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    BGA PACKAGE TRAY Search Results

    BGA PACKAGE TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    313-PIN

    Abstract: No abstract text available
    Text: UNIT : mm 322.6 315 24.5 266 29.95 A 35.15 38 76 135.9 38 A' 35.15 SECTION A – A' 36.8 5.16 7.62 6.35 35.15 Applied Package 313-pin Plastic BGA 352-pin Plastic BGA 396-pin Plastic BGA Quantity pcs Tray Material MAX. 24 Heat Proof Temp. T-657 Carbon PES


    Original     		313-pin 352-pin 396-pin T-657 PDF

    tray bga

    Abstract: BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray
    Text: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 NEC 38.00 76.0 BGA 35×35ESP 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 35.35 35.00 (5.57) (6.35) 7.62 SECTION A-A' Applied Package 313-pin Plastic BGA (35×35) 352-pin Plastic BGA (35×35)


    Original     		35ESP 313-pin 352-pin 388-pin 396-pin 420-pin 456-pin 480-pin 484-pin 544-pin tray bga BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray PDF

    tray datasheet bga

    Abstract: tray bga fcbga tray jedec NEC 710
    Text: TRAY CONTAINER UNIT : mm 3x8=24 33.25 A' 35.50 33.25 135°C MAX 32.45 BGA 33×33A 35.50 NEC 71.0 135.9 PPE A 33.25 248.5 315.0 322.6 SECTION A-A' 4.52 7.62 (6.35) 33.25 Applied Package Quantity (pcs) 955-pin • Plastic BGA (FCBGA)(33×33) 24 MAX. BGA 33 × 33A


    Original     		955-pin SSD-A-H7079 tray datasheet bga tray bga fcbga tray jedec NEC 710 PDF

    tray datasheet bga

    Abstract: 4545
    Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)


    Original     		480-pin 580-pin 672-pin 756-pin 888-pin SSD-A-H5933-3 tray datasheet bga 4545 PDF

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 PDF

    676 BGA package tray

    Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)


    Original     		BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 385-pin 400-pin 676 BGA package tray tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27 PDF

    tray datasheet bga

    Abstract: jedec tray BGA tray bga JEDEC TRAY DIMENSIONS JEDEC tray standard
    Text: TRAY CONTAINER NEC A' 35.18 135°C MAX. 7 BGA 35x35A 38.00 76.0 A 29.95 35.18 38.00 266.0 24.50 315.0 322.6 SECTION A-A' (3.91) 35.18 7.62 (6.35) 135.9 PPE 3×8=24 UNIT : mm Applied Package Quantity (pcs) 1155-pin Plastic BGA (35×35) (FLIP CHIP TYPE) 24 MAX.


    Original     		1155-pin SSD-A-H7299 tray datasheet bga jedec tray BGA tray bga JEDEC TRAY DIMENSIONS JEDEC tray standard PDF

    nec 575

    Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
    Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)


    Original     		BGA23 23ESP 324-pin 352-pin 484-pin 575-pin SSD-A-H7317-4 nec 575 484-pin BGA NEC C 324 C jedec tray BGA tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER PDF

    tray bga

    Abstract: BGA22 JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320
    Text: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22x22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 322.6 Section A – A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5×12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22×22 ESP 320-pin Plastic BGA (22×22)


    Original     		BGA22 22ESP 320-pin 345-pin 385-pin 389-pin 429-pin SSD-A-H6973-4 tray bga JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320 PDF

    a 2530

    Abstract: JEDEC tray standard JEDEC TRAY DIMENSIONS tray bga BGA package tray tray jedec BGA 550-PIN
    Text: TRAY CONTAINER 19.80 135° C MAX. A A' 25.30 NEC 96.3 BGA30 x 25ESP 32.10 135.9 PPE 4 × 9=36 UNIT : mm 30.30 34.15 273.2 315.0 322.6 20.90 SECTION A-A' 30.30 (5.88) (5.62) 7.62 30.00 Applied Package Quantity (pcs) 420-pin Plastic BGA (30×25) 464-pin Plastic BGA (30×25)


    Original     		BGA30 25ESP 550-pin BGA30 420-pin 464-pin SSD-A-H7573-2 a 2530 JEDEC tray standard JEDEC TRAY DIMENSIONS tray bga BGA package tray tray jedec BGA PDF

    nec 2565

    Abstract: SSD-A-H6921 tray datasheet bga BGA package tray 2565 nec tray bga 576
    Text: TRAY CONTAINER HEAT PROOF PPE 150°C MAX 40.25 42.3 30.6 40.25 A' 25.65 A PBGA 40x40 42.3 7 84.6 3×7=21 253.8 315 322.6 SECTION A – A' 40.25 4.74 7.62 6.35 135.9 Unit : mm Applied Package Quantity (pcs) 416-pin Plastic BGA (40×40) 500-pin Plastic BGA (40×40)


