BGA PACKAGE THERMAL RESISTANCE FREESCALE Search Results

BGA PACKAGE THERMAL RESISTANCE FREESCALE Result Highlights (5)

Part	Manufacturer	Description
PQU650M-F-COVER	Murata Manufacturing Co Ltd	PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH9R00CQ5	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N)
TPH1R306PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N)
TPHR8504PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N)

BGA PACKAGE THERMAL RESISTANCE FREESCALE Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
pcb warpage in ipc standard Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387 Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.	Original		PDF
BGA PACKAGE thermal resistance Abstract: cmos 4008 304X MPC604 604 semiconductor Nippon capacitors Text: Freescale Semiconductor, Inc. MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604 RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of	Original	MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance cmos 4008 304X MPC604 604 semiconductor Nippon capacitors	PDF
D 304X transistor Abstract: BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB Text: Freescale Semiconductor, Inc. MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 O IC EM R, O CT U ND C IN . S E L A PowerPC 604 RISC EMicroprocessor SC E Hardware Specifications FR BY D The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of	Original	MPR604HSU-02 MPC604EC/D 604TM D 304X transistor BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB	PDF
transistor mw 131 Abstract: ALPha r09 Nippon capacitors Text: Freescale Semiconductor, Inc. G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 Advance Information PowerPC 603e RISC Microprocessor Family: PID7v-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of	Original	G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v PID7v-603e) transistor mw 131 ALPha r09 Nippon capacitors	PDF
SAC405 Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station Text: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent	Original	countrieESD51 JESD5112, SAC405 IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station	PDF
Kester 182 Abstract: ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance Text: Freescale Semiconductor, Inc. G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 O IC EM R, O CT U ND C IN . S E L CA PowerPC 603e RISC Microprocessor Family: S E E PID7v-603e Hardware Specifications FR Y B D The PowerPC 603e microprocessor	Original	G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v Kester 182 ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance	PDF
mpc5668g Abstract: MPC5668X a3700 automotive power transistor PJ15 SPC5668GF1AMMG SPC5668GF1 PJ59 SPC5668 317 MG 707 SPC5668x Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category	Original	MPC5668X MPC5668x 32-bit e200z650) buffer16 e200z0) MPC5668G) mpc5668g a3700 automotive power transistor PJ15 SPC5668GF1AMMG SPC5668GF1 PJ59 SPC5668 317 MG 707 SPC5668x	PDF
MPC5668 Abstract: MPC5668x MPC5668G sram ecc nexus 5001 ph-15 diode pj12 diode BGA mpc5668x 5668G mha 36 Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 5, 01/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category	Original	MPC5668X MPC5668x 32-bit e200z650) buffer16 e200z0) MPC5668G) MPC5668 MPC5668G sram ecc nexus 5001 ph-15 diode pj12 diode BGA mpc5668x 5668G mha 36	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category	Original	MPC5668X MPC5668x 32-bit e200z650) buffer16 e200z0) MPC5668G)	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 4, 01/2011 MPC5668x MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category – 32 KB unified cache with line locking and eight-entry	Original	MPC5668X MPC5668x 32-bit e200z650) buffer16 e200z0) MPC5668G)	PDF
MPC7 Abstract: MMC2075 MMC2075VF001 MMC2080 MMC2080VF001 motorola flex pager 11 flex protocol EXTS D16N2 Text: Freescale Semiconductor, Inc. MMC2080/2075/D Rev. 0, 10/1999 Semiconductor Products Sector Freescale Semiconductor, Inc. MMC2080/2075 Advance Information MMC2080/2075 Integrated Processor with Roaming FLEX Decoder Part 1 Introduction The MMC2080/2075 is designed to provide the messaging and paging marketplace with a powerful and	Original	MMC2080/2075/D MMC2080/2075 MMC2080/2075 MMC2080 MMC2075 MMC2080. MPC7 MMC2075VF001 MMC2080VF001 motorola flex pager 11 flex protocol EXTS D16N2	PDF
X-RAY INSPECTION Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as	Original	AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance	PDF
SPC5668 Abstract: MPC5668G MPC5668X Nexus S automotive power transistor PJ15 e200z650 nexus 5001 PJ11 N13T1 MPC5668 Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5668X Rev. 3, 9/2009 MPC5668x MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category	Original	MPC5668X MPC5668x 32-bit e200z650) e200z0) MPC5668G) MPC5668E) SPC5668 MPC5668G Nexus S automotive power transistor PJ15 e200z650 nexus 5001 PJ11 N13T1 MPC5668	PDF
G38-87 Abstract: JESD51-2 MPC7441 MPC7445 MPC7447 MPC7447A MPC7447AEC MPC7450 na3x Text: Freescale Semiconductor Technical Data This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7447A is an implementation of the PowerPC microprocessor family of reduced instruction set computer	Original	MPC7447AEC MPC7447A MPC7447A; MPC7447. MPC7447A MPC7447A. MPC7450 CH370 G38-87 JESD51-2 MPC7441 MPC7445 MPC7447 MPC7447AEC na3x	PDF

