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    SF-BGA272A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA272A C 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] typ. 0.76mm [0.030"] typ. 24.13mm [0.950"] X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. Ø 0.40mm [Ø 0.0156"] tooling hole X2


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    PDF BGA272A SF-BGA272A-B-11

    MPC555

    Abstract: J137 LA-BGA-MPC555-S-B-01 PB-BGA-MPC555-01 C6215
    Text: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View LS-BGA272A-01 included PB-BGA-MPC555-01 (included) 16.10mm [0.634"] Plugged 2 1.321mm [0.052"] 5.959mm [0.235"]


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    PDF J3-37 J3-38 J1-38 J1-37 LS-BGA272A-01 PB-BGA-MPC555-01 321mm 959mm C6215 000mm MPC555 J137 LA-BGA-MPC555-S-B-01 PB-BGA-MPC555-01 C6215

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


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    PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


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    PDF XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01