Untitled
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.
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BGA-48P-M06
48-pin
BGA-48P-M06)
MCM-M001-2-3
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PDF
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9803
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M10 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M10 48-pin plastic BGA (BGA-48P-M10) Note: The actual shape of coners may differ from the dimension.
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BGA-48P-M10
48-pin
BGA-48P-M10)
MCM-M002-3-2
9803
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PDF
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led matrix circuits
Abstract: bga48 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.
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BGA-48P-M06
48-pin
BGA-48P-M06)
BGA48006SC-1-2
ar8P-M06)
led matrix circuits
bga48
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PDF
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BGA-48P-M01
Abstract: 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M01 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M01 48-pin plastic FBGA (BGA-48P-M01)
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BGA-48P-M01
48-pin
BGA-48P-M01)
B48001S-1C-2
BGA-48P-M01
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PDF
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fujitsu
Abstract: 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M03 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M03 48-pin plastic FBGA (BGA-48P-M03)
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BGA-48P-M03
48-pin
BGA-48P-M03)
B48003S-1C-2
fujitsu
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PDF
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fujitsu
Abstract: 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M02 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M02 48-pin plastic FBGA (BGA-48P-M02)
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BGA-48P-M02
48-pin
BGA-48P-M02)
B48002S-1C-2
fujitsu
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PDF
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T405R
Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink
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WTS001
p1-25
220486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
T405R
Bergquist BP-108
T410R
Chomerics* T405
658-35AB
T405
T410
T411
T412
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PDF
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MSM8200
Abstract: No abstract text available
Text: Issue 1.0 March 2002 Description The MSM82000CB is a 2M x 8 SRAM device available in Chip Size BGA Ball Grid Array package, with access times of 15 and 20ns. The device is available to commercial and industrial temperature grades. The Chip Size BGA provides an ultra high density
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MSM82000CB
MSM8200
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PDF
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bga 6x8 Package
Abstract: DIP40 package 28F008 DIP40 DIP30 a5 gnd 700
Text: M4229 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: 404001BG6YAM AS-40-40-01BG-6YAM-8/16 REPLACEMENT SOCKET: S-BGA-6X8-048-A Call Emulation Technology for a replacement socket price and delivery quote. CONNECTION TABLE:
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M4229
404001BG6YAM
AS-40-40-01BG-6YAM-8/16
S-BGA-6X8-048-A
F4229)
G28F008S3
G28F008S5
G28F008SC
G28F016S3
G28F016S5
bga 6x8 Package
DIP40 package
28F008
DIP40
DIP30
a5 gnd 700
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PDF
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intel C4 package
Abstract: F4334 DIP40 a5 gnd 700
Text: M4334 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: 484001BG6YAMNS AS-48-40-01BG-6YAM-8/16 REPLACEMENT SOCKET: S-BGA-6X8-48-A Call Emulation Technology for a replacement socket price and delivery quote. CONNECTION TABLE:
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M4334
484001BG6YAMNS
AS-48-40-01BG-6YAM-8/16
S-BGA-6X8-48-A
F4334)
48-Ball
DIP40
048-TS01
GT28F008B3
GT28F0016B3
intel C4 package
F4334
DIP40
a5 gnd 700
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PDF
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intel 28f160
Abstract: bga 6x8 Package 48440 bga 6x8 28F160
Text: M4226 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: REPLACEMENT SOCKET: 484401BG6YAM8/16 AS-48-44-01BG-6YAM-8/16 S-BGA-6X8-048-A CONNECTION TABLE: Call Emulation Technology for a replacement socket price and delivery quote.