SnPb36Ag2 Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100 Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation	Original	2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100	PDF
lga 1336 Abstract: 7447A MPC7447A solder profile hcte TT 2076 G38-87 JESD51-2 MPC7441 MPC7445 MPC7447 Text: Freescale Semiconductor MPC7447AEC Rev. 5, 01/2006 Technical Data MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The	Original	MPC7447AEC MPC7447A MPC7447A; MPC7447. MPC7447A MPC7447A. MPC7450 lga 1336 7447A MPC7447A solder profile hcte TT 2076 G38-87 JESD51-2 MPC7441 MPC7445 MPC7447	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor MPC7447AEC Rev. 4, 09/2005 Technical Data MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The	Original	MPC7447AEC MPC7447A MPC7447A; MPC7447. MPC7447A. MPC7450	PDF
MPC755 Abstract: marking code V6 33 surface mount diode G38-87 JESD51-2 MPC745 MPC750 MPC755EC A 1718 mpc740 transistor 755-X Text: Freescale Semiconductor Document Number: MPC755EC Rev. 8, 02/2006 Technical Data MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are	Original	MPC755EC MPC755 MPC755; MPC745. MPC755 MPC745 MPC755. MPC750 marking code V6 33 surface mount diode G38-87 JESD51-2 MPC755EC A 1718 mpc740 transistor 755-X	PDF
RX350 Abstract: ABB Group Hall Effect Current Sensors ABB MPC755 Hardware Specification hall sensor u18 MPC755 Aavid Thermalloy cold plate freescale JTAG header 14 marking code V6 33 surface mount diode G38-87 Text: Freescale Semiconductor MPC755EC Rev. 6.1, 01/2005 Technical Data MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are PowerPC	Original	MPC755EC MPC755 MPC755; MPC745. MPC755 MPC745 MPC755. MPC750 RX350 ABB Group Hall Effect Current Sensors ABB MPC755 Hardware Specification hall sensor u18 Aavid Thermalloy cold plate freescale JTAG header 14 marking code V6 33 surface mount diode G38-87	PDF
H8-H9-H11 Abstract: MPC755 G38-87 JESD51-2 MPC745 MPC750 MPC755EC Text: Freescale Semiconductor Document Number: MPC755EC Rev. 7.0, 04/2005 Technical Data MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are	Original	MPC755EC MPC755 MPC755; MPC745. MPC755 MPC745 MPC755. MPC750 H8-H9-H11 G38-87 JESD51-2 MPC755EC	PDF
LGA voiding Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style	Original	AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale	PDF
AN3281 Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style	Original	AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate	PDF
mpc7448 Abstract: C10G2 Text: Freescale Semiconductor MPC7448EC Rev. 0, 9/2005 Advance Information MPC7448 RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7448. The MPC7448 is an implementation of the PowerPC microprocessor family of reduced instruction set computer RISC	Original	MPC7448EC MPC7448 MPC7448. MPC7450 C10G2	PDF
RX350 Abstract: freescale JTAG header 14 motorola g18 G38-87 JESD51-2 MPC745 MPC750 MPC755 Text: Freescale Semiconductor, Inc. Advance Information MPC755EC/D Rev. 6, 9/2002 Freescale Semiconductor, Inc. MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are reduced	Original	MPC755EC/D MPC755 MPC755; MPC745. MPC755 MPC745 MPC755. MPC750 RX350 freescale JTAG header 14 motorola g18 G38-87 JESD51-2	PDF

BGA PACKAGE THERMAL RESISTANCE FREESCALE Search Results

BGA PACKAGE THERMAL RESISTANCE FREESCALE Result Highlights (5)

BGA PACKAGE THERMAL RESISTANCE FREESCALE Datasheets Context Search

pcb warpage in ipc standard

BGA PACKAGE thermal resistance

D 304X transistor

transistor mw 131

SAC405

Kester 182

mpc5668g

MPC5668

Untitled

Untitled

MPC7

X-RAY INSPECTION

SPC5668

G38-87

SnPb36Ag2

lga 1336

Untitled

MPC755

RX350

H8-H9-H11

LGA voiding

AN3281

mpc7448

RX350