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    BGA TRAY Search Results

    BGA TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
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    BGA TRAY Price and Stock

    Micron Technology Inc MT29F2G08ABBGAH4-IT:G

    NAND Flash SLC 2Gbit 8 63/120 VFBGA 1 IT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics MT29F2G08ABBGAH4-IT:G 1,443
    • 1 $1.45
    • 10 $1.27
    • 100 $1.23
    • 1000 $1.22
    • 10000 $1.16
    		Buy Now

    Micron Technology Inc MT29F2G08ABBGAH4-AAT:G

    NAND Flash SLC 2Gbit 8 63/120 VFBGA 1 AT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics MT29F2G08ABBGAH4-AAT:G
    • 1 $4.31
    • 10 $3.8
    • 100 $3.41
    • 1000 $2.92
    • 10000 $2.91
    		Get Quote

    Micron Technology Inc MT29F2G16ABBGAH4-AAT:G

    NAND Flash SLC 2Gbit 16 63/120 VFBGA 1 AT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics MT29F2G16ABBGAH4-AAT:G
    • 1 $4.26
    • 10 $3.87
    • 100 $3.38
    • 1000 $2.92
    • 10000 $2.91
    		Get Quote

    Micron Technology Inc MT29F2G16ABBGAH4-AIT:G

    NAND Flash SLC 2Gbit 16 63/120 VFBGA 1 IT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics MT29F2G16ABBGAH4-AIT:G
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $2.64
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    Hirose Electric Co Ltd IT5HM-100S-BGA(37)

    High-Speed(25+ Gbps) BGA Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com IT5HM-100S-BGA(37)
    • 1 -
    • 10 $25.6
    • 100 $17.56
    • 1000 $17.56
    • 10000 $17.56
    		Buy Now
    Find more BGA TRAY price and stock on Findchips.com

    BGA TRAY Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    BGA 731

    Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


    Original     		PDF

    313-PIN

    Abstract: No abstract text available
    Text: UNIT : mm 322.6 315 24.5 266 29.95 A 35.15 38 76 135.9 38 A' 35.15 SECTION A – A' 36.8 5.16 7.62 6.35 35.15 Applied Package 313-pin Plastic BGA 352-pin Plastic BGA 396-pin Plastic BGA Quantity pcs Tray Material MAX. 24 Heat Proof Temp. T-657 Carbon PES


    Original     		313-pin 352-pin 396-pin T-657 PDF

    tray bga

    Abstract: BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray
    Text: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 NEC 38.00 76.0 BGA 35×35ESP 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 35.35 35.00 (5.57) (6.35) 7.62 SECTION A-A' Applied Package 313-pin Plastic BGA (35×35) 352-pin Plastic BGA (35×35)


    Original     		35ESP 313-pin 352-pin 388-pin 396-pin 420-pin 456-pin 480-pin 484-pin 544-pin tray bga BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray PDF

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


    Original     		BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07 PDF

    tray datasheet bga

    Abstract: tray bga fcbga tray jedec NEC 710
    Text: TRAY CONTAINER UNIT : mm 3x8=24 33.25 A' 35.50 33.25 135°C MAX 32.45 BGA 33×33A 35.50 NEC 71.0 135.9 PPE A 33.25 248.5 315.0 322.6 SECTION A-A' 4.52 7.62 (6.35) 33.25 Applied Package Quantity (pcs) 955-pin • Plastic BGA (FCBGA)(33×33) 24 MAX. BGA 33 × 33A


    Original     		955-pin SSD-A-H7079 tray datasheet bga tray bga fcbga tray jedec NEC 710 PDF

    BGA Solder Ball compressive force

    Abstract: bga solder ball shear
    Text: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA


    Original     		10067807-101LF 10076728-101LF 10067811-101LF ELXAIRMXBGA0109ELT BGA Solder Ball compressive force bga solder ball shear PDF

    tray datasheet bga

    Abstract: 4545
    Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)


    Original     		480-pin 580-pin 672-pin 756-pin 888-pin SSD-A-H5933-3 tray datasheet bga 4545 PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    AM2 socket bga

    Abstract: Socket AM2 Design Specification bga solder ball shear am2 specification am2 socket specification foxconn
    Text: SPECIFICATIONS BGA 940 AM2 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 940 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 25 mΩ max.


    Original     		13kgf 750gf 240gf 1000m 31X31 AM2 socket bga Socket AM2 Design Specification bga solder ball shear am2 specification am2 socket specification foxconn PDF

    socket 939

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 939 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”]Pitch 939 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 20 mΩ max.


    Original     		13kgf 750gf 240gf 1000m Type50 31X31 socket 939 foxconn PDF

    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 DT BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF

    BGA754

    Abstract: Solder ball shear bga solder ball shear foxconn
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754PoV-0 754Pos. 29X29 BGA754 Solder ball shear bga solder ball shear foxconn PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapter Sockets Ball Grid Array BGA Adapter Sockets Table of Models Description: Standard Socket (S) Material: High Temp. Liquid Crystal Polymer (LCP)* Index: -60°C to 260°C (-76°F to 500°F) Insulator Size: Same size as BGA device body Description: Extraction Socket (SB)


    Original     		CAT16-PREVIEW06 PDF

    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF

    bga solder ball shear

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos 754Pos. 29X29 bga solder ball shear foxconn PDF

    Untitled

    Abstract: No abstract text available
    Text: iT3D-aoos-BGA * Daugnter card o K X Spacer \IT3M~20QS~BGA( *) IT3-200P-20HÍ03) ^ Spacer \ Mother board <^ 3~| 20 Fig. 1(FREE) Mating Side Mounting Side Hating Cross Section (Free) NOTE- I T > Mounting side is mated with the receptacle:IT3M-200S-BGA(*) and fixed with the latch.


    OCR Scan     		IT3D-200S-BGA1Â IT3-200P-20H103] IT3M-200S-BGA1Â receptacleaT3M-20QS-BGA -200S-BGA( ETAD-F0347 40pcs 80pcs PDF

    196-pin

    Abstract: DSP56300 EB360
    Text: Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196pin Plastic Ball Grid Array (PBGA) packages. The MAP - BGA


    Original     		EB360 196-pin 196-pin 196pin DSP56300 EB360 PDF

    DSP56300

    Abstract: EB362
    Text: Freescale Semiconductor Engineering Bulletin EB362 Rev. 1, 10/2005 Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages This document describes the differences between the 252-pin MAP-BGA Mold Array Process-Ball Grid Array and the 252pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA


    Original     		EB362 252-pin 252-pin 252pin DSP56300 EB362 PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP PDF

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 PDF

    Untitled

    Abstract: No abstract text available
    Text: 24 ± 0.5 IT3D^~100S~BGA * [HI Daughter card -H <n -H \ Spacer 1Q <- <^3 | <a Spacer 1 Column IT3»-1QQP-26H(»)/ A t 3M*-100S-BGA(*) \ Mother board <j ¡1 Fig. 1(FREE) Mating Cross Section (Free) 3 NOTE- f T > GC> PT> 4. 5. 6. FORM NO.229-1 Mounting side is mated with the receptacle=IT3M-100S-BGA(*)and fixed withthe latch.


    OCR Scan     		-1QQP-26H( -100S-BGA( IT3M-100S-BGA( ETAD-F0347 lines50pcs IT3-100P-26H PDF