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    BGA PACKAGE TOP MARK Search Results

    BGA PACKAGE TOP MARK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE TOP MARK Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA PACKAGE TOP MARK Altera CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Original PDF

    BGA PACKAGE TOP MARK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ADV0012

    Abstract: ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark
    Text: CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Altera will begin marking a one-line internal traceability code on all BGA packages beginning January 2001. The Altera lot number, country of origin, and new internal marking code will be laser marked, or ink marked, on the top of all BGA packages for


    Original     		PDF ADV0012 ADV0012 ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark

    ADV0115

    Abstract: improves EP20K200E EP20K300E
    Text: CUSTOMER ADVISORY ADV0115 EP20K200E and EP20K300E 652-Ball BGA Package Improvement Change Description: The EP20K200E and EP20K300E 652-Ball BGA packages will be re-enforced with a stiffener added to the top of the package. Reason For Change: This change improves EP20K200E and EP20K300E 652-Ball BGA package coplanarity


    Original     		PDF ADV0115 EP20K200E EP20K300E 652-Ball ADV0115 improves

    ADV0201

    Abstract: ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark
    Text: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT Change Description: Altera will begin marking the assembly lot number and a one-line internal traceability code on all non-BGA packages beginning March 2002. Reason For Change: The assembly lot number and new internal traceability marking code will be laser or ink


    Original     		PDF ADV0201 ADV0201 ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark

    Untitled

    Abstract: No abstract text available
    Text: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C


    Original     		PDF TXB0104 15-kV SCES650C 500-V A114-B) A115-A)

    Untitled

    Abstract: No abstract text available
    Text: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C


    Original     		PDF TXB0104 15-kV SCES650C 500-V A114-B) A115-A)

    STV0299B

    Abstract: STB6000 STV0297 STV0360 STV0299 COFDM Tuner demodulator application note receiver QAM STI5105 LQFP216 STM5105
    Text: STM5105 Low-cost interactive set-top box decoder DATA BRIEF STM5105 is supplied in either 24 mm x 24 mm LQFP216 or 23 mm x 23 mm BGA package. DESCRIPTION STMicroelectronics sets a new standard for perfomance, price and integration in the single chip MPEG-2 set-top box decoder market with the


    Original     		PDF STM5105 STM5105 LQFP216 STM5105. STV0299B STB6000 STV0297 STV0360 STV0299 COFDM Tuner demodulator application note receiver QAM STI5105

    STV0299b

    Abstract: STI5105 STB6000 STV0297 stv0299 STV0360 tuner dvb - c malaysia stb jtag cofdm dvb chip encoder LQFP216
    Text: STM5105 Low-cost interactive set-top box decoder DATA BRIEF STM5105 is supplied in either 24 mm x 24 mm LQFP216 or 23 mm x 23 mm BGA package. DESCRIPTION STMicroelectronics sets a new standard for perfomance, price and integration in the single chip MPEG-2 set-top box decoder market with the


    Original     		PDF STM5105 STM5105 LQFP216 STM5105. STV0299b STI5105 STB6000 STV0297 stv0299 STV0360 tuner dvb - c malaysia stb jtag cofdm dvb chip encoder

    Untitled

    Abstract: No abstract text available
    Text: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C


    Original     		PDF TXB0104 15-kV SCES650C 500-V A114-B) A115-A)

    TXS0104EZXUR

    Abstract: TXS01xx
    Text: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3


    Original     		PDF TXS0104E SCES651C 000-V A114-B) A115-A) 15-kV TXS0104EZXUR TXS01xx

    TXS0104EPWR

    Abstract: YF04E TXS0104ED TXS0104EYZTR TXS0104EZXUR YF04
    Text: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3


    Original     		PDF TXS0104E SCES651C 000-V A114-B) A115-A) 15-kV TXS0104EPWR YF04E TXS0104ED TXS0104EYZTR TXS0104EZXUR YF04

