BL 37 933 Search Results

Facon BH 37 933

Abstract: facon bh 39933 BD 37 931 s Facon Bb 37 933 facon bh 37 741 BH 37 933 facon bd 39933 bb 36 931 bj 39933 BB36931
Contextual Info: FACON 4SE T> m 3MSbED3 ODDOGOb T B iF C N 2 3 -O FACON SEMICONDUCTEURS/SEMECONDUCTORS single phase moulded bridges 0,8 Amp to 1,5 Amp ponts m on op h asés m oulés 0,8 Amp à 1,5 Amp V RRM Typos <V V RMS rec o m ­ m ended m ax >d on re ­ s is tiv e lo a d

facon bf 39933

Abstract: facon BA 204 115 Facon Bb 37 933 facon bh 39933 BD 39-931 Facon BH 37 933 bd 39933 FBH15 facon bd 39933 Facon bh 36931
Contextual Info: FACON 4SE D • 3M5b203 □□□□□Ob S FACON SEMICONDUCTEURS/SEMtCONDUCTORS ■ FCN ~T~2 3 ' 0 { single phase moulded bridges 0,8 Amp to 1,5 Amp ponts monophasés moulés 0,8 Amp à 1,5 Amp V RRM Typ es V r MS recom ­ mended max id on re­ sistive load

LD 8105 GL

Abstract: BFK 82 99.801.3900.9 F8313 LD25V BFK12 bfk13 cn/A/U 237 BG 98.060.0000.0 15x5
Contextual Info: contents contents contents of type description TYPE Type Part no. ,0 BIS 11,0 MM ,0 BIS 11,0 MM ,5 BIS 13,5 MM ,5 BIS 6,5 MM .ADC 1 GELB / 70 E S35 0,0 BIS 17,0 MM 0,2 -0,56 QMM 0,2 -0,56 QMM 0,2 -0,56 QMM 0,2 -0,56 QMM 0,5 -01,5 QMM 0,5 -1,5 QMM 0,5 -1,5 QMM

LT 6227

Contextual Info: Data sheet OMNIMATE Signal - series BL/SL 5.08 SL 5.08HC/02/90G 3.2SN BK BX Weidmüller Interface GmbH & Co. KG Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Male headers made from glass fibre-reinforced plastic

Contextual Info: 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L32M32D2, MT42L16M32D1 Features Options • VDD2: 1.2V • Configuration – 4 Meg x 32 x 4 banks – 8 Meg x 16 x 4 banks – 2 x 8 Meg x 16 x 4 banks • Device type

Contextual Info: Preliminary‡ 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L32M32D2 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks – 2 x 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package

Contextual Info: Preliminary‡ 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L32M32D2 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks – 2 x 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package

MT42L16M32

Abstract: MT42L16M32D1 MT42L16M32D MT42L32M16D1 MT42L32M16D PS 229 LPDDR2 PoP LPDDR2 DRAM LPDDR2-1066 Micron LPDDR2
Contextual Info: 512Mb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L16M32D1 Features Options Marking • VDD2: 1.2V • Configuration – 4 Meg x 32 x 4 banks – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package

MT42L16M32D1

Abstract: 7600B Dynamic Memory Refresh Controller LPDDR2-1066 121ball
Contextual Info: 512Mb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L16M32D1 Features Options Marking • VDD2: 1.2V • Configuration – 4 Meg x 32 x 4 banks – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package

hynix lpddr2

Abstract: ELPIDA mobile dram LPDDR2 Elpida LPDDR2 Memory hynix lpddr2 sdram lpddr2 DQ calibration Hynix 4Gb LPDDR2 LPDDR2 SDRAM hynix NT6TL64M32AQ -G1 lpddr2-s2 LPDDR2 1Gb Memory
Contextual Info: 2Gb LPDDR2-S4 SDRAM NT6TL64M32AQ Feature Options  Double-data rate architecture; two data transfer per clock cycle  Bidirectional, data strobe DQS, /DQS is transmitted/received with data, to be used in capturing data at the receiver  Differential clock inputs (CK and /CK)

TS12232

Abstract: STMicroelectronics date code format M41T81S FOX924B M41T81S NAND512W3A2BN6 smd 3528 led strip NAND512W3A2 M41T82 STCN75 STLM20
Contextual Info: UM0963 User manual STEVAL-IFS012V1 demonstration board based on multiple temperature sensors and RTCs Introduction This document explains the functioning of the multi-device temperature sensor and real-time clock RTC demonstration board. The complete system consists of a motherboard with an

14004

Abstract: DIN 933 M12 4 PIN CIRCULAR PLASTIC CONNECTORS Rouge 933 176-100 hirschmann Topaz 512 4412 61076 lichtschranke ST 150 MB-800
Contextual Info: E-Serie Kat-0901-Druck 24.09.2001 15:37 Uhr Seite 2 Rundsteckverbinder M 8 + M12 für den elektrischen Anschluß von Sensoren Circular connectors M8 + M12 for the electrical connection of sensors Fiches cylindriques M8 + M12 pour la connexion électrique de détecteurs

