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    BGA PACKAGE Search Results

    BGA PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA PACKAGE Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA Package Xilinx Chip Scale BGA (CS144/CSG144) Package Original PDF
    BGA PACKAGE TOP MARK Altera CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Original PDF

    BGA PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    reflow soldering profile BGA

    Abstract: reflow temperature bga BGA PROFILING bga rework
    Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already


    Original     		PDF

    led matrix circuits

    Abstract: 256-pin Plastic BGA BGA-256P-M02
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)


    Original     		PDF BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02

    led matrix circuits

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01)


    Original     		PDF BGA-480P-M01 480-pin BGA-480P-M01) BGA480001SC-2-1 led matrix circuits

    led matrix circuits

    Abstract: fujitsu FUJITSU SEMICONDUCTOR
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M02 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M02 480-pin plastic BGA (BGA-480P-M02)


    Original     		PDF BGA-480P-M02 480-pin BGA-480P-M02) BGA480002SC-2-1 led matrix circuits fujitsu FUJITSU SEMICONDUCTOR

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)


    Original     		PDF BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)


    Original     		PDF BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P

    256-pin BGA

    Abstract: 24 pin MATRIX led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)


    Original     		PDF BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits

    256-pin BGA

    Abstract: led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)


    Original     		PDF BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M05 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M05 352-pin plastic BGA (BGA-352P-M05) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)


    Original     		PDF BGA-352P-M05 352-pin BGA-352P-M05) BGA352006SC-1-1

    BGA-420P-M03

    Abstract: BGA-420P
    Text: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)


    Original     		PDF BGA-420P-M03 420-pin BGA-420P-M03) BGA420003SC-2-1 BGA-420P-M03 BGA-420P

    BGA-416P

    Abstract: BGA-416P-M02 T0-50 416-PIN
    Text: BALL GRID ARRAY PACKAGE 416 PIN PLASTIC BGA-416P-M02 Lead pitch 50mil Pin matrix 30 Sealing method Resin seal 416-pin plastic BGA BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.20(1.575±.008)SQ 36.83±0.20(1.450±.008) INDEX C1.0 (.039) 1.27±0.20


    Original     		PDF BGA-416P-M02 50mil 416-pin BGA-416P-M02) BGA416002SC-1-1 BGA-416P BGA-416P-M02 T0-50

    BGA-256P-M02

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)


    Original     		PDF BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 BGA-256P-M02

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M04 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)


    Original     		PDF BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1

    416-PIN

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)


    Original     		PDF BGA-416P-M02 416-pin BGA-416P-M02) BGA416002SC-2-2

    led matrix circuits

    Abstract: BGA-272P-M01
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)


    Original     		PDF BGA-272P-M01 272-pin BGA-272P-M01) B272001SC-1-3 led matrix circuits BGA-272P-M01

    BGA-352

    Abstract: 352-PIN
    Text: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M02 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008)


    Original     		PDF BGA-352P-M02 50mil 352-pin BGA-352P-M02) BGA352003SC-1-1 BGA-352

    T0-50

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M01 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.20(1.378±.008)SQ 31.75±0.20(1.250±.008) INDEX C1.0 (.039) 1.27±0.20


    Original     		PDF BGA-352P-M01 50mil 352-pin BGA-352P-M01) BGA352002SC-1-1 T0-50

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)


    Original     		PDF BGA-352P-M01 352-pin BGA-352P-M01) BGA352002SC-2-2

    256-pin Plastic BGA

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ


    Original     		PDF BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 o256-pin 256-pin Plastic BGA

    BGA-576

    Abstract: BGA576 576-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)


    Original     		PDF BGA-576P-M01 576-pin BGA-576P-M01) BGA576001SC-2-1 BGA-576 BGA576

    BGA-352P-M03

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M03 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ


    Original     		PDF BGA-352P-M03 352-pin BGA-352P-M03) BGA352004SC-1-1 BGA-352P-M03

    BGA-420P

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02) 35.00±0.20(1.38±.008)SQ 32.50±0.10(1.28±.004)SQ


    Original     		PDF BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 BGA-420P

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ


    Original     		PDF BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1