    Original     		500-pin 576-pin 644-pin 416-pin SSD-A-H6921 nec 2565 SSD-A-H6921 tray datasheet bga BGA package tray 2565 nec tray bga 576 PDF

    nec 2565

    Abstract: tray bga 576 tray datasheet bga
    Text: TRAY CONTAINER HEAT PROOF 7 150°C MAX PPE 40.25 84.6 42.30 A' 25.65 A TBGA 40x40 3×7=21 135.9 Unit : mm 40.25 42.30 253.8 30.60 315.0 322.6 SECTION A – A' 5.82 7.62 (6.35) 40.25 Applied Package 500-pin • Plastic BGA 40×40 576-pin • Plastic BGA 40×40


    Original     		500-pin 576-pin SSD-A-H6757-1 nec 2565 tray bga 576 tray datasheet bga PDF

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)


    Original     		BGA45 1849-pin 1752-pin BGA45 SSD-A-H7053-1 JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 BGA4545 PDF

    JEDEC Jc-11 free

    Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
    Text: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw


    Original     		PDF

    tray bga

    Abstract: tray datasheet bga NEC 2732 jedec bga tray tray jedec BGA JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm 4 x 9=36 19.80 135° C MAX. 25.30 NEC 96.3 A' BGA30.5×25ESP 32.10 135.9 PPE A 30.80 34.15 273.2 315.0 322.6 20.90 SECTION A-A' 30.80 (5.87) (5.62) 7.62 30.50 Applied Package Quantity (pcs) 559-pin Plastic BGA (30.5×25) 36 MAX.


    Original     		BGA30 25ESP 559-pin SSD-A-H7739 tray bga tray datasheet bga NEC 2732 jedec bga tray tray jedec BGA JEDEC TRAY DIMENSIONS PDF

    nec 2565

    Abstract: 2565 nec JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7045-1 1521-PIN BGA40 BGA-404 4015 899-pin
    Text: TRAY CONTAINER UNIT : mm 3x7=21 NEC 40.15 135°C MAX 7 A' 25.65 42.30 84.6 BGA40×40A 135.9 PPE A 40.15 42.30 30.60 253.8 315.0 322.6 SECTION A – A' (3.91) (6.35) 7.62 40.15 Applied Package Quantity (pcs) 899-pin Plastic BGA (40×40) (FLIP CHIP TYPE)


    Original     		BGA40 899-pin 1521-pin SSD-A-H7045-1 nec 2565 2565 nec JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7045-1 BGA-404 4015 PDF

    nec 2565

    Abstract: NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga
    Text: TRAY CONTAINER 135°C MAX 19.65 NEC 102.6 A' 16.65 25.65 FBGA 19x19A A 19.65 22.00 286.0 14.50 315.0 322.6 SECTION A-A' (5.62) (5.80) 19.65 19.00 7.62 135.9 PPE 5×14=70 UNIT : mm Applied Package Quantity (pcs) 324-pin Plastic BGA (19×19) 70 MAX. Tray


    Original     		324-pin BGA19 SSD-A-H7599 nec 2565 NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga PDF

    JEDEC TRAY DIMENSIONS

    Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.


    Original     		FBGA17 256-pin SSD-A-H7511 JEDEC TRAY DIMENSIONS PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard PDF

    pbga package weight

    Abstract: mindspeed pbga Cold solder joint
    Text: 500154B December 18, 2001 Plastic BGA Surface Mount Application Note Introduction One of the greatest advantages of the Plastic Ball Grid Array PBGA package is that it is typically placed onto printed circuit boards and assembled using existing surface mount


    Original     		500154B 225-pin pbga package weight mindspeed pbga Cold solder joint PDF

    IPC-9701

    Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
    Text: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the


    Original     		MS-034 15mm-42 IPC-9701 Amkor mold compound coreless substrate amkor flip "IPC-9701" PDF

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 PDF

    tray datasheet bga

    Abstract: JEDEC TRAY DIMENSIONS BGA-35
    Text: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 76.0 38.00 BGA35×35B 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 SECTION A-A' (5.57) 7.62 (6.35) 35.35 35.00 Applied Package Quantity (pcs) 629-pin Plastic BGA (35×35) (FLIP CHIP TYPE) 24 MAX.


    Original     		BGA35 629-pin SSD-A-H7768 tray datasheet bga JEDEC TRAY DIMENSIONS BGA-35 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray container dimensions BGA package tray JEDEC tray standard dimensions 729-Pin tray bga TRAY CONTAINER JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm 4 x 9=36 135° C MAX. 31.60 29.23 31.10 252.8 315.0 322.6 Section A – A' 29.23 4.67 (6.35) 7.62 29.23 NEC 94.2 31.40 BGA29 × 29B A' 20.85 135.9 PPE A Applied Package 729-pin Plastic BGA (29×29) (Flip-chip type) Quantity (pcs)


    Original     		BGA29 729-pin BGA29 SSD-A-H7796 JEDEC TRAY DIMENSIONS tray container dimensions BGA package tray JEDEC tray standard dimensions tray bga TRAY CONTAINER JEDEC tray standard PDF

    676 BGA package tray

    Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)


    Original     		BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 676 BGA package tray BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray PDF