LPDDR2-1066

Abstract: micron lpddr2 lpddr2 DQ calibration LPDDR2 SDRAM micron MT42L128M64D4 lpddr2 MT42L64M64D2 micron LPDDR2 X32 LPDDR2 SDRAM mt42L128M64D
Contextual Info: 2Gb: x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L64M64D2, MT42L128M64D4, MT42L96M64D3 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 32 x 8 banks x 2 die – 8 Meg x 32 x 8 banks x 3 die – 8 Meg x 32 x 8 banks x 4 die

lpddr3

Contextual Info: 178-Ball Mobile LPDDR3 SDRAM Features Mobile LPDDR3 SDRAM EDF8132A1MC, EDFA232A1MA Features Options • VDD1/VDD2/VDDCA/VDDQ: 1.8V/1.2V/1.2V/1.2V • Array configuration – 256 Meg x 32 DDP – 512 Meg x 32 (QDP) • Packaging – 12.0mm x 11.5mm, 178-ball FBGA package

NT5CC128M16FP

Contextual Info: 2Gb DDR3 L SDRAM F-Die NT5CB256M8FN / NT5CB128M16FP NT5CC256M8FN / NT5CC128M16FP Options Features  Differential clock input (CK, ) Speeds  Differential bidirectional data strobe  DDR3 - 2133 1,2  TDQS and /TDQS pair for X8  DDR3 - 1866

nt5cc64m

Contextual Info: 1Gb DDR3 SDRAM F-Die NT5CB C 128M8FN / NT5CB(C)64M16FP Options Features  Differential clock input (CK, ) Speeds  Differential bidirectional data strobe  DDR3 - 1866  TDQS and /TDQS pair for X8  DDR3/DDR3L/DDR3L RS - 1600  8n-bit prefetch architecture

Contextual Info: 4Gb DDR3 SDRAM C-Die NT5CB C 512M8CN / NT5CB(C)256M16CP Options Features  Differential clock input (CK, ) Speeds  Differential bidirectional data strobe  DDR3 - 2133 2,3  TDQS and /TDQS pair for X8  DDR3 - 1866 2,3  8n-bit prefetch architecture

Contextual Info: 2Gb DDR3 L SDRAM F-Die NT5CB256M8FN / NT5CB128M16FP NT5CC256M8FN / NT5CC128M16FP Options Features  Differential clock input (CK, ) Speeds  Differential bidirectional data strobe  DDR3 - 2133 2,3  TDQS and /TDQS pair for X8  DDR3 - 1866

Contextual Info: 1Gb DDR3 SDRAM F-Die NT5CB C 128M8FN / NT5CB(C)64M16FP Options Features  Differential clock input (CK, ) Speeds  Differential bidirectional data strobe  DDR3 - 1866  TDQS and /TDQS pair for X8  DDR3/DDR3L/DDR3L RS - 1600 2,3 2,4  8n-bit prefetch architecture

M39012 TNC

Abstract: M39012 KC-59-417 KN-19-114 KN-59-244 KC-59-416 M39Q12 KC-89-87 KA-59-231 KA-59-22
Contextual Info: MILITARY CRO SS INDEX M39012 Military Number SKINGS M39012 Kings Part Number Series Page No. Description j j Military Number Kings Part Number Series Description Page No. M39012/01-0Q05 KN-59-176 N Plug 31 j M39012;26-0010 KA-59-231 TNC Plug 23 M39012/01-0101

Contextual Info: Nanya Technology Corp. DDR3 L 1Gb SDRAM NT5CB(C)128M8FN / NT5CB(C)64M16FP NT5CB(C)128M8FN / NT5CB(C)64M16FP Commercial, Industrial and Automotive DDR3(L) 1Gb SDRAM Features  Signal Integrity  JEDEC DDR3 Compliant - Configurable DS for system compatibility

Contextual Info: 1Gb DDR3 SDRAM F-Die NT5CB C 128M8FN / NT5CB(C)64M16FP Options Features  Differential clock input (CK, ) Speeds  Differential bidirectional data strobe  DDR3 - 1866  TDQS and /TDQS pair for X8  DDR3/DDR3L/DDR3L RS - 1600 2,3 2,4  8n-bit prefetch architecture

NT5CC256

Abstract: NT5CB128M16FP
Contextual Info: 2Gb DDR3 L SDRAM F-Die NT5CB256M8FN / NT5CB128M16FP NT5CC256M8FN / NT5CC128M16FP Options Features  Differential clock input (CK, ) Speeds  Differential bidirectional data strobe  DDR3 - 2133 2,3  TDQS and /TDQS pair for X8  DDR3 - 1866

MT42L32M32D2

Abstract: micron lpddr2 LPDDR2 SDRAM LPDDR2 SDRAM micron MT42L32M32
Contextual Info: Preliminary‡ 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L32M32D2, MT42L16M32D1 Features Options Marking • VDD2: 1.2V • Configuration – 4 Meg x 32 x 4 banks – 8 Meg x 16 x 4 banks – 2 x 8 Meg x 16 x 4 banks