BLUE CHIP TECHNOLOGY Search Results

Contextual Info: Blue Chip Technology Datasheet : Vario Elite 4000 Digital Signage Controller Part of the Vario Elite family, the 4000 brings ultimate processing performance to the Blue Chip Technology HDTV Resolution support range of digital signage controllers. Delivering HDTV

Contextual Info: Blue Chip Technology Datasheet : Vario Elite 3200 Digital Signage Controller Part of the Vario Elite family, the Vario 3200 is the latest edition to the Blue Chip Technology range of digital HDTV Resolution support signage controllers. Delivering HDTV resolutions, high bit

Contextual Info: G•SiC Technology XBright Power Chip LED CxxxXB500-S0100-A Features Applications • XBright™ Technology • Larger “Power Chip” Design • High Performance • General Illumination – – – – – -30 mW min. 460nm Blue -27 mW min. (470nm) Blue

Contextual Info: G•SiC Technology XBright Power Chip LED CxxxXB500-S0100-A Features Applications • XBright™ Technology • Larger “Power Chip” Design • High Performance • General Illumination – – – – – -30 mW min. 460nm Blue -27 mW min. (470nm) Blue

Contextual Info: Blue Chip Technology Datasheet - BCT-915A Slot Card The Blue Chip Technology BCT-915A Single Board Computer brings together the latest processor, graphics, memory and I/O capabilities. It’s perfectly suited to driving advanced applications in manufacturing, test/analysis, medical, broadcast and communications

Contextual Info: G•SiC Technology XBright® Power Chip LED CxxxXB500-Sxx00-A Features Applications • XBright® LED Technology • Larger “Power Chip” Design • High Performance • General Illumination – – – – – -35 mW min. 460nm Blue -30 mW min. (470nm) Blue

Contextual Info: Blue Chip Detonator Key Features •       The Blue Chip family of high voltage chip slapper detonators is designed for a wide variety of applications. Each type of detonator has been qualified to MIL-DTL-23659 Appendix A and is qualified for use in-line. The various

254 nm uv LED

Abstract: MSL-1947HB3
Contextual Info: MSL-1947HB3 Surface Mount Chip LEDs Description Package Dimensions The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package.

Unity Opto Technology

Abstract: MSL-1947HB3 MSL-1947HB3-5 MSL-1947HB3-S UV LED 295 nm
Contextual Info: Surface Mount Chip LEDs Description MSL-1947HB3-S Package Dimensions The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package.

Unity Opto Technology

Abstract: MSL-1947HB3-5 SOURCE LABLE
Contextual Info: MSL-1947HB3-5 Surface Mount Chip LEDs Description Package Dimensions The MSL-1947HB3-5, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package.

MSL-194B

Contextual Info: Surface Mount Chip LEDs MSL-194B Package Dimensions Description CATHODE MARK The MSL-194B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable 0.80 0.032 for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

MSL-174B

Contextual Info: Surface Mount Chip LEDs MSL-174B Package Dimensions Description CATHODE MARK The MSL-174B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable 1.25 0.049 for SMT assembly method. It utilizes InGaN on SiC POLARITY LED chip technology and water clear epoxy package.

MSL-154B

Contextual Info: Surface Mount Chip LEDs MSL-154B Package Dimensions Description CATHODE MARK The MSL-154B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable 1.60 0.063 for SMT assembly method. It utilizes InGaN on SiC POLARITY LED chip technology and water clear epoxy package.

MSL-154BV

Contextual Info: Surface Mount Chip LEDs MSL-154BV Package Dimensions Description CATHODE MARK The MSL-154BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable 1.60 0.063 for SMT assembly method. It utilizes GaN on SiC POLARITY LED chip technology and water clear epoxy package.

ir 032

Abstract: MSL-194BV
Contextual Info: Surface Mount Chip LEDs MSL-194BV Package Dimensions Description CATHODE MARK The MSL-194BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable 0.80 0.032 for SMT assembly method. It utilizes GaN on SiC POLARITY LED chip technology and water clear epoxy package.

Contextual Info: Photodiode-Chip EPC-440-1.4 19.11.2007 rev. 06 Wavelength range Type Technology Electrodes UV-blue-green Schottky Contact GaP P anode up typ. dimensions (µm) 1360 1300 1100 typ. thickness Description 300 µm High spectral sensitivity in the blue and ultraviolet

Contextual Info: Photodiode-Chip EPC-440-3.6 19.11.2007 rev. 05 Wavelength range Type Technology Electrodes UV-blue-green Schottky Contact GaP P anode up 3560 typ. dimensions (µm) 3500 3300 typ. thickness Description 300 µm High spectral sensitivity in the blue and ultraviolet

Contextual Info: Photodiode-Chip EPC-440-0.9 19.11.2007 rev. 06 Wavelength range Type Technology Electrodes UV-blue-green Schottky Contact GaP P anode up typ. dimensions (µm) 860 800 720 typ. thickness Description 300 µm High spectral sensitivity in the blue and ultraviolet

Contextual Info: Photodiode-Chip EPC-440-2.5 19.11.2007 rev. 05 Wavelength range Type Technology Electrodes UV-blue-green Schottky Contact GaP P anode up typ. dimensions (µm) 2460 2400 2200 typ. thickness Description 300 µm High spectral sensitivity in the blue and ultraviolet

LC503TBL1-15H-A

Abstract: blue LED 5mm low 000mcd blue led LC503TBL1-15G-A LC503TBL1-30G-A LC503TBL1-30H-A LO566TBL4-60G-A blue led 5mm 20ma silicon carbide LED
Contextual Info: TBL Blue LEDs ULTRABRIGHT LEDs The Cotco TBL Blue Series LEDs utilize the most recent advances in InGaN/SiC technology. The die process combines highly efficient InGaN materials with a Silicon Carbide SiC substrate in a geometrically enhanced Epi-down chip

4525 GE

Contextual Info: BLUE POWER DIE BXCE 33 mil x 33 mil PRODUCT DATA SHEET DS-C16 The Bridgelux family of blue power die enables high performance and cost effective solutions to serve solid state lighting market. This next generation chip technology delivers improved efficiency and

ultraviolet sensor flame

Abstract: uv flame sensor
Contextual Info: Photodiode-Chip EPC-440-0.9 Preliminary 11.04.2007 rev. 04/07 Wavelength range Type Technology Electrodes UV-blue-green Schottky Contact GaP P anode up typ. dimensions (µm) 860 800 720 typ. thickness Description 300 µm High spectral sensitivity in the blue and ultraviolet

Contextual Info: BRIDGELUX BLUE POWER DIE BXFE 45 x 45 PRODUCT DATA SHEET DS-C18 The Bridgelux family of blue power die enables high performance and cost effective solutions to serve solid state lighting market. This next generation chip technology delivers improved efficiency and

Contextual Info: Photodiode-Chip EPC-440-2.5 Preliminary 11.04.2007 rev. 03/07 Wavelength range Type Technology Electrodes UV-blue-green Schottky Contact GaP P anode up typ. dimensions (µm) 2460 2400 2200 typ. thickness Description 300 µm High spectral sensitivity in the blue and ultraviolet