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M4226
484401BG6YAM8/16
AS-48-44-01BG-6YAM-8/16
S-BGA-6X8-048-A
F4226)
44-Pin
intel 28f160
bga 6x8 Package
48440
bga 6x8
28F160
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PDF
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IC63LV1024-8BI
Abstract: No abstract text available
Text: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error September 12,2001
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IC63LV1024
36-pin
32-pin
AHSR025-0C
IC63LV1024-15B
IC63LV1024-15H
IC63LV1024-15T
IC63LV1024-15J
IC63LV1024-15K
IC63LV1024-8BI
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PDF
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IC63LV1024
Abstract: IC63LV1024-10B IC63LV1024-8B IC63LV1024-8J IC63LV1024-8K IC63LV1024-8T IS63LV1024
Text: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error Obsolete "H" type
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IC63LV1024
36-pin
32-pin
AHSR025-0D
R024-12KI
400mil
300mil
IC63LV1024-15B
IC63LV1024
IC63LV1024-10B
IC63LV1024-8B
IC63LV1024-8J
IC63LV1024-8K
IC63LV1024-8T
IS63LV1024
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PDF
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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PDF
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g10 fr4 7mm
Abstract: FR4 substrate 1.6mm FR4 1.6mm substrate pitch 0.75mm BGA SF-BGA48G-B-03 bga 6x8 0.3mm pitch BGA
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 7mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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FR4/G10
SF-BGA48G-B-03
SF-BGA048G-B-03
g10 fr4 7mm
FR4 substrate 1.6mm
FR4 1.6mm substrate
pitch 0.75mm BGA
bga 6x8
0.3mm pitch BGA
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PDF
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FR4 1.6mm substrate
Abstract: SF-BGA46D-B-03 FR4 substrate 1.6mm pitch 0.75mm BGA
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 6.5mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 7.91mm 0.75mm pitch typ. Top View 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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FR4/G10
SF-BGA46D-B-03
SF-BGA046D-B-03
FR4 1.6mm substrate
FR4 substrate 1.6mm
pitch 0.75mm BGA
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PDF
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0.35mm BGA
Abstract: FR4 1.6mm substrate 0.35mm pitch BGA SF-BGA48C-B-03 FR4 substrate 1.6mm BGA 0.35mm pitch bga 6x8
Text: Compatible BGA Footprint 16mm [0.630"] 13.5mm [0.531"] 13.2mm [0.520"] 7.29mm [0.287"] 11mm [0.433"] 10.72mm [0.422"] 10.85mm [0.427"] 0.75mm 0.35mm [0.014"] 7.4mm [0.291"] Top View 9.8mm [0.386"] D 0.8 mm x4 0.38mm [0.015"] 9.75mm [0.384"] End View 0.75mm pitch typ.
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FR4/G10
SF-BGA48C-B-03
SF-BGA048C-B-03
0.35mm BGA
FR4 1.6mm substrate
0.35mm pitch BGA
FR4 substrate 1.6mm
BGA 0.35mm pitch
bga 6x8
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PDF
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FR4 substrate 1.6mm
Abstract: FR4 1.6mm substrate SF-BGA46B-B-03 bga 6x8 0.3mm pitch BGA pitch 0.75mm BGA
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7.286mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 6.964mm Top View 0.75mm pitch typ. 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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286mm
964mm
FR4/G10
SF-BGA46B-B-03
FR4 substrate 1.6mm
FR4 1.6mm substrate
bga 6x8
0.3mm pitch BGA
pitch 0.75mm BGA
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PDF
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FR4 substrate 1.6mm
Abstract: FR4 1.6mm substrate bga 6x8 SF-BGA48H-B-03 pitch 0.75mm BGA g10 fr4 7mm
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 8.5mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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FR4/G10
SF-BGA48H-B-03
SF-BGA048H-B-03
FR4 substrate 1.6mm
FR4 1.6mm substrate
bga 6x8
pitch 0.75mm BGA
g10 fr4 7mm
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PDF
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CS16LV20493
Abstract: No abstract text available
Text: High Speed Super Low Power SRAM 128K-Word By 16 Bit CS16LV20493 Revision History Rev. No. History Issue Date 1.0 Initial issue Jan.17, 2005 1.1 Add 48 CSP-6x8mm Sep. 16, 2005 1.2 Revise DC characteristics Apr. 11, 2008 1.3 Remove 48 Mini BGA 6*8 mm package type
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128K-Word
CS16LV20493
CS16LV20493
16bits
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PDF
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FR4 1.6mm substrate
Abstract: SF-BGA46C-B-03 FR4 substrate 1.6mm pitch 0.75mm BGA
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7.58mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 9.81mm Top View 0.75mm pitch typ. 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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Original
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FR4/G10
SF-BGA46C-B-03
SF-BGA046C-B-03
FR4 1.6mm substrate
FR4 substrate 1.6mm
pitch 0.75mm BGA
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PDF
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FR4 1.6mm substrate
Abstract: SF-BGA47A-B-03 bga 6x8 FR4 substrate 1.6mm pitch 0.75mm BGA G10 FR4
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7.286mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 10.85mm Top View 0.75mm pitch typ. 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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Original
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286mm
FR4/G10
SF-BGA47A-B-03
SF-BGA047A-B-03
FR4 1.6mm substrate
bga 6x8
FR4 substrate 1.6mm
pitch 0.75mm BGA
G10 FR4
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PDF
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SG-BGA-6076
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer
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225mm
5M-1994.
SG-BGA-6076
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PDF
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Untitled
Abstract: No abstract text available
Text: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FEATURES 324 Pin BGA North Bridge Chip Supports the Pentium C om patible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and
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OCR Scan
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SLC90E42
SLC90E42
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PDF
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