BGA PACKAGE OUTLINE Search Results

Contextual Info: MAIN INDEX GO TO WEB The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA Thin BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP

82439TX

Abstract: 324-Pin f 324
Contextual Info: 82439TX System Controller MTXC 37.0 MTXC Package Information This specification outlines the mechanical dimensions for the MTXC. The package is a 324 pin ball grid array (BGA). Figure 98. MTXC 324-pin Ball Grid Array (BGA) TOP VIEW Pin #1 Corner SIDE VIEW

ADV9912

Abstract: MO-151 Assembly Locations
Contextual Info: CUSTOMER ADVISORY FineLine BGA Packages Altera is adding ASAT and ASE as additional sources of supply for the FineLine BGA packages currently assembled by ANAM in the Philippines and Korea. This change will affect the FineLine BGA package outline thickness*, which will result in a

4-Layer

Abstract: PIIX4 82371AB 324-PIN f 324 data sheet of Ball grid array
Contextual Info: 82371AB PCI ISA IDE Xcelerator PIIX4 19.0 PIIX4 Package Information This specification outlines the mechanical dimensions for PIIX4. The package is a 324-pin ball grid array (BGA). Figure 36. PIIX4 324-Pin Ball Grid Array (BGA) TOP VIEW Pin #1 Corner SIDE VIEW

Contextual Info: 2 Gigabit Stacked DDR2 SDRAM DD53E 256Mb x 8 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls

U48B

Abstract: DDR2 Mechanical Dimensions
Contextual Info: 2 Gigabit Stacked DDR2 SDRAM DD52E 512Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls

cqfp package outline

Abstract: ceramic
Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK

12x12 bga thermal resistance

Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Contextual Info: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

DALLAS CAP

Abstract: DS3802 DS3832C-311 nv sram
Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

reflow temperature rohs bga

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

TR6878

Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Contextual Info: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution

HMC265CB1

Contextual Info: HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 Features General Description RUGGED SMT BGA PACKAGE The HMC265CB1 is a 20 – 31 GHz surface mount sub - harmonically pumped x2 MMIC downconverter with integrated LO & IF amplifiers in a rugged Ball Grid Array (BGA) package.

Contextual Info: HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2000 Features General Description RUGGED SMT BGA PACKAGE The HMC265CB1 is a 20 – 31 GHz surface mount sub - harmonically pumped x2 MMIC downconverter with integrated LO & IF amplifiers in a rugged Ball Grid Array (BGA) package.

land pattern BGA 0.75

Abstract: BGA reflow guide BGA and CSP bo 137
Contextual Info: T W H E O R L D L E A D E R I N L O G I C P R O D U C T S Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder with liquidus

digital rf delay line 2 GHz

Contextual Info: MAMUSM0008 Digital Switched Delay Line, 1.8 - 2.4 GHz Features V 1.00 BGA Package n 750 pS Dynamic Range, 50 pS Step Size n BGA Package n Parallel Control Interface n Positive Control Logic n Cascadable n No off chip components required Description The M/A-COM MAMUSM0008 is a 0 to 750 pS variable

underfill

Abstract: rework reflow hot air BGA Loctite PCB design for very fine pitch csp package thick bga die size Loctite 3567 Intel BGA Solder FDZ202P Fairchild, BGA fbga Substrate design guidelines
Contextual Info: Application Note 7001 March 2004 Guidelines for Using Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling

digital rf delay line 2 GHz

Abstract: rf delay line MAMUSM0008 MAMUSM0008TR 72 vna 10 GHz rf delay line
Contextual Info: MAMUSM0008 Digital Switched Delay Line, 1.8 - 2.4 GHz Features V 1.00 BGA Package n 750 pS Dynamic Range, 50 pS Step Size n BGA Package n Parallel Control Interface n Positive Control Logic n Cascadable n No off chip components required Description The M/A-COM MAMUSM0008 is a 0 to 750 pS variable

374124B00035G

Abstract: T411
Contextual Info: TAPE Attachment Method Part Number: 374124B00035G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Plastic T411 Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package

T411

Abstract: 374424B00035G
Contextual Info: TAPE Attachment Method Part Number: 374424B00035G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Plastic T411 Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package

T405R

Contextual Info: TAPE Attachment Method Part Number: 375024B00032G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Metal T405R Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package

T405R

Contextual Info: TAPE Attachment Method Part Number: 374724B00032G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Metal T405R Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package

V54C3128

Abstract: LA5A6
Contextual Info: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3

MSAB

Contextual Info: MOSEL VITELIC V54C3128 16/80/40 4(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3