neodymium magnet
M1219-10
|