    Untitled

    Abstract: No abstract text available
    Text: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3


    Original     		PDF TXS0104E SCES651C 000-V A114-B) A115-A) 15-kV

    Untitled

    Abstract: No abstract text available
    Text: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3


    Original     		PDF TXS0104E SCES651C 000-V A114-B) A115-A) 15-kV

    Untitled

    Abstract: No abstract text available
    Text: TXS0104E www.ti.com SCES651E – JUNE 2006 – REVISED AUGUST 2013 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS Check for Samples: TXS0104E FEATURES 1 • • GXU/ZXU BGA PACKAGE (TOP VIEW) A B C 4 3 2 1 TERMINAL ASSIGNMENTS


    Original     		PDF TXS0104E SCES651E 10-kV

    YF04E

    Abstract: No abstract text available
    Text: TXS0104E www.ti.com SCES651E – JUNE 2006 – REVISED AUGUST 2013 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS Check for Samples: TXS0104E FEATURES 1 • • GXU/ZXU BGA PACKAGE (TOP VIEW) A B C 4 3 2 1 TERMINAL ASSIGNMENTS


    Original     		PDF TXS0104E SCES651E 000-V A114-B) A115-A) 15-kV YF04E

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V100.11x11 A1 CORNER 100 BALL PLASTIC BALL GRID ARRAY PACKAGE A INCHES D A1 CORNER I.D. E B TOP VIEW 0.15 M C 0.006 0.08 0.003 M C A B A1 CORNER D1 10 9 8 7 6 5 4 3 2 1 S A1


    Original     		PDF 11x11

    4925 B

    Abstract: tray datasheet bga JEP95 4925 B transistor OB35
    Text: BGA Package 35-Lead 11.25mm x 6.25mm × 3.42mm (Reference LTC DWG# 05-08-1878 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW


    Original     		PDF 35-Lead 5M-1994 MS-028 JEP95 4925 B tray datasheet bga JEP95 4925 B transistor OB35

    tray datasheet bga

    Abstract: 4925 B JEP95
    Text: BGA Package 35-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1879 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW


    Original     		PDF 35-Lead 5M-1994 MS-028 JEP95 tray datasheet bga 4925 B JEP95

    JEP95

    Abstract: tray datasheet bga MS-028
    Text: BGA Package 45-Lead 11.25mm x 9.00mm × 4.92mm (Reference LTC DWG# 05-08-1869 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 7 PACKAGE TOP VIEW


    Original     		PDF 45-Lead 5M-1994 MS-028 JEP95 JEP95 tray datasheet bga

    4925 B

    Abstract: MS-028 BGA package tray 40 x 40 JEP95 tray datasheet bga JEP95 MS-028
    Text: BGA Package 40-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1867 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW


    Original     		PDF 40-Lead 5M-1994 MS-028 JEP95 4925 B BGA package tray 40 x 40 JEP95 tray datasheet bga JEP95 MS-028

    BGA 15X15

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o A A1 CORNER V196.15x15 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1


    Original     		PDF 15x15 BGA 15X15

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V256.17x17 A A1 CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1 CORNER I.D. INCHES SYMBOL E B TOP VIEW 0.15 MC A B 0.006 0.08 C 0.003 M b A1 CORNER D1 A1 CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1


    Original     		PDF 17x17

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o A A1 CORNER V196.12x12 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1


    Original     		PDF 12x12

    V160

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o A A1 CORNER V160.12x12A D 160 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1


    Original     		PDF 12x12A V160

    bga socket

    Abstract: A814
    Text: GHZ BGA Socket and SMT adaptor Page 1 of 2 Assembly Instructions 1. Apply water soluble or no clean flux on the target PCB lands. 2. Apply a small amount of TAC flux on opposite corners of the PCB lands. 3. Note the target board land pattern orientation and the adaptor's orientation mark. Place SMT adaptor solder ball side down onto


    Original     		